Abstract:
A method of performing a ranging process between a base station and a mobile station in sleep mode in a wireless access system, wherein the base station provides the mobile station with an initial notification of a periodic ranging time that occurs during a sleep time interval and during which the mobile station is to perform the ranging process, the initial notification included in a first message, the first message indicating whether the mobile station should terminate sleep mode to receive downlink data, and wherein the base station provides the mobile station with subsequent notifications of periodic ranging times that occur during the sleep time interval, the subsequent notifications indicated in a second message, the second message transmitted to the mobile station as part of the ranging process such that the mobile station performs a plurality of ranging processes within the sleep time interval.
Abstract:
A method of performing a ranging process between a base station and a mobile station in sleep mode in a wireless access system, wherein the base station provides the mobile station with an initial notification of a periodic ranging time that occurs during a sleep time interval and during which the mobile station is to perform the ranging process, the initial notification included in a first message, the first message indicating whether the mobile station should terminate sleep mode to receive downlink data, and wherein the base station provides the mobile station with subsequent notifications of periodic ranging times that occur during the sleep time interval, the subsequent notifications indicated in a second message, the second message transmitted to the mobile station as part of the ranging process such that the mobile station performs a plurality of ranging processes within the sleep time interval.
Abstract:
A semiconductor device includes a semiconductor substrate having an active area including first and second impurity regions of a transistor, a gate formed over the active area of the semiconductor substrate and isolated from the semiconductor substrate, a first insulating interlayer formed on the semiconductor substrate and having first and second contact holes exposing the first and the second impurity regions, respectively, a capacitor having a storage electrode and a plate electrode, the storage electrode being connected electrically to the first impurity region through the first contact hole, a bit line contact pad connected electrically to the second impurity region through the second contact hole, a second insulating interlayer formed on the plate electrode and having a third contact hole exposing the bit line contact pad, and a bit line formed on the second insulating interlayer and in contact with the bit line contact pad through the third contact hole.
Abstract:
A method of fabricating a semiconductor device having a memory device region and a logic device region on a substrate includes the steps of forming first and second gate lines on the substrate at the memory device region and the logic device region, respectively, forming a sidewall insulating layer on both sides of each of the first and second gate lines, forming a plurality of impurity regions in the substrate, forming a silicon nitride layer on the memory device including the first gate lines, forming a silicide layer on the second gate line and impurity regions at the logic device region, and forming an oxide layer on an exposed surface excluding portions over each one of the impurity regions at the memory region and the logic device region, respectively.
Abstract:
The present invention relates to a device isolation structure and a device solation method in a semiconductor power IC. The device isolation structure according to the present invention includes: a semiconductor substrate including a high voltage region and a low voltage region; a trench overlapping the high voltage device region of the semiconductor substrate and an interfacing region formed between the high voltage device region and the low voltage device region; a fourth insulating film, a fifth insulating film, and a conductive film sequentially layered in the trench; a first insulating film pattern formed on the semiconductor substrate including the trench; and field insulating films respectively formed on the trench and on a portion of an upper surface of the semiconductor substrate which is exposed out of the first insulating film pattern. The present invention has several advantages concerning manufacturing costs and reliability, some of which being achieved by forming a thermal oxide film in an empty space of the conductive film by which oxygen is permeated thereinto and thus restraining breakdown from being generated between high voltage devices at a high voltage.
Abstract:
An improved twin well formation method for a semiconductor device capable of improving the latch-up characteristic in DRAM device which requires a high integration density and of improving a recess problem which occurs due to the capacitor, which includes the steps of a first step which forms an insulation film on a semiconductor substrate having a first region and a second region; a second step which forms a first temporary film on an insulation film of the first region; a third step which forms a first side wall spacer at the first temporary side wall; a fourth step which implants a first conductive ion to a substrate of a second region; a fifth step which forms a second temporary film on a substrate of the second region; a sixth step which removes the first temporary film; a seventh step which implants a second conductive ion to a substrate of the first region; and an eighth step which anneals and removes the second temporary film and the first insulation spacer.
Abstract:
A method of associating a mobile station to a base station in a wireless communication system comprises transmitting to a serving base station a scanning request message comprising an association indicator. The method also comprises receiving from the serving base station a scanning response message comprising a rendezvous time associated with a neighboring base station for initiating ranging with the neighboring base station, wherein the serving base station communicates an association notification to the neighboring base station, the association notification comprising the rendezvous time. The method also comprises associating with the neighboring base station by transmitting a ranging request after passing of the rendezvous time determined from a transmission time of the scanning response message from the neighboring base station, wherein the rendezvous time is associated with a time the neighboring base station is expected to provide a non-contention based ranging opportunity for the mobile station.
Abstract:
A method of performing a ranging process between a base station and a mobile station in sleep mode in a wireless access system, wherein the base station provides the mobile station with an initial notification of a periodic ranging time that occurs during a sleep time interval and during which the mobile station is to perform the ranging process, the initial notification included in a first message, the first message indicating whether the mobile station should terminate sleep mode to receive downlink data, and wherein the base station provides the mobile station with subsequent notifications of periodic ranging times that occur during the sleep time interval, the subsequent notifications indicated in a second message, the second message transmitted to the mobile station as part of the ranging process such that the mobile station performs a plurality of ranging processes within the sleep time interval.
Abstract:
A method of associating a mobile station to a base station in a wireless communication system comprises transmitting to a serving base station a scanning request message comprising an association indicator. The method also comprises receiving from the serving base station a scanning response message comprising a rendezvous time associated with a neighboring base station for initiating ranging with the neighboring base station, wherein the serving base station communicates an association notification to the neighboring base station, the association notification comprising the rendezvous time. The method also comprises associating with the neighboring base neighboring base station by transmitting a ranging request after passing of the rendezvous time determined from a transmission time of the scanning response message from the neighboring base station, wherein the rendezvous time is associated with a time the neighboring base station is expected to provide a non-contention based ranging opportunity for the mobile station.
Abstract:
A method of fabricating a semiconductor device includes the steps of: forming a well of first conductivity type and well of second conductivity type in a substrate; forming a field oxide layer and gate oxide layer on the substrate; forming first and second polysilicon layers on the field oxide layer and gate oxide layer, the first polysilicon layer being doped with impurities of second conductivity type, the second polysilicon layer being doped with impurities of first conductivity, the first and second polysilicon layers coming into contact with each other; patterning the first and second polysilicon layers to be isolated from each other, to thereby forming first and second gates; and forming a conductive layer between the first and second gates. Accordingly, isolation of N-type and P-type polysilicon layers from each other, and patterning of them for the purpose of forming a gate are carried out using one mask, effectively simplifying the etching process during a gate patterning process. Also, by providing a conductive layer between the first and second gates, which electrically connects those gates, mutual diffusion of the impurities doping the polysilicon layers is prevented.