公开(公告)号：US20120049213A1

公开(公告)日：2012-03-01

申请号：US13148544

申请日：2009-10-13

申请人： Chao-Hsing Chen ,  Schang-Jing Hon ,  Alexander Chang Wang ,  Li-Tian Liang ,  Chin-Yung Fan ,  Chien-Kai Chung ,  Min-Hsun Hsieh

发明人： Chao-Hsing Chen ,  Schang-Jing Hon ,  Alexander Chang Wang ,  Li-Tian Liang ,  Chin-Yung Fan ,  Chien-Kai Chung ,  Min-Hsun Hsieh

IPC分类号： H01L27/15

CPC分类号： H01L27/15 ,  H01L25/0753 ,  H01L27/153 ,  H01L27/156 ,  H01L27/3211 ,  H01L33/50 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/8592 ,  H01L2924/12032 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-emitting device is provided that is capable of being directly connected to an alternative current source, including at least one electronic element; at least one light-emitting diode array chip; at least one bonding pad, a conductive trace, and a submount for supporting the electronic element, the light-emitting diode array chip, the bonding pad, and the conductive trace. The conductive trace is electrically connected to the electronic element, the light-emitting diode array chip, and bonding pad.

摘要翻译： 提供了能够直接连接到包括至少一个电子元件的替代电流源的发光器件; 至少一个发光二极管阵列芯片; 至少一个接合焊盘，导电迹线和用于支撑电子元件的基座，发光二极管阵列芯片，接合焊盘和导电迹线。 导电迹线电连接到电子元件，发光二极管阵列芯片和接合焊盘。

公开(公告)号：US09142534B2

公开(公告)日：2015-09-22

申请号：US13148544

申请日：2009-10-13

申请人： Chao-Hsing Chen ,  Schang-Jing Hon ,  Alexander Chan Wang ,  Li-Tian Liang ,  Chin-Yung Fan ,  Chien-Kai Chung ,  Min-Hsun Hsieh

发明人： Chao-Hsing Chen ,  Schang-Jing Hon ,  Alexander Chan Wang ,  Li-Tian Liang ,  Chin-Yung Fan ,  Chien-Kai Chung ,  Min-Hsun Hsieh

IPC分类号： H01L27/15 ,  H01L27/02 ,  H01L25/065 ,  H01L25/075 ,  H01L27/32 ,  H01L33/62

CPC分类号： H01L27/15 ,  H01L25/0753 ,  H01L27/153 ,  H01L27/156 ,  H01L27/3211 ,  H01L33/50 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/8592 ,  H01L2924/12032 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-emitting device is provided that is capable of being directly connected to an alternative current source, including at least one electronic element; at least one light-emitting diode array chip; at least one bonding pad, a conductive trace, and a submount for supporting the electronic element, the light-emitting diode array chip, the bonding pad, and the conductive trace. The conductive trace is electrically connected to the electronic element, the light-emitting diode array chip, and bonding pad.

摘要翻译： 提供了能够直接连接到包括至少一个电子元件的替代电流源的发光器件; 至少一个发光二极管阵列芯片; 至少一个接合焊盘，导电迹线和用于支撑电子元件的基座，发光二极管阵列芯片，接合焊盘和导电迹线。 导电迹线电连接到电子元件，发光二极管阵列芯片和接合焊盘。