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    Semiconductor electromechanical contact
    7.
    发明授权
    Semiconductor electromechanical contact 有权
    半导体机电接触

    公开(公告)号：US07695286B2

    公开(公告)日：2010-04-13

    申请号：US12204741

    申请日：2008-09-04

    申请人： Mark Swart ,  John Ellis

    发明人： Mark Swart ,  John Ellis

    IPC分类号： H01R12/00

    CPC分类号： H01R13/2407 ,  H01R12/714 ,  H01R13/2428 ,  H01R13/2435 ,  H01R2107/00

    摘要： A compliant electrical contact assembly for interconnecting a lead or terminal of an integrated circuit having two cantilever beams positioned within a slot in a housing arranged such that a portion of the beams slide along a portion of one another and within the housing as the beams are deformed elastically in order to allow more travel and compliance without yielding or totally deforming the beam. The sliding action during deformation effectively multiplies the total compliance in the assembly above and beyond the compliance otherwise available to elastic compression of the cantilever beams.

    摘要翻译： 用于互连集成电路的引线或端子的顺应性电接触组件，该集成电路的引线或端子具有位于壳体内的槽内的两个悬臂梁，其布置成使得当梁变形时，梁的一部分沿着彼此的一部分滑动并且在壳体内滑动 弹性地为了允许更多的行进和顺应性而不产生屈曲或使梁完全变形。 变形期间的滑动动作有效地将上述组件中的总顺从性超越了悬臂梁的弹性压缩可用的顺从性。

    SEMICONDUCTOR ELECTROMECHANICAL CONTACT
    8.
    发明申请
    SEMICONDUCTOR ELECTROMECHANICAL CONTACT 有权
    半导体机电接触

    公开(公告)号：US20090075497A1

    公开(公告)日：2009-03-19

    申请号：US12204741

    申请日：2008-09-04

    申请人： Mark Swart ,  John Ellis

    发明人： Mark Swart ,  John Ellis

    IPC分类号： H01R12/00

    CPC分类号： H01R13/2407 ,  H01R12/714 ,  H01R13/2428 ,  H01R13/2435 ,  H01R2107/00

    摘要： A compliant electrical contact assembly for interconnecting a lead or terminal of an integrated circuit having two cantilever beams positioned within a slot in a housing arranged such that a portion of the beams slide along a portion of one another and within the housing as the beams are deformed elastically in order to allow more travel and compliance without yielding or totally deforming the beam. The sliding action during deformation effectively multiplies the total compliance in the assembly above and beyond the compliance otherwise available to elastic compression of the cantilever beams.

    摘要翻译： 用于互连集成电路的引线或端子的顺应性电接触组件，该集成电路的引线或端子具有位于壳体内的槽内的两个悬臂梁，其布置成使得当梁变形时，梁的一部分沿着彼此的一部分滑动并且在壳体内滑动 弹性地为了允许更多的行进和顺应性而不产生屈曲或使梁完全变形。 变形期间的滑动动作有效地将上述组件中的总顺从性超越了悬臂梁的弹性压缩可用的顺从性。

    Apparatus for scan testing printed circuit boards
    9.
    发明申请
    Apparatus for scan testing printed circuit boards 失效
    用于扫描测试印刷电路板的装置

    公开(公告)号：US20050001640A1

    公开(公告)日：2005-01-06

    申请号：US10897182

    申请日：2004-07-22

    申请人： Mark Swart

    发明人： Mark Swart

    IPC分类号： G01R31/02 ,  G01R31/28 ,  H05K3/00

    CPC分类号： G01R31/2805 ,  G01R31/2808

    摘要： A scan test apparatus having at least an upper layer of conductive and compliant material and may include a lower layer of conductive and compliant material sized to cover the upper and lower surfaces of the printed circuit board to be tested. Electrical current is introduced into the conductive layers which shorts out the circuits on the printed circuit board. An electrical contactor is positioned on either side of the conductive layers on both sides of the printed circuit board. The printed circuit board is passed through the upper and lower conductive layers and the contactors by rollers positioned on each end of the scan test machine. The contactor sends a test signal from the circuit board to measurement electronics. Other embodiments include the shorting matrix to be movable and the printed circuit board being fixed and include non-contact sensors or arrays of electrical contactors.

    摘要翻译： 一种扫描测试装置，其至少具有导电和顺应性材料的上层，并且可以包括尺寸适于覆盖待测试的印刷电路板的上表面和下表面的导电和柔性材料的下层。 引入导电层中的电流使印刷电路板上的电路短路。 电接触器位于印刷电路板两侧的导电层的两侧。 印刷电路板通过定位在扫描测试机每端的辊通过上下导电层和接触器。 接触器将测试信号从电路板发送到测量电子设备。 其他实施例包括可移动的短路矩阵和印刷电路板是固定的，并且包括非接触式传感器或电接触器阵列。