摘要:
A method and apparatus for processing a magnetic transducer which uses gallium ion beam milling to precisely define pole tip widths of the magnetic transducer. The gallium ion beam may be defocused to improve definition of the region which is damaged by gallium ion implantation. The precision pole tip widths provide a transducer that may record correspondingly precise track widths on a magnetic storage medium, such as a rotating disk. Subsequent to the ion milling process, the invention restores the magnetically conductive properties of the pole tip region, which may be degraded as a result of the ion milling process, by means of a lapping process.
摘要:
Provided are electronic device packages and their methods of formation. The electronic device packages include an electronic device mounted on a substrate, a conductive via and a locally thinned region in the substrate. The invention finds application, for example, in the electronics industry for hermetic packages containing an electronic device such as an IC, optoelectronic or MEMS device.
摘要:
Provided are electronic device packages and their methods of formation. The electronic device packages include a sealed volume enclosing an electronic device and a feedthrough into the sealed volume for electrical connection of the electronic device. Provided are optoelectronic device packages and their methods of formation. The optoelectronic device packages include a first substrate and lid attached to the first substrate forming an enclosed volume. An optoelectronic device is disposed within the enclosed volume and a wick stop for preventing solder flow is provided. Provided are prism-coupled optical assemblies which allow for the coupling of light between an optical component, such as a laser, and an integrated optical waveguide through a prism.
摘要:
An optical probe for emitting and/or receiving light within a body comprises an optical fiber that transmits and/or receives an optical signal, a silicon optical bench including a fiber groove running longitudinally that holds an optical fiber termination of the optical fiber and a reflecting surface that optically couples an endface of the optical fiber termination to a lateral side of the optical bench. The fiber groove is fabricated using silicon anisotropic etching techniques. Some examples use a housing around the optical bench that is fabricated using LIGA or other electroforming technology. A method for forming lens structure is also described that comprises forming a refractive lens in a first layer of a composite wafer material, such as SOI (silicon on insulator) wafers and forming an optical port through a backside of the composite wafer material along an optical axis of the refractive lens. the refractive lens is preferably formed using grey-scale lithography and dry etching the first layer.
摘要:
Provided are electronic device packages and their methods of formation. The electronic device packages include an electronic device mounted on a substrate, a conductive via and a locally thinned region in the substrate. The invention finds application, for example, in the electronics industry for hermetic packages containing an electronic device such as an IC, optoelectronic or MEMS device.
摘要:
An optical membrane device comprises a substrate, at least one support block on a surface of the substrate, and at least one plate. A torsion beam supports the plate above the substrate on the support block. The optical membrane device also includes an optical membrane structure supported by the plate above the substrate and at least one electrode on the substrate underneath the plate. In one implementation, the optical membrane device further comprises a tether for coupling the optical membrane structure to the plate. The tether extends between the optical membrane structure and the plate. In another implementation, the substrate of the optical membrane device has an optical port through the substrate directly below the optical membrane structure. The plate is substantially balanced around the torsion beam to minimize a sensitivity to orientation in a gravitational field.
摘要:
Provided are electronic device packages and their methods of formation. The electronic device packages include an electronic device mounted on a substrate, a conductive via and a locally thinned region in the substrate. The invention finds application, for example, in the electronics industry for hermetic packages containing an electronic device such as an IC, optoelectronic or MEMS device.
摘要:
A Fabry-Perot tunable filter comprises a membrane device. The membrane device includes a support structure having an optical port. Also, the membrane device has an optical membrane structure separated from the support structure over the optical port. The optical membrane structure includes a center body portion and an outer body portion. Tethers extend radially from the center body portion to the outer body portion of the optical membrane structure. The center body portion has an area that is about equal or smaller than the area of the optical port.
摘要:
A Fabry-Perot tunable filter comprises a membrane device. The membrane device includes a support structure having an optical port. Also, the membrane device has an optical membrane structure separated from the support structure over the optical port. The optical membrane structure includes a center body portion and an outer body potion. Tethers extend radially from the center body portion to the outer body portion of the optical membrane structure. The center body portion has an area that is about equal or smaller than the area of the optical port.
摘要:
An optical probe for emitting and/or receiving light within a body comprises an optical fiber that transmits and/or receives an optical signal, a silicon optical bench including a fiber groove running longitudinally that holds an optical fiber termination of the optical fiber and a reflecting surface that optically couples an endface of the optical fiber termination to a lateral side of the optical bench. The fiber groove is fabricated using silicon anisotropic etching techniques. Some examples use a housing around the optical bench that is fabricated using LIGA or other electroforming technology. A method for forming lens structure is also described that comprises forming a refractive lens in a first layer of a composite wafer material, such as SOI (silicon on insulator) wafers and forming an optical port through a backside of the composite wafer material along an optical axis of the refractive lens. the refractive lens is preferably formed using grey-scale lithography and dry etching the first layer.