Method and apparatus for automatically changing a polishing pad in a chemical mechanical polishing system
    6.
    发明授权
    Method and apparatus for automatically changing a polishing pad in a chemical mechanical polishing system 失效
    用于在化学机械抛光系统中自动改变抛光垫的方法和装置

    公开(公告)号:US06379221B1

    公开(公告)日:2002-04-30

    申请号:US08777906

    申请日:1996-12-31

    IPC分类号: B24B100

    摘要: A method and an apparatus for automatically replacing a used polishing pad in a chemical mechanical polishing system are described. A controller places a mechanical device against the used polishing pad while the pad is on the polishing platen and activates a pad chucking mechanism that affixes the used pad to the mechanical device. The controller then moves the mechanical device and the pad toward a used pad receptacle, where the pad chucking mechanism is deactivated to release the used pad into the receptacle. The controller then places the mechanical device against a clean polishing pad in a clean pad dispenser and reactivates the pad chucking mechanism to affix the clean pad to the mechanical device. The mechanical device and the clean pad are moved toward the platen, where the pad chucking mechanism is deactivated to release the clean polishing pad onto the platen.

    摘要翻译: 描述了一种在化学机械抛光系统中自动更换用过的抛光垫的方法和装置。 控制器将机械装置放置在使用过的抛光垫上,同时衬垫位于研磨台板上并激活将所用垫固定在机械装置上的衬垫夹持机构。 然后,控制器将机械装置和垫朝向使用的垫容器移动,其中垫夹持机构被去激活以将使用的垫释放到容器中。 然后,控制器将机械装置放置在干净的衬垫分配器中的干净的抛光垫上,并重新激活衬垫夹紧机构以将清洁垫固定到机械装置。 机械装置和清洁垫移动到压板,其中垫夹持机构被去激活以将清洁的抛光垫释放到压板上。