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12 条记录 (耗时 0.02 秒)

    Sputter target monitoring system
    2.
    发明申请
    Sputter target monitoring system 审中-公开
    溅射目标监测系统

    公开(公告)号：US20050236266A1

    公开(公告)日：2005-10-27

    申请号：US10518293

    申请日：2003-06-10

    申请人： John Poole ,  Charles Wickersham

    发明人： John Poole ,  Charles Wickersham

    IPC分类号： C23C14/32 ,  C23C14/34 ,  C23C14/54 ,  H01J37/34

    CPC分类号： H01J37/32935 ,  C23C14/34 ,  C23C14/54 ,  H01J37/34 ,  H01J37/3444 ,  H01J37/3482

    摘要： A sputtering target monitoring system (20) for monitoring the status of a sputtering source target (22) during the sputtering process. The collection of data is initiated based on measured voltages in the sputtering source target (22), whereas the arcing count is determined based on current spikes or interruptions to the current in the sputtering source target (22) during the sputtering process. The real time data collected during the sputtering process is recorded and displayed in table or graphical format at any time during the sputtering process. Thus, problems in the sputtering process, or in the sputtering source (22), including an approaching end of life of the target may be easily ascertained. Alarms, messages or other indicators may be used to alert operators to problems or conditions during the sputtering process.

    摘要翻译： 一种用于在溅射过程中监测溅射源靶（22）的状态的溅射靶监测系统（20）。 基于溅射源目标（22）中的测量电压来启动数据的收集，而基于溅射过程期间溅射源目标（22）中的电流的电流尖峰或中断来确定电弧计数。 在溅射过程中随时记录和显示溅射过程中收集的实时数据，并以表格或图形格式显示。 因此，可以容易地确定溅射工艺或溅射源（22）中包括目标寿命终止的问题。 报警，消息或其他指示器可用于提醒操作员在溅射过程中的问题或条件。

    Method and apparatus for surface roughness measurement
    3.
    发明申请
    Method and apparatus for surface roughness measurement 审中-公开
    表面粗糙度测量方法和设备

    公开(公告)号：US20060268284A1

    公开(公告)日：2006-11-30

    申请号：US11365758

    申请日：2006-03-01

    申请人： Zhiguo Zhang ,  Charles Wickersham ,  Larry Ellison

    发明人： Zhiguo Zhang ,  Charles Wickersham ,  Larry Ellison

    IPC分类号： G01B11/30 ,  G01B21/30

    CPC分类号： G01B11/303

    摘要： A non-contact system and method for measuring an article surface, like a surface (or portion thereof) of a sputtering target assembly, are provided. For instance, the method includes scanning a surface with a sensing beam, and measuring the distance traveled by the sensing beam reflected from the surface, to a sensing device. The system can include a sensing device for collecting surface data at a plurality of points on the surface, and an analyzing device for analyzing the collected data.

    摘要翻译： 提供了用于测量物品表面的非接触系统和方法，如溅射靶组件的表面（或其部分）。 例如，该方法包括用感测光束扫描表面，并测量由表面反射的感测光束行进的距离到感测装置。 该系统可以包括用于在表面上的多个点处收集表面数据的感测装置和用于分析所收集的数据的分析装置。

    Ultrasonic method for detecting banding in metals
    4.
    发明申请
    Ultrasonic method for detecting banding in metals 审中-公开
    用于检测金属条带的超声波检测方法

    公开(公告)号：US20070144623A1

    公开(公告)日：2007-06-28

    申请号：US11059212

    申请日：2005-02-16

    申请人： Charles Wickersham

    发明人： Charles Wickersham

    IPC分类号： C22C27/02

    CPC分类号： G01N29/4427 ,  C22C27/02 ,  G01N29/06 ,  G01N29/07 ,  G01N29/11 ,  G01N29/265 ,  G01N29/28 ,  G01N29/343 ,  G01N29/348 ,  G01N29/48 ,  G01N2291/0231 ,  G01N2291/044 ,  G01N2291/101 ,  G01N2291/2632 ,  G01N2291/2697

    摘要： A method for non-destructively detecting the presence of banded regions in a metal is described. The method involves sending an ultrasonic wave into the metal and obtaining reflected signals. The reflected signals are compared with each other to determine variations in signal intensity. A banded region within the metal can be observed as a weaker reflected signal than a reflected backwall signal, thus accurately identifying a location of banding within the metal. Metal articles with a low percent of banding are also described.

    摘要翻译： 描述了用于非破坏性地检测金属中带状区域的存在的方法。 该方法包括将超声波发送到金属中并获得反射信号。 将反射信号相互比较以确定信号强度的变化。 金属内的带状区域可以被观察为比反射的后壁信号更弱的反射信号，从而准确地识别金属内的条带位置。 还描述了具有低百分比条带的金属制品。

    Inertial bonding method of forming a sputtering target assembly and assembly made therefrom
    5.
    发明申请
    Inertial bonding method of forming a sputtering target assembly and assembly made therefrom 审中-公开
    形成溅射靶组件的惯性接合方法和由其制成的组件

    公开(公告)号：US20070084719A1

    公开(公告)日：2007-04-19

    申请号：US11527766

    申请日：2006-09-26

    申请人： Charles Wickersham ,  Jason Haag

    发明人： Charles Wickersham ,  Jason Haag

    IPC分类号： C23C14/00

    CPC分类号： C23C14/3407

    摘要： A method of forming a sputtering target assembly and the sputtering target assembly made therefrom are described. The method can include bonding a sputtering target to a backing plate with the use of solder, braze metal, or alloys thereof, and reflowing the solder or braze metal after bonding the sputtering target to the backing plate.

    摘要翻译： 描述形成溅射靶组件的方法和由其制成的溅射靶组件。 该方法可以包括使用焊料，钎焊金属或其合金将溅射靶材接合到背板上，以及在将溅射靶材粘合到背板上之后回流焊料或钎焊金属。

    Tantalum and other metals with (110) orientation
    6.
    发明申请
    Tantalum and other metals with (110) orientation 审中-公开
    钽和其他具有（110）取向的金属

    公开(公告)号：US20050155677A1

    公开(公告)日：2005-07-21

    申请号：US11030260

    申请日：2005-01-06

    申请人： Charles Wickersham

    发明人： Charles Wickersham

    IPC分类号： C22C27/02 ,  C22F1/18 ,  C23C14/34 ,  C30B11/00 ,  C30B29/02

    CPC分类号： C22F1/18 ,  C22C27/02 ,  C23C14/3414 ,  C30B11/00 ,  C30B29/02

    摘要： Tantalum metal, niobium metal, alloys thereof and other bcc metals and alloys thereof having a texture of primary or mixed (110) on the surface and/or throughout the thickness of the metal is described. Also described are the processes for making the tantalum metal and other bcc metal with a texture of primary or mixed (110) and the process of making a sputtering target from the tantalum metal or other bcc metal with a texture of primary or mixed (110).

    摘要翻译： 描述了在金属的表面和/或整个厚度上具有初级或混合（110）质地的钽金属，铌金属，其合金和其它bcc金属及其合金。 还描述了制造具有初级或混合组织（110）的钽金属和其他bcc金属的方法以及由具有初级或混合（110）的织构的钽金属或其他bcc金属制造溅射靶的工艺， 。

    Sputtering target assemblies using resistance welding
    8.
    发明申请
    Sputtering target assemblies using resistance welding 有权
    使用电阻焊的溅射靶组件

    公开(公告)号：US20050011749A1

    公开(公告)日：2005-01-20

    申请号：US10620314

    申请日：2003-07-15

    申请人： Mikhail Kachalov ,  Charles Wickersham

    发明人： Mikhail Kachalov ,  Charles Wickersham

    IPC分类号： C23C14/34 ,  H01J37/34 ,  C23C14/00 ,  C23C14/32

    CPC分类号： H01J37/3435 ,  C23C14/3407

    摘要： A method of forming a sputtering target assembly and other metal articles is described. Sputtering target assemblies and metal articles are also described. The method includes bonding a sputter target to a backing plate using resistance heating or welding to bond assembly members that respectively include mating projections and grooves formed in bonding surfaces thereof.

    摘要翻译： 描述了形成溅射靶组件和其它金属制品的方法。 还描述了溅射靶组件和金属制品。 该方法包括使用电阻加热或焊接将溅射靶结合到背板上，以将组装构件分别包括配合突起和形成在其接合表面中的槽。