Solution processible materials and their use in electronic devices
    10.
    发明申请
    Solution processible materials and their use in electronic devices 审中-公开
    解决可加工材料及其在电子设备中的应用

    公开(公告)号:US20070286953A1

    公开(公告)日:2007-12-13

    申请号:US11803450

    申请日:2007-05-14

    IPC分类号: B05D5/00 B29C71/04 B05D3/12

    摘要: The invention describes a method or methods to create, or extend a two-dimensional (two-dimensional) electronic delocalization of a deposited solution processible material by energetic and/or chemical means for use in electronic devices. The process allows for a high degree of tunability in the extent of delocalization that occurs. Therefore the electronic properties can be tailored to various electronic target applications such as thin film transistors and photovoltaic devices.

    摘要翻译: 本发明描述了通过用于电子设备的高能和/或化学方法来产生或扩展沉积的可溶解可加工材料的二维(二维)电子离域的方法或方法。 该过程允许在发生的离域程度上具有高度的可调性。 因此,电子性能可以适用于各种电子目标应用,例如薄膜晶体管和光伏器件。