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公开(公告)号:US08714227B2
公开(公告)日:2014-05-06
申请号:US12842112
申请日:2010-07-23
申请人: Chen-Ke Hsu , Liang-Sheng Chi , Chun-Chang Chen , Win-Jim Su , Hsu-Cheng Lin , Mei-Ling Tsai , Yi Lung Liu , Chen Ou
发明人: Chen-Ke Hsu , Liang-Sheng Chi , Chun-Chang Chen , Win-Jim Su , Hsu-Cheng Lin , Mei-Ling Tsai , Yi Lung Liu , Chen Ou
IPC分类号: B32B38/10
CPC分类号: H01L22/20 , H01L21/67005 , H01L21/67132 , H01L21/67271 , Y10S156/93 , Y10S156/941 , Y10T156/1111 , Y10T156/1116 , Y10T156/1158 , Y10T156/1168 , Y10T156/1179 , Y10T156/1195 , Y10T156/1917 , Y10T156/1933 , Y10T156/1983
摘要: A chip sorting apparatus comprising a chip holder comprising a first surface and an second surface opposite to the first surface; a wafer comprising a first chip disposed on a first position of the first surface; a first chip receiver comprising a third surface and an fourth surface opposite to the third surface, wherein the third surface is opposite to the first surface; a pressurization device making the first chip and the third surface of the first chip receiver adhered to each other through pressuring the second surface at where corresponding to the first position; and a separator decreasing the adhesion between the first chip and the first surface.
摘要翻译: 一种芯片分选装置,包括:芯片保持器,其包括第一表面和与所述第一表面相对的第二表面; 晶片,其包括设置在所述第一表面的第一位置上的第一芯片; 第一芯片接收器,包括与第三表面相对的第三表面和第四表面,其中第三表面与第一表面相对; 使第一芯片的第一芯片和第三表面的加压装置通过在对应于第一位置的位置处对第二表面施加压力而彼此粘合; 以及减小第一芯片和第一表面之间的粘附性的隔板。
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公开(公告)号:US20110017407A1
公开(公告)日:2011-01-27
申请号:US12842112
申请日:2010-07-23
申请人: Chen-Ke Hsu , Liang-Sheng Chi , Chun-Chang Chen , Win-Jim Su , Hsu-Cheng Lin , Mei-Ling Tsai , Yi Lung Liu , Chen Ou
发明人: Chen-Ke Hsu , Liang-Sheng Chi , Chun-Chang Chen , Win-Jim Su , Hsu-Cheng Lin , Mei-Ling Tsai , Yi Lung Liu , Chen Ou
IPC分类号: B32B38/10
CPC分类号: H01L22/20 , H01L21/67005 , H01L21/67132 , H01L21/67271 , Y10S156/93 , Y10S156/941 , Y10T156/1111 , Y10T156/1116 , Y10T156/1158 , Y10T156/1168 , Y10T156/1179 , Y10T156/1195 , Y10T156/1917 , Y10T156/1933 , Y10T156/1983
摘要: A chip sorting apparatus comprising a chip holder comprising a first surface and an second surface opposite to the first surface; a wafer comprising a first chip disposed on a first position of the first surface; a first chip receiver comprising a third surface and an fourth surface opposite to the third surface, wherein the third surface is opposite to the first surface; a pressurization device making the first chip and the third surface of the first chip receiver adhered to each other through pressuring the second surface at where corresponding to the first position; and a separator decreasing the adhesion between the first chip and the first surface.
摘要翻译: 一种芯片分选装置,包括:芯片保持器,其包括第一表面和与所述第一表面相对的第二表面; 晶片,其包括设置在所述第一表面的第一位置上的第一芯片; 第一芯片接收器,包括与第三表面相对的第三表面和第四表面,其中第三表面与第一表面相对; 使第一芯片的第一芯片和第三表面的加压装置通过在对应于第一位置的位置处对第二表面施加压力而彼此粘合; 以及减小第一芯片和第一表面之间的粘附性的隔板。
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