摘要:
A multiple run by run process is described. A plurality of tools and a plurality of products to be run on the tools are provided. Tool effects and product effects on a parameter are identified for each tool and each product. A desired recipe is calculated for each product on each tool based on the tool effects and product effects identified. Thereafter, the plurality of products is run on the plurality of tools. The desired recipe is updated after each run of each tool. Tool aging is calculated after each run of each tool based on the desired recipe used.
摘要:
A multiple run by run process is described. A plurality of tools and a plurality of products to be run on the tools are provided. A desired recipe is calculated for each product on each tool based on a previous recipe used for each product on each tool and deviation of a parameter from a target value. Thereafter, the plurality of products is run on the plurality of tools. The desired recipe is updated after each run of each tool.
摘要:
An image sensor module having a light gathering region and a light non-gathering region includes an image sensor, a light blocking spacer, a lens layer and a fixing shell. The light blocking spacer is disposed on the image sensor and located in the light non-gathering region. The light blocking spacer has a through hole exposing a portion of the image sensor in the light gathering region. The lens layer is disposed on the light blocking spacer and covers the through hole. The lens layer includes a transparent substrate and a lens disposed on the transparent substrate and located in the light gathering region. The fixing shell located in the light non-gathering region wraps the sidewalls of the image sensor, the light blocking spacer and the lens layer continuously. The material of the fixing shell includes a thermosetting material. A method for manufacturing the image sensor module is also provided.
摘要:
A method for photolithography in semiconductor device manufacturing comprises defining test critical dimension target for a photolithography mask, measuring a mask critical dimension, comparing mask critical dimension to the test critical dimension target and determining a critical dimension deviation, determining a photolithography light base energy in response to the critical dimension deviation, and exposing the wafer according to the photolithography light base energy.
摘要:
An exemplary wafer level package comprises a semiconductor wafer with a plurality of semiconductor chips of perfect polygonal shapes thereon. A circuit-free area is defined over the semiconductor wafer to electrically isolate the semiconductor chips. A dam structure is substantially formed over the circuit-free area, wherein a portion of the dam structure formed around an edge of the semiconductor wafer is formed with a plurality via holes therein. A transparent substrate is formed over the semiconductor wafer, defining a plurality of cavities between the semiconductor chips and the transparent substrate, wherein the transparent substrate is supported by the dam structure.
摘要:
In a stylus attachment structure for an IT product, the attachment structure formed on an IT product, such as, a laptop, a tablet PC and a PDA, comprises an attachment slot, a push-out member, a retaining member and an elastic part, wherein the push-out member is arranged in the attachment slot and the retaining member is slidably mounted at one end of the attachment slot for selectively retaining or releasing the stylus. In this way, when the stylus is not in use for a while, it can be obliquely plugged to one end of the attachment slot, it is easy for the user to pick up the stylus; alternatively, the stylus can be fully received in the attachment socket and further secured in place with a retaining member, thereby enabling the stylus to be attached properly so that it doesn't become loose.
摘要:
An advanced process control method using time interval between lots of a particular product to control the weighting of feedback data is described. A plurality of products are fabricated wherein the products are tracked by the process control method based on product type, for example. Variation in a parameter is detected. The adjustment speed of a process recipe is determined based on a time interval weighting wherein the time interval is defined as the time between processing of lots of the same product type. The process recipe is updated at the determined adjustment speed to decrease variation of the parameter.
摘要:
A spin-coater for coating a liquid material on a wafer that is equipped with a self-cleaning coating cup and a method for self-cleaning a spin-coater are described. The spin-coater is constructed of a coating cup of circular shape, a wafer pedestal situated in the cup, a coating material dispensing nozzle over the pedestal, a motor means for rotating the pedestal, and a solvent dispensing means that is mounted juxtaposed to an upper rim of the sidewall of the cup for dispensing a cleaning solvent onto an interior surface of the sidewall to dissolve and rinse off any liquid coating material splattered thereon and to prevent the formation of solid contamination from the solidified coating material.
摘要:
In a stylus attachment structure for an IT product, the attachment structure formed on an IT product, such as, a laptop, a tablet PC and a PDA, comprises an attachment slot, a push-out member, a retaining member and an elastic part, wherein the push-out member is arranged in the attachment slot and the retaining member is slidably mounted at one end of the attachment slot for selectively retaining or releasing the stylus. In this way, when the stylus is not in use for a while, it can be obliquely plugged to one end of the attachment slot, it is easy for the user to pick up the stylus; alternatively, the stylus can be fully received in the attachment socket and further secured in place with a retaining member, thereby enabling the stylus to be attached properly so that it doesn't become loose.
摘要:
An method and apparatus for aligning a mask to a wafer for photolithographic processing steps which does not use optical alignment. Each wafer is provided a unique identification code, such as a bar code. As wafers are processed through photolithographic steps where optical detection of an alignment mark can be easily accomplished the alignment data for each wafer is stored in a memory unit. At the next photolithographic step a detector reads the identification code and identifies the wafer being processed. The wafer identification is fed to a data processing unit which retrieves the alignment data for that wafer fro the memory unit. The data processing unit then feed alignment data to a mechanical controller which positions the wafer relative to the mask image being used in the photolithographic step.