摘要:
Provided are a system in package (SIP) semiconductor device suitable for efficient power management, and a method of managing power of the SIP semiconductor device. The SIP semiconductor device includes chips including first and second chips. Each of the chips includes an alive block, a local interface, and an intellectual property (IP) block. The alive block is continuously supplied with power in order to continuously be in an on-state. The local interface transmits/receives data to/from other chips. The IP block individually stores and processes data. The alive blocks of the chips are connected to each other through a first signal line unit for transmitting a signal required to wake up or initialize the chips. The alive blocks control power to the chips, respectively, in response to an external wake-up instruction signal or the signal transmitted through the first signal line unit. Therefore, power can be efficiently managed since power that is supplied to the chips of the SIP semiconductor device is managed by the alive blocks or the local interfaces of the chips.
摘要:
A system on a chip (SoC) device verification system comprises: an SoC device model including one or more IPs and a memory controller; an external IP verification model receiving an instruction from the SoC device model and verifying operation of the one or more IPs included in the SoC device model; and a bus select model selecting one of the external IP verification model and an external device in response to a memory control signal received from the memory controller of the SoC device model.
摘要:
A system on a chip (SoC) device verification system comprises: an SoC device model including one or more IPs and a memory controller; an external IP verification model receiving an instruction from the SoC device model and verifying operation of the one or more IPs included in the SoC device model; and a bus select model selecting one of the external IP verification model and an external device in response to a memory control signal received from the memory controller of the SoC device model.
摘要:
Provided are a system in package (SIP) semiconductor device suitable for efficient power management, and a method of managing power of the SIP semiconductor device. The SIP semiconductor device includes chips including first and second chips. Each of the chips includes an alive block, a local interface, and an intellectual property (IP) block. The alive block is continuously supplied with power in order to continuously be in an on-state. The local interface transmits/receives data to/from other chips. The IP block individually stores and processes data. The alive blocks of the chips are connected to each other through a first signal line unit for transmitting a signal required to wake up or initialize the chips. The alive blocks control power to the chips, respectively, in response to an external wake-up instruction signal or the signal transmitted through the first signal line unit. Therefore, power can be efficiently managed since power that is supplied to the chips of the SIP semiconductor device is managed by the alive blocks or the local interfaces of the chips.