Solderable EMI Gasket and Grounding Pad
    10.
    发明申请
    Solderable EMI Gasket and Grounding Pad 审中-公开
    可焊接EMI垫片和接地垫

    公开(公告)号:US20090008431A1

    公开(公告)日:2009-01-08

    申请号:US11773080

    申请日:2007-07-03

    CPC分类号: H05K9/0015

    摘要: Apparatus, which is useful as both a conductive gasket and a grounding pad, which has a compressible elastomeric substrate having at least one side surface and two ends, a conductive elastomeric layer adjacent to all of the side surfaces of the compressible substrate, and a metal layer adjacent to the conductive layer.

    摘要翻译: 可用作导电垫片和接地垫两者的装置,其具有可压缩的弹性体基底,其具有至少一个侧表面和两个末端,邻近可压缩基底的所有侧表面的导电弹性体层和金属 层。