公开(公告)号：US20110233178A1

公开(公告)日：2011-09-29

申请号：US12748578

申请日：2010-03-29

申请人： Chi Wah CHENG ,  Lap Kei CHOW ,  Zhuanyun ZHANG ,  Sze Leong LAI

发明人： Chi Wah CHENG ,  Lap Kei CHOW ,  Zhuanyun ZHANG ,  Sze Leong LAI

IPC分类号： B23K26/00

CPC分类号： B23K26/0673 ,  B23K26/364 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  B23K2103/52 ,  H01L21/67092

摘要： A laser processing apparatus for cutting substrates comprises a laser head for generating a laser beam and first and second work holders on which substrates are mountable. A diverter positioned along a path of the laser beam is operative to selectively direct the laser beam towards a first substrate mounted on the first work holder to cut the first substrate, or towards a second substrate mounted on the second work holder to cut the second substrate, so that contemporaneous operations may be conducted on one substrate while the other substrate is being cut.

摘要翻译： 用于切割基板的激光加工设备包括用于产生激光束的激光头和可安装基板的第一和第二工件保持器。 沿着激光束的路径定位的分流器可操作以选择性地将激光束引向安装在第一工件保持器上的第一基板，以切割第一基板，或朝向安装在第二工件保持器上的第二基板切割第二基板 从而可以在一个基板上同时进行操作，而另一个基板被切割。

公开(公告)号：US20150111366A1

公开(公告)日：2015-04-23

申请号：US14058396

申请日：2013-10-21

申请人： Chi Wah CHENG ,  Eric Lap Kei CHOW ,  Joseph Hoi Shuen TANG ,  Chun Kit LIU

发明人： Chi Wah CHENG ,  Eric Lap Kei CHOW ,  Joseph Hoi Shuen TANG ,  Chun Kit LIU

IPC分类号： H01L21/67 ,  H01L21/687 ,  B28D5/00 ,  H01L21/78

CPC分类号： H01L21/67092 ,  B28D5/024 ,  B28D5/029 ,  H01L21/68764

摘要： Disclosed is a singulation apparatus, comprising: at least one chuck station to which a workpiece is securable, the at least one chuck station being configured to move along a feed direction; a bridge extending above the at least one chuck station, the bridge having a first side and a second side opposite the first side; a first cutting device members mounted to the bridge and being independently movable along the first side, transversely to the feed direction; and a second cutting device members mounted to the bridge and being independently movable along the second side, transversely to the feed direction, the first and second cutting devices being for cutting the workpiece. A singulation method is also disclosed.

摘要翻译： 公开了一种切割装置，包括：至少一个卡盘站，工件可固定到该夹持站上，所述至少一个卡盘站构造成沿着进给方向移动; 在所述至少一个卡盘站上方延伸的桥，所述桥具有与所述第一侧相对的第一侧和第二侧; 第一切割装置构件，其安装到所述桥上并且可沿着所述第一侧横向于所述进给方向独立地移动; 以及第二切割装置构件，其安装到所述桥上并且可沿所述第二侧横向于所述进给方向独立地移动，所述第一和第二切割装置用于切割所述工件。 还公开了一种分割方法。

公开(公告)号：US20140011336A1

公开(公告)日：2014-01-09

申请号：US13541865

申请日：2012-07-05

申请人： Chi Hang KWOK ,  Chi Wah CHENG ,  Lap Kei CHOW

发明人： Chi Hang KWOK ,  Chi Wah CHENG ,  Lap Kei CHOW

IPC分类号： H01L21/78 ,  B23K26/06

CPC分类号： B23K26/0853 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/50

摘要： A laser processing method is disclosed, comprising the steps of: directing a laser beam to a workpiece; and effecting a relative motion between the laser beam and the workpiece. In particular, the step of directing the laser beam to the workpiece comprises focusing the laser beam within the workpiece until an internal damage forms within the workpiece and a crack propagates from the internal damage to at least one surface of the workpiece to form a surface crack on the workpiece. Further, the step of effecting the relative motion between the laser beam and the workpiece is such that the surface crack on the workpiece propagates along a line of separation on the workpiece. A laser processing apparatus is also disclosed.

摘要翻译： 公开了一种激光加工方法，包括以下步骤：将激光束导向工件; 并且实现激光束和工件之间的相对运动。 特别地，将激光束引导到工件的步骤包括将激光束聚焦在工件内直到在工件内形成内部损伤，并且裂纹从内部损伤传播到工件的至少一个表面以形成表面裂纹 在工件上。 此外，实现激光束和工件之间的相对运动的步骤使得工件上的表面裂纹沿着工件上的分离线传播。 还公开了一种激光加工装置。

公开(公告)号：US20140008855A1

公开(公告)日：2014-01-09

申请号：US13542785

申请日：2012-07-06

申请人： Chi Wah CHENG ,  Lap Kei CHOW ,  Chi Hang LEUNG

发明人： Chi Wah CHENG ,  Lap Kei CHOW ,  Chi Hang LEUNG

IPC分类号： H01L21/683 ,  B25B11/00

CPC分类号： B28D5/0094 ,  H01L21/67126 ,  H01L21/6838 ,  H01L21/68792 ,  Y10T29/49998

摘要： An apparatus for supporting a workpiece during processing of the workpiece is disclosed. The apparatus comprises: a chassis having a vacuum chamber that is connectable to a vacuum source; a supporting device rotatable relative to the chassis, the supporting device having a hollow compartment and a supporting surface for holding the workpiece; and at least one sealing device arranged between the chassis and the supporting device, to provide an air-tight seal between the chassis and the supporting device while allowing for rotation of the supporting device with respect to the chassis, so as to form a vacuum passage extending from the supporting surface of the supporting device through the hollow compartment of the supporting device and the vacuum chamber of the chassis to the vacuum source, to thereby hold the workpiece to the supporting surface of the supporting device during processing of the workpiece.

摘要翻译： 公开了一种用于在加工工件期间支撑工件的装置。 该装置包括：具有可连接到真空源的真空室的底架; 支撑装置可相对于底盘旋转，支撑装置具有中空隔室和用于保持工件的支撑表面; 以及布置在底盘和支撑装置之间的至少一个密封装置，以在底架和支撑装置之间提供气密密封，同时允许支撑装置相对于底盘旋转，以便形成真空通道 从支撑装置的支撑表面延伸穿过支撑装置的中空隔室和底盘的真空室到真空源，从而在工件加工期间将工件保持在支撑装置的支撑表面上。

公开(公告)号：US20120259444A1

公开(公告)日：2012-10-11

申请号：US13080009

申请日：2011-04-05

申请人： Chi Wah CHENG ,  Lap Kei CHOW ,  Man Kin LEUNG ,  Hoi Shuen TANG

发明人： Chi Wah CHENG ,  Lap Kei CHOW ,  Man Kin LEUNG ,  Hoi Shuen TANG

IPC分类号： G06F17/50

CPC分类号： B28D5/029

摘要： A method of configuring a dicing device 101, which dices along a cutting line of a workpiece 111 according to a dicing step, is disclosed. Numerical input of a dicing order of the dicing device 101 to dice a workpiece 111 is time-consuming and prone to errors. The disclosed method comprises the step of depicting a graphical user interface 202, which includes a layout 203 of the workpiece 111 that further includes a plurality of cut lines relating to respective cutting lines along the workpiece 111. The disclosed method further comprises the step of graphically contacting a cut line from the layout 203 through a user-interface device 201, to allow selection of the cut line before the selected cut line is assigned to the dicing step of the dicing device 101. By providing the plurality of cut lines in the layout 203 that are graphically contactable through the user-interface device 201, the method advantageously allows an easier process of configuring the dicing step of the dicing device 101. Also disclosed are a dicing apparatus for dicing a workpiece 111, as well as a computer-readable medium having a computer program for instructing a computer to perform the disclosed method.

摘要翻译： 公开了一种根据切割步骤配置沿着工件111的切割线切割的切割装置101的方法。 切割装置101切割工件111的切割顺序的数字输入是耗时的并且容易出错。 所公开的方法包括描绘图形用户界面202的步骤，其包括工件111的布局203，其还包括与沿着工件111的相应切割线相关的多条切割线。所公开的方法还包括图形化的步骤 通过用户界面装置201从布局203接触切割线，以允许在将所选择的切割线分配给切割装置101的切割步骤之前选择切割线。通过在布局中提供多条切割线 203通过用户界面装置201图形地可接触，该方法有利地允许配置切割装置101的切割步骤的更简单的过程。还公开了一种用于将工件111切割的切割装置以及计算机可读 介质具有用于指示计算机执行所公开的方法的计算机程序。

公开(公告)号：US20100289889A1

公开(公告)日：2010-11-18

申请号：US12465766

申请日：2009-05-14

申请人： Chi Wah CHENG ,  Lap Kei CHOW

发明人： Chi Wah CHENG ,  Lap Kei CHOW

IPC分类号： H04N7/18

CPC分类号： H01L21/681 ,  H01L21/67092

摘要： A method for determining cutting lines for a substrate prior to its singulation is provided whereby the substrate comprises first and second rows of alignment marks which are substantially parallel to each other such that a pair of alignment marks each from the first and second rows of alignment marks is configured for determining a position of a cutting line. The method comprises the steps of positioning the first row of alignment marks along a relative motion path of a first camera and positioning the second row of alignment marks along a relative motion path of a second camera. While the substrate is being moved relative to the first and second cameras along the respective relative motion paths without stopping, the first and second cameras capture images of multiple pairs of alignment marks from the first and second rows of alignment marks during such motion. Thereafter, the position of each cutting line is determined from the images of each pair of alignment marks along the first and second rows of alignment marks relating to the cutting line and stored in a storage device for use during singulation.

摘要翻译： 提供了一种用于在其单独化之前确定用于衬底的切割线的方法，由此所述衬底包括基本上彼此平行的第一和第二排对准标记，使得从所述第一和第二行对准标记中的一对对准标记 被配置用于确定切割线的位置。 该方法包括以下步骤：沿着第一相机的相对运动路径定位第一排对准标记，并沿着第二相机的相对运动路径定位第二排对准标记。 当基板相对于第一和第二相机相对于相应的相对运动路径移动而不停止时，第一和第二相机在这种运动期间从第一和第二排对准标记捕获多对对准标记的图像。 此后，根据与切割线相关的第一和第二排对准标记的每对对准标记的图像确定每条切割线的位置，并存储在用于分割的存储装置中。

公开(公告)号：US20150370244A1

公开(公告)日：2015-12-24

申请号：US14311856

申请日：2014-06-23

申请人： Hing Suen SIU ,  Yu Sze CHEUNG ,  Chi Wah CHENG ,  Chung Yan LAU

发明人： Hing Suen SIU ,  Yu Sze CHEUNG ,  Chi Wah CHENG ,  Chung Yan LAU

IPC分类号： G05B19/418

CPC分类号： G05B19/4182 ,  G05B2219/39106 ,  G05B2219/40554 ,  G05B2219/45031 ,  G05B2219/45054 ,  Y02P90/083

摘要： Disclosed is an apparatus for handling electronic components. The apparatus comprises: i) a rotary device and a plurality of pick heads arranged circumferentially around the rotary device, each pick head being operable to hold an electronic component; ii) a position-determining device for determining an arrangement of the electronic components as held by the respective pick heads; iii) a fiducial mark arranged in a position that is indicative of the arrangement of the electronic components, as determined by the position-determining device; iv) a first imaging device arranged relative to the fiducial mark; and v) at least one handling device for handling the electronic components. Specifically, the first imaging device is operable to capture at least one image comprising the fiducial mark and the at least one handling device so that a position of the at least one handling device is adjustable to align the at least one handling device with respect to the arrangement of the electronic components, based on an offset between the fiducial mark and the at least one handling device as derived from the at least one image captured by the first imaging device. A method of adjusting the position of at least one handling device of an apparatus for handling electronic components is also disclosed.

摘要翻译： 公开了一种处理电子部件的装置。 该装置包括：i）旋转装置和围绕旋转装置周向布置的多个拾取头，每个拾取头可操作以保持电子部件; ii）位置确定装置，用于确定由各个拾取头保持的电子部件的布置; iii）布置在由位置确定装置确定的指示电子部件的布置的位置的基准标记; iv）相对于基准标记布置的第一成像装置; 以及v）用于处理电子部件的至少一个处理装置。 具体地，第一成像装置可操作以捕获包括基准标记和至少一个处理装置的至少一个图像，使得至少一个处理装置的位置是可调节的，以使至少一个处理装置相对于 基于从由第一成像装置拍摄的至少一个图像得出的基准标记和至少一个处理装置之间的偏移，电子部件的布置。 还公开了一种调节用于处理电子部件的装置的至少一个处理装置的位置的方法。

公开(公告)号：US20100150756A1

公开(公告)日：2010-06-17

申请号：US12335675

申请日：2008-12-16

申请人： Lap Kei Eric CHOW ,  Hoi Shuen TANG ,  Hon Keung LAI ,  Chi Wah CHENG

发明人： Lap Kei Eric CHOW ,  Hoi Shuen TANG ,  Hon Keung LAI ,  Chi Wah CHENG

IPC分类号： F04B35/04

CPC分类号： F04F7/00

摘要： A nozzle device comprising a nozzle chamber includes a fluid inlet located at a first side of the nozzle chamber which is operative to introduce fluid into the nozzle chamber in an injection direction and a fluid outlet at a second side of the nozzle chamber which is operative to expel fluid from the nozzle chamber. A high frequency wave generator is also located in the nozzle chamber which is oriented and operative to generate high frequency waves in a direction which is substantially parallel to the injection direction, whereby to impart high frequency energy to the fluid in the nozzle chamber.

摘要翻译： 包括喷嘴室的喷嘴装置包括位于喷嘴室的第一侧处的流体入口，该流体入口可操作以沿喷射方向将流体引入喷嘴室，并且在喷嘴室的第二侧具有流体出口， 从喷嘴室排出流体。 高频波发生器也位于喷嘴室中，其定向和操作以在基本上平行于喷射方向的方向上产生高频波，从而向喷嘴室中的流体施加高频能量。

公开(公告)号：US20140328652A1

公开(公告)日：2014-11-06

申请号：US14258463

申请日：2014-04-22

申请人： Chi Wah CHENG ,  Kai Fung LAU ,  Hing Suen SIU

发明人： Chi Wah CHENG ,  Kai Fung LAU ,  Hing Suen SIU

IPC分类号： B65G47/84

CPC分类号： H01L21/67718 ,  H01L21/67132

摘要： Disclosed is a transfer apparatus for transferring electronic devices from a wafer to a test handler. The transfer apparatus comprises: i) a rotary device rotatable about an axis; and ii) a plurality of holders configured to hold the electronic devices for transfer from the wafer to the test handler. The plurality of holders are coupled to, and extendable from, the rotary device to pick the electronic devices from the wafer. Specifically, the plurality of holders are arranged circumferentially around, and inclined with respect to, the axis of the rotary device, so as to change an orientation of the electronic devices on the wafer to a desired orientation of the electronic devices on the test handler.

摘要翻译： 公开了一种用于将电子设备从晶片传送到测试处理器的传送设备。 传送装置包括：i）可围绕轴线旋转的旋转装置; 以及ii）多个保持器，其构造成保持用于从晶片转移到测试处理器的电子设备。 多个保持器联接到旋转装置并且可从旋转装置延伸以从晶片拾取电子装置。 具体地说，多个保持器周向地布置并相对于旋转装置的轴线倾斜，以便将晶​​片上的电子设备的取向改变到测试处理器上的电子设备的期望取向。

公开(公告)号：US20140049279A1

公开(公告)日：2014-02-20

申请号：US13584971

申请日：2012-08-14

申请人： Hing Suen SIU ,  Yu Sze CHEUNG ,  Chi Wah CHENG ,  Kai Fung LAU

发明人： Hing Suen SIU ,  Yu Sze CHEUNG ,  Chi Wah CHENG ,  Kai Fung LAU

IPC分类号： G01R1/073

CPC分类号： G01R1/06772 ,  G01R1/0416 ,  G01R1/07342

摘要： A testing apparatus for electronic components comprises a mounting block and a plurality of contact strips arranged on the mounting block. The contact strips are configured such that electrical leads of an electronic component are operative to press against and bend the contact strips in a biasing direction to ensure good contact between the electrical leads and the contact strips during testing of the electronic component. Further, a preload block located on the mounting block is operative to contact and apply a pre-stress force onto the contact strips in the biasing direction prior to contact between the electrical leads and the contact strips.

摘要翻译： 一种用于电子部件的测试装置包括安装块和布置在安装块上的多个接触条。 接触条被配置成使得电子部件的电引线可操作以在偏置方向上按压和弯曲接触片，以确保电子部件测试期间电引线和接触片之间的良好接触。 此外，位于安装块上的预加载块可操作以在电引线和接触片之间接触之前在偏压方向上接触并施加预接触力。