公开(公告)号：US07278252B2

公开(公告)日：2007-10-09

申请号：US11521829

申请日：2006-09-15

申请人： Chia Wei Chang

发明人： Chia Wei Chang

IPC分类号： B68C1/16

CPC分类号： B68C3/00 ,  B68C2003/0041 ,  B68C2003/0091

摘要： A stirrup includes a footrest as well as a hanger for suspending the stirrup from a saddle. A shock absorber is provided for the footrest and has protrusions which impart a nonslip character to the shock absorber. The protrusions have respective ends which face away from the shock absorber, and each of these ends is provided with a depression.

公开(公告)号：US06796110B2

公开(公告)日：2004-09-28

申请号：US10309590

申请日：2002-12-03

申请人： Chia Wei Chang

发明人： Chia Wei Chang

IPC分类号： B68C300

CPC分类号： B68C1/16

摘要： An improved equestrian saddle creates an angle of separation between the stirrup and the body of the horse to aid the insertion of the rider's foot. A fender conforms to the shape of an attached molded plate. As a result, the stirrup strap is twisted, turning the associated stirrup away from the horse. The molded plate is intended to be shaped by a user, maintain its shape during normal use conditions, and be re-shaped by the user at will. Alternatively, the plate could be molded into a permanent shape and attached to the fender. In yet another embodiment, the plate could be shaped by the user and then made rigid by the user. The plate is preferably inserted into a pocket in the fender structure.

摘要翻译： 改进的马术马鞍产生马镫与马体之间的分离角度，以帮助骑手脚的插入。 挡泥板符合附着的模制板的形状。 结果，马镫带扭曲，将相关马镫远离马。 模制板旨在由使用者成形，在正常使用条件下保持其形状，并且由使用者随意重新塑造。 或者，板可以模制成永久形状并且附接到翼子板。 在另一个实施例中，板可以由使用者成形，然后由使用者制成刚性。 板优选地插入翼子板结构中的口袋中。

公开(公告)号：US08222441B2

公开(公告)日：2012-07-17

申请号：US12385573

申请日：2009-04-13

申请人： Ching-Hsuan Lin ,  Tsung Li Lin ,  Chia Wei Chang ,  Kuen-Yuan Hwang ,  An-Pang Tu ,  Fang-Hsien Su

发明人： Ching-Hsuan Lin ,  Tsung Li Lin ,  Chia Wei Chang ,  Kuen-Yuan Hwang ,  An-Pang Tu ,  Fang-Hsien Su

IPC分类号： C07F9/32 ,  C08L71/02

CPC分类号： C07F9/657172 ,  C08K5/5313 ,  C09K21/12

摘要： A series of novel phosphorus-containing compounds having the following formula are disclosed: wherein R1-R12, A, B, D, X, and Y are as defined in the specification. A process for the preparation of the compound of formula (1), a curing agent, and a flame resistant epoxy resin and a preparation process thereof are also provided.

摘要翻译： 公开了一系列具有下式的新型含磷化合物：其中R1-R12，A，B，D，X和Y如说明书中所定义。 还提供了制备式（1）化合物，固化剂和阻燃环氧树脂的方法及其制备方法。

公开(公告)号：US20090091903A1

公开(公告)日：2009-04-09

申请号：US11588914

申请日：2006-10-27

申请人： Shih Ping Hsu ,  Chung Cheng Lien ,  Chia Wei Chang

发明人： Shih Ping Hsu ,  Chung Cheng Lien ,  Chia Wei Chang

IPC分类号： H05K1/18

CPC分类号： H05K1/185 ,  H01L23/5385 ,  H01L23/5389 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/462 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2203/061 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/32145 ,  H01L2924/00015

摘要： A stack structure of circuit boards embedded with semiconductor chips is proposed. At least two circuit boards are provided. Each of the circuit boards includes circuit layers formed on surfaces thereof and at least one opening embedded with a semiconductor chip, wherein, the circuit layers have a plurality of conductive structures and electrically conductive pads, and the semiconductor chip has a plurality of electrode pads, and the conductive structures of the circuit layers are electrically conductive to the electrode pads of the semiconductor chip. At least one adhesive layer is formed between the two circuit boards and disposed with a conductive material corresponding in position to the electrically conductive pads of the circuit boards. Thus, a conductive path can be formed by the conductive material between the electrically conductive pads of the circuit boards, thereby establishing electrical connection between the two circuit boards.

摘要翻译： 提出了嵌入半导体芯片的电路板的堆栈结构。 提供至少两个电路板。 每个电路板包括形成在其表面上的电路层和嵌入半导体芯片的至少一个开口，其中电路层具有多个导电结构和导电焊盘，并且半导体芯片具有多个电极焊盘， 并且电路层的导电结构与半导体芯片的电极焊盘导电。 在两个电路板之间形成至少一个粘合剂层，并且设置有与电路板的导电焊盘相对应的导电材料。 因此，可以通过导电材料在电路板的导电焊盘之间形成导电路径，由此建立两个电路板之间的电连接。

公开(公告)号：US20090258997A1

公开(公告)日：2009-10-15

申请号：US12385573

申请日：2009-04-13

申请人： Ching-Hsuan Lin ,  Tsung Li Lin ,  Chia Wei Chang ,  Kuen-Yuan Hwang ,  An-Pang Tu ,  Fang-Hsien Su

发明人： Ching-Hsuan Lin ,  Tsung Li Lin ,  Chia Wei Chang ,  Kuen-Yuan Hwang ,  An-Pang Tu ,  Fang-Hsien Su

IPC分类号： C08L71/02 ,  C07F9/32

CPC分类号： C07F9/657172 ,  C08K5/5313 ,  C09K21/12

摘要： A series of novel phosphorus-containing compounds having the following formula are disclosed: wherein R1-R12, A, B, D, X, and Y are as defined in the specification. A process for the preparation of the compound of formula (1), a curing agent, and a flame resistant epoxy resin and a preparation process thereof are also provided.

摘要翻译： 公开了一系列具有下式的新型含磷化合物：其中R1-R12，A，B，D，X和Y如说明书中所定义。 还提供了制备式（1）化合物，固化剂和阻燃环氧树脂的方法及其制备方法。

公开(公告)号：US07065943B2

公开(公告)日：2006-06-27

申请号：US10899473

申请日：2004-07-26

申请人： Chia Wei Chang

发明人： Chia Wei Chang

IPC分类号： B68C3/00

CPC分类号： B68C3/00 ,  B68C2003/0041 ,  B68C2003/0091

摘要： A stirrup includes an elongated footrest as well as a hanger for suspending the stirrup from a saddle. The footrest and the hanger can pivot relative to one another on an axis parallel to the longitudinal axis of the footrest. A shock absorber is provided for the footrest and has spaces for anchoring the shock absorber to the footrest. The footrest, in turn, has anchoring members for the shock absorber.

摘要翻译： 一个马镫包括一个细长的脚踏板以及一个用于从马鞍悬挂马镫的衣架。 脚凳和衣架可以在平行于搁脚板的纵向轴线的轴线上相对于彼此枢转。 为脚踏设置减震器，并具有用于将减震器固定到搁脚板的空间。 搁脚板又具有用于减震器的锚定构件。

公开(公告)号：USD490942S1

公开(公告)日：2004-06-01

申请号：US29177484

申请日：2003-03-11

申请人： Chia Wei Chang

设计人： Chia Wei Chang

公开(公告)号：US07706148B2

公开(公告)日：2010-04-27

申请号：US11588914

申请日：2006-10-27

申请人： Shih Ping Hsu ,  Chung Cheng Lien ,  Chia Wei Chang

发明人： Shih Ping Hsu ,  Chung Cheng Lien ,  Chia Wei Chang

IPC分类号： H01R12/16

CPC分类号： H05K1/185 ,  H01L23/5385 ,  H01L23/5389 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/462 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2203/061 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/32145 ,  H01L2924/00015

摘要： A stack structure of circuit boards embedded with semiconductor chips is proposed. At least two circuit boards are provided. Each of the circuit boards includes circuit layers formed on surfaces thereof and at least one opening embedded with a semiconductor chip, wherein, the circuit layers have a plurality of conductive structures and electrically conductive pads, and the semiconductor chip has a plurality of electrode pads, and the conductive structures of the circuit layers are electrically conductive to the electrode pads of the semiconductor chip. At least one adhesive layer is formed between the two circuit boards and disposed with a conductive material corresponding in position to the electrically conductive pads of the circuit boards. Thus, a conductive path can be formed by the conductive material between the electrically conductive pads of the circuit boards, thereby establishing electrical connection between the two circuit boards.

摘要翻译： 提出了嵌入半导体芯片的电路板的堆栈结构。 提供至少两个电路板。 每个电路板包括形成在其表面上的电路层和嵌入半导体芯片的至少一个开口，其中电路层具有多个导电结构和导电焊盘，并且半导体芯片具有多个电极焊盘， 并且电路层的导电结构与半导体芯片的电极焊盘导电。 在两个电路板之间形成至少一个粘合剂层，并且设置有与电路板的导电焊盘相对应的导电材料。 因此，可以通过导电材料在电路板的导电焊盘之间形成导电路径，由此建立两个电路板之间的电连接。

公开(公告)号：US20080169265A1

公开(公告)日：2008-07-17

申请号：US11652663

申请日：2007-01-12

申请人： Tzu Chiao Huang ,  Chia Wei Chang

发明人： Tzu Chiao Huang ,  Chia Wei Chang

IPC分类号： B29C49/00

CPC分类号： B65D81/3211

摘要： A bottle allowing connection in series includes a bottle body having a mouth, a receiving section connected to and extended into an open bottom of the bottle body, and a passively movable opening device mounted in an upper portion of the receiving section and forward movable by a force applied thereto. A first bottle body may be serially connected at the mouth to the receiving section at the bottom of a second bottle body. When the first bottle body is turned relative to the second bottle body, the opening device in the receiving section of the second bottle body is moved forward to open a sealed top of the receiving section, allowing liquid contents in the two bottle bodies to be conveniently mixed without the need of a third container.

摘要翻译： 允许串联连接的瓶子包括具有口的瓶体，连接并延伸到瓶体的开口底部的容纳部分，以及安装在容纳部分的上部中的可被动地打开的装置， 施加力 第一瓶体可以在口处串联连接到第二瓶体的底部处的接收部分。 当第一瓶体相对于第二瓶体转动时，第二瓶体的容纳部分中的打开装置向前移动以打开容纳部分的密封顶部，从而使两个瓶体中的液体内容物方便 混合而不需要第三个容器。

公开(公告)号：US07328562B2

公开(公告)日：2008-02-12

申请号：US11317716

申请日：2005-12-23

申请人： Chia Wei Chang

发明人： Chia Wei Chang

IPC分类号： B68C3/00

CPC分类号： B68C3/00 ,  B68C2003/0041 ,  B68C2003/0091

摘要： A stirrup (210,310) includes a footrest (214,314) as well as a hanger (216,316) for suspending the stirrup from a saddle. A shock absorber (350) is provided for the footrest (314) and has passages (364) which allow the shock absorber to be tied to the footrest. Each of the passages (364) extends between two opposite surfaces of the shock absorber (350) and is made up of two tapering portions (374) which narrow in a direction away from the respective surfaces.

摘要翻译： 马镫（210,310）包括搁脚板（214,314）以及用于将马镫从鞍座上悬挂的悬挂器（216,316）。 为搁脚板（314）提供减震器（350），并具有通道（364），该通道允许减震器与搁脚板相连。 每个通道（364）在减震器（350）的两个相对的表面之间延伸，并且由两个锥形部分（374）构成，该锥形部分在远离各个表面的方向上变窄。