公开(公告)号：US06280907B1

公开(公告)日：2001-08-28

申请号：US09343514

申请日：1999-06-30

申请人： Chia-Tin Chung ,  Bin-Yuan Lin ,  Wun-Ku Wang ,  Wei-Chun Yang ,  Hsin-Herng Wang ,  Te-Yeu Su

发明人： Chia-Tin Chung ,  Bin-Yuan Lin ,  Wun-Ku Wang ,  Wei-Chun Yang ,  Hsin-Herng Wang ,  Te-Yeu Su

IPC分类号： G03F700

CPC分类号： H05K1/167 ,  H01C17/06586 ,  H05K1/095 ,  H05K3/048 ,  H05K2201/0317 ,  H05K2201/0391 ,  H05K2203/0191 ,  H05K2203/0264 ,  H05K2203/0568 ,  H05K2203/1453

摘要： A process is disclosed for forming resistors on a printed circuit substrate. The method includes the step of applying a photoresist layer onto substrate, and forming openings in the photoresist layer to expose the preselected regions for resistors, such that polymer thick resist pastes as well as resistive metallic films can be applied onto the substrate through these openings with precise geometry. The process according to the invention has higher accuracy and greater processing flexibility than the prior art processes where the resistor pastes are directly applied onto the substrate by screen printing.

摘要翻译： 公开了用于在印刷电路基板上形成电阻器的工艺。 该方法包括将光致抗蚀剂层施加到基底上的步骤，以及在光致抗蚀剂层中形成开口以暴露电阻器的预选区域，使得可以通过这些开口通过这些开口将聚合物厚的抗蚀剂浆料以及电阻金属膜施加到基底上， 精确几何。 根据本发明的方法具有比通过丝网印刷将电阻器浆料直接施加到基底上的现有技术方法更高的精度和更大的加工灵活性。

公开(公告)号：US6030553A

公开(公告)日：2000-02-29

申请号：US343515

申请日：1999-06-30

申请人： Hui-min Huang ,  Chia-Tin Chung ,  Bin-Yuan Lin ,  Hsin-Herng Wang ,  Wun-Ku Wang ,  Te-Yeu Su ,  Su-Jen Chang

发明人： Hui-min Huang ,  Chia-Tin Chung ,  Bin-Yuan Lin ,  Hsin-Herng Wang ,  Wun-Ku Wang ,  Te-Yeu Su ,  Su-Jen Chang

IPC分类号： C09D163/00 ,  C09D5/24 ,  H01C7/02 ,  H01C7/04 ,  H01B1/06 ,  H01B1/04

CPC分类号： H01C7/027 ,  H01C7/049 ,  Y10T29/49082

摘要： Polymer thick film resistor pastes with dimensionally stability and excellent processibility, such as coating, printing, and extruding, are disclosed. The resistor paste composition in accordance with the present invention comprises a low-k cycloaliphatic epoxy resin vehicle loaded with electrically conductive particles, a cationic photoinitiator, a thermal catalyst, and optionally a reactive diluent.

摘要翻译： 公开了具有尺寸稳定性和优异加工性的聚合物厚膜电阻器浆料，例如涂布，印刷和挤出。 根据本发明的电阻浆料组合物包含载有导电颗粒的低k脂环族环氧树脂载体，阳离子光引发剂，热催化剂和任选的反应性稀释剂。

公开(公告)号：US07575778B2

公开(公告)日：2009-08-18

申请号：US10913869

申请日：2004-08-07

申请人： Te-Yeu Su ,  Hsin-Herng Wang ,  Ying-Ti Chu ,  Chin-Ming Chu ,  Li-Chung Ping

发明人： Te-Yeu Su ,  Hsin-Herng Wang ,  Ying-Ti Chu ,  Chin-Ming Chu ,  Li-Chung Ping

IPC分类号： B05D5/12 ,  B05D3/12

CPC分类号： H01C7/005 ,  H01C17/06593 ,  H05K1/095 ,  H05K1/167 ,  H05K3/1233 ,  H05K2203/1453

摘要： The present invention teaches formulations, apparatus and a method of applying high thixotropic index polymer thick-film resistive pastes for making polymer thick-film resistors with improved tolerances by providing a squeegee with a blade tilted at an angle of 10° to 85° to the surface of the printed circuit board thus causing a fluid rotational motion within the bead of the polymer thick-film resistive paste as the squeegee blade moves relative to the printed circuit board. This rotational motion increases the shear strain rate experienced by the paste within the bead and results in a more effective filling of the resistor-shaped cavity without including air bubbles, experiencing elastic recovery of the paste and, without surface fractures of the paste.

摘要翻译： 本发明教导了施加高触变性折射率聚合物厚膜电阻浆料以制备具有改进的公差的聚合物厚膜电阻器的配方，设备和方法，其中提供了刮刀，其具有与10°至85°的角度倾斜 因此当刮板相对于印刷电路板移动时，印刷电路板的表面因此导致聚合物厚膜电阻浆料的珠粒内的流体旋转运动。 该旋转运动增加了焊道内的焊膏所经历的剪切应变速率，并且导致电阻器形状的空腔的更有效的填充，而不包括气泡，经历糊状物的弹性恢复，并且没有粘合剂的表面裂缝。

公开(公告)号：US20050051360A1

公开(公告)日：2005-03-10

申请号：US10913869

申请日：2004-08-07

申请人： Te-Yeu Su ,  Hsin-Herng Wang ,  Ying-Ti Chu ,  Chin-Ming Chu ,  Li-Chung Ping

发明人： Te-Yeu Su ,  Hsin-Herng Wang ,  Ying-Ti Chu ,  Chin-Ming Chu ,  Li-Chung Ping

IPC分类号： H01C7/00 ,  H01C17/065 ,  H05K1/09 ,  H05K1/16 ,  H05K3/12

CPC分类号： H01C7/005 ,  H01C17/06593 ,  H05K1/095 ,  H05K1/167 ,  H05K3/1233 ,  H05K2203/1453

摘要： The present invention teaches formulations, apparatus and a method of applying high thixotropic index polymer thick-film resistive pastes for making polymer thick-film resistors with improved tolerances by providing a squeegee with a blade tilted at an angle of 10 to 85 to the surface of the printed circuit board thus causing a fluid rotational motion within the bead of the polymer thick-film resistive paste as the squeegee blade moves relative to the printed circuit board. This rotational motion increases the shear strain rate experienced by the paste within the bead and results in a more effective filling of the resistor-shaped cavity without including air bubbles, experiencing elastic recovery of the paste and, without surface fractures of the paste.

摘要翻译： 本发明教导了施加高触变性折射率聚合物厚膜电阻浆料以制备具有改进的公差的聚合物厚膜电阻器的配方，设备和方法，其中提供了一个刮板，叶片以10至85°的角度倾斜到 因此当印刷电路板相对于印刷电路板移动时，导致聚合物厚膜电阻浆料的珠粒内的流体旋转运动。 该旋转运动增加了焊道内的焊膏所经历的剪切应变速率，并且导致电阻器形状的空腔的更有效的填充，而不包括气泡，经历糊状物的弹性恢复，并且没有粘合剂的表面裂缝。