公开(公告)号：US08749076B2

公开(公告)日：2014-06-10

申请号：US13704639

申请日：2011-06-10

申请人： Chiaki Okada ,  Kazuhiko Yamada ,  Yukari Inoue

发明人： Chiaki Okada ,  Kazuhiko Yamada ,  Yukari Inoue

IPC分类号： H01L23/29 ,  B44C1/17 ,  H05K1/03

CPC分类号： H01L23/295 ,  C08K3/08 ,  C09D5/24 ,  C09D7/61 ,  H01L24/29 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/83805 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The present invention relates to a resin paste composition including an organic compound, and a granular aluminum powder having an average particle diameter of from 2 to 10 μm and a flake-shaped silver powder having an average particle diameter of from 1 to 5 μm which are uniformly dispersed in the organic compound, and a semiconductor device manufactured by bonding a semiconductor element onto a supporting member through the resin paste composition and then encapsulating the resulting bonded product. According to the present invention, it is possible to provide a resin paste composition used for bonding an element such as semiconductor chips onto a lead frame which is excellent in not only electrical conductivity and bonding property but also working efficiency without using a large amount of rare and expensive silver, and a semiconductor device having a high productivity and a high reliability.

摘要翻译： 本发明涉及包含有机化合物的树脂糊剂组合物和平均粒径为2〜10μm的粒状铝粉末和平均粒径为1〜5μm的片状银粉末 均匀分散在有机化合物中，以及半导体器件，其通过树脂糊剂组合物将半导体元件粘合到支撑构件上，然后封装所得到的粘合产物。 根据本发明，可以提供一种用于将诸如半导体芯片的元件接合到引线框架上的树脂浆料组合物，其不仅导电性和接合性能优异，而且在不使用大量稀有金属的情况下也具有工作效率 和昂贵的银，以及具有高生产率和高可靠性的半导体器件。

公开(公告)号：US20130113121A1

公开(公告)日：2013-05-09

申请号：US13704639

申请日：2011-06-10

申请人： Chiaki Okada ,  Kazuhiko Yamada ,  Yukari Inoue

发明人： Chiaki Okada ,  Kazuhiko Yamada ,  Yukari Inoue

IPC分类号： C09J11/04 ,  H01L23/28

CPC分类号： H01L23/295 ,  C08K3/08 ,  C09D5/24 ,  C09D7/61 ,  H01L24/29 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/83805 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The present invention relates to a resin paste composition including an organic compound, and a granular aluminum powder having an average particle diameter of from 2 to 10 μm and a flake-shaped silver powder having an average particle diameter of from 1 to 5 μm which are uniformly dispersed in the organic compound, and a semiconductor device manufactured by bonding a semiconductor element onto a supporting member through the resin paste composition and then encapsulating the resulting bonded product. According to the present invention, it is possible to provide a resin paste composition used for bonding an element such as semiconductor chips onto a lead frame which is excellent in not only electrical conductivity and bonding property but also working efficiency without using a large amount of rare and expensive silver, and a semiconductor device having a high productivity and a high reliability.

摘要翻译： 本发明涉及一种包含有机化合物的树脂糊组合物和平均粒径为2〜10μm的平均粒径为1〜5μm的片状银粉，其为 均匀分散在有机化合物中，以及半导体器件，其通过树脂糊剂组合物将半导体元件粘合到支撑构件上，然后封装所得到的粘合产物。 根据本发明，可以提供一种用于将诸如半导体芯片的元件接合到引线框架上的树脂浆料组合物，其不仅导电性和接合性能优异，而且在不使用大量稀有金属的情况下也具有工作效率 和昂贵的银，以及具有高生产率和高可靠性的半导体器件。

公开(公告)号：US4985328A

公开(公告)日：1991-01-15

申请号：US410416

申请日：1989-09-21

申请人： Yuugo Kumagai ,  Ryouji Tan ,  Takashi Ikeda ,  Tetsuya Fujii ,  Chiaki Okada ,  Osamu Higashida ,  Hatuo Sugitani ,  Masato Fukasawa

发明人： Yuugo Kumagai ,  Ryouji Tan ,  Takashi Ikeda ,  Tetsuya Fujii ,  Chiaki Okada ,  Osamu Higashida ,  Hatuo Sugitani ,  Masato Fukasawa

IPC分类号： G03G9/09 ,  G03G9/097

CPC分类号： G03G9/09783 ,  G03G9/091 ,  Y10S430/104

摘要： A dry toner composition comprising (A) a binder resin, (B) a colorant and (C) charge control agents comprising a special metal complex of oxycarboxylic acid (C-1) and a special metal complex of azo compound (C-2) can provide high quality images without causing toner flying even after printed for a long period of time, and thus is useful for providing a dry developer and a process for forming images using said dry developer.