摘要:
A method for forming a light-transmitting region comprises providing a support feature. A sacrificial layer is formed over a portion of the support feature, wherein the sacrificial layer comprises an energy-induced swelling material. A light-blocking layer is conformably formed over the support feature to cover the sacrificial layer and the support feature. The support feature, the sacrificial layer, and the light-blocking layer are subjected to an energy source to swell the sacrificial layer until bursting to thereby delaminate a portion of the light-blocking layer from the support feature and leave a light-transmitting region exposed with a portion of the support feature in the light-blocking layer. A gas flow or scrub cleaning force is provided to clean up the light-transmitting region and a top surface of the light-blocking layer remains over the support feature.
摘要:
A method for forming a light-transmitting region comprises providing a support feature. A sacrificial layer is formed over a portion of the support feature, wherein the sacrificial layer comprises an energy-induced swelling material. A light-blocking layer is conformably formed over the support feature to cover the sacrificial layer and the support feature. The support feature, the sacrificial layer, and the light-blocking layer are subjected to an energy source to swell the sacrificial layer until bursting to thereby delaminate a portion of the light-blocking layer from the support feature and leave a light-transmitting region exposed with a portion of the support feature in the light-blocking layer. A gas flow or scrub cleaning force is provided to clean up the light-transmitting region and a top surface of the light-blocking layer remains over the support feature.
摘要:
Electronic device packages with electromagnetic compatibility (EMC) coating thereon are presented. An electronic device package includes a chip scale package having a CMOS image sensor (CIS) array chip and a set of lenses configured with an aperture. An encapsulation is molded overlying the chip scale package. A shield is atop the encapsulation. A frame fixes the set of lenses to the encapsulation. An electromagnetic compatibility (EMC) coating is formed on the encapsulation to prevent electromagnetic interference.
摘要:
Electronic device packages with electromagnetic compatibility (EMC) coating thereon are presented. An electronic device package includes a chip scale package having a CMOS image sensor (CIS) array chip and a set of lenses configured with an aperture. An encapsulation is molded overlying the chip scale package. A shield is atop the encapsulation. A frame fixes the set of lenses to the encapsulation. An electromagnetic compatibility (EMC) coating is formed on the encapsulation to prevent electromagnetic interference.
摘要:
A smoke filter includes a housing formed with an upper casing and a lower casing. A filtration passage with a bending section is formed between the upper casing and the lower casing and further, a replaceable filtration cloth device is provided in the interior of the housing and the filtration cloth of the replaceable filtration device passes through the filtration passage. By so designing, the smoke filter of this invention is able to increase a filtration area, enhance filtration efficiency and diminish the size of the housing and further, the smoke filter of this invention is simple in structure and convenient in maintenance and in replacement of the filtration cloth.
摘要:
A camera module and a fabrication method thereof are provided. The camera module includes a lens structure and an image sensor device chip disposed under the lens structure. The lens structure includes a transparent substrate and a lens disposed on the transparent substrate. A spacer is disposed on the transparent substrate to surround the lens, wherein the spacer contains a base pattern and a dry film photoresist. The method includes forming a base pattern on a carrier and attaching a dry film photoresist on the carrier. The dry film photoresist is planarized by a lamination process and then patterned to form a spacer. A transparent substrate having a plurality of lenses is provided. The spacer is stripped from the carrier, attaching on the transparent substrate to surround each of the lenses, and then bonded with image sensor device chips.
摘要:
A camera module is disclosed. The camera module includes an imager sensor device comprising a microlens array. A lens set overlies the imager sensor device. A dry film type photoresist spacer is interposed between the imager sensor device and the lens set, wherein the dry film type photoresist spacer has an opening above the microlens array. A fabrication method of the camera module is also disclosed.
摘要:
A dust bag positioning cylindrical member for a two-stage dust collecting machine is a cylindrical shape with an open upper end and an open lower end with a diameter a little less than that of a bag cylinder so that the dust bag positioning cylindrical member may be placed in and stabilize a dust bag previously placed in the bag cylinder. Thus the dust bag may not be blown to stick at the mouth of a first air exit during a second stage of dust collecting operation of the machine.
摘要:
A dust-sucking arm of an air cleaning machine includes two flexible ducts respectively connected between two rigid ducts and between one rigid duct and the wind-guiding opening. Three pivotal bases are assembled at the outer sides of the rigid ducts and the flexible ducts. Two parallel connecting rod units are respectively and pivotally assembled between two adjacent pivotal bases. One connecting rod of each parallel connecting rod unit is fixed with the relative rigid duct to actuate the rigid duct to move. Two pressure cylinders are respectively and pivotally installed between a connecting duct and the relative pivotal base, supporting the connecting rod unit. Two locking members are respectively installed between one connecting rod and the pivotal base, locking the connecting rod to stop the connecting rod unit.
摘要:
A remote controller for a big-horsepower wood-waste collecting machine includes an electromagnetic valve, an IC panel and an infrared remote controller. The electromagnetic valve is set between a main power source and a machine motor for properly controlling to pass or cut off the power. The IC panel is properly linked with the electromagnetic valve and has an infrared receiving circuit for receiving a remote signal. The infrared remote controller, separated from the machine, has an infrared transmitting circuit to transmit a remote signal. The IC panel can receive the remote signal to command the electromagnetic valve to pass or cut off the power.