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1.发明申请ELECTRONIC DEVICE PACKAGE WITH ELECTROMAGNETIC COMPATIBILITY (EMC) COATING THEREON 有权具有电磁兼容性（EMC）涂层的电子器件封装公开(公告)号：US20100006965A1
公开(公告)日：2010-01-14
申请号：US12170857
申请日：2008-07-10
IPC分类号： H01L31/0203
CPC分类号： H01L27/14618 , H01L27/14625 , H01L2224/0554 , H01L2224/05548 , H01L2224/05573 , H01L2224/13 , H01L2924/00014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Electronic device packages with electromagnetic compatibility (EMC) coating thereon are presented. An electronic device package includes a chip scale package having a CMOS image sensor (CIS) array chip and a set of lenses configured with an aperture. An encapsulation is molded overlying the chip scale package. A shield is atop the encapsulation. A frame fixes the set of lenses to the encapsulation. An electromagnetic compatibility (EMC) coating is formed on the encapsulation to prevent electromagnetic interference.
摘要翻译： 提供了具有电磁兼容性（EMC）涂层的电子器件封装。 一种电子器件封装包括具有CMOS图像传感器（CIS）阵列芯片的芯片级封装以及配置有孔径的一组透镜。 将封装模制在芯片级封装上。 屏蔽是封装的顶部。 一个框架将该组透镜固定到封装。 在封装上形成电磁兼容（EMC）涂层，以防止电磁干扰。
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2.发明授权Electronic device package with electromagnetic compatibility (EMC) coating thereon 有权具有电磁兼容性（EMC）涂层的电子器件封装公开(公告)号：US07964936B2
公开(公告)日：2011-06-21
申请号：US12170857
申请日：2008-07-10
IPC分类号： H01L23/552
CPC分类号： H01L27/14618 , H01L27/14625 , H01L2224/0554 , H01L2224/05548 , H01L2224/05573 , H01L2224/13 , H01L2924/00014 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Electronic device packages with electromagnetic compatibility (EMC) coating thereon are presented. An electronic device package includes a chip scale package having a CMOS image sensor (CIS) array chip and a set of lenses configured with an aperture. An encapsulation is molded overlying the chip scale package. A shield is atop the encapsulation. A frame fixes the set of lenses to the encapsulation. An electromagnetic compatibility (EMC) coating is formed on the encapsulation to prevent electromagnetic interference.
摘要翻译： 提供了具有电磁兼容性（EMC）涂层的电子器件封装。 一种电子器件封装包括具有CMOS图像传感器（CIS）阵列芯片的芯片级封装以及配置有孔径的一组透镜。 将封装模制在芯片级封装上。 屏蔽是封装的顶部。 一个框架将该组透镜固定到封装。 在封装上形成电磁兼容（EMC）涂层，以防止电磁干扰。
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公开(公告)号：US08355628B2
公开(公告)日：2013-01-15
申请号：US12399706
申请日：2009-03-06
IPC分类号： G03B17/02 , G03B13/34 , H01L31/0232
CPC分类号： G03B17/00 , H04N5/2253 , H04N5/2254 , H04N5/2257
摘要： The invention provides a compact camera module. The compact camera module includes an image sensing device, a set of optical elements, and a zooming device. The set of optical elements connects to the image sensing device, and comprises a lens set. The zooming device connects to the set of optical elements for adjusting a distance between the lens set and the image sensing device. The zooming device directly electrically joins with the image sensing device.
摘要翻译： 本发明提供了一种紧凑的相机模块。 紧凑型相机模块包括图像感测装置，一组光学元件和变焦装置。 该组光学元件连接到图像感测装置，并且包括透镜组。 变焦装置连接到一组光学元件，用于调整透镜组和图像感测装置之间的距离。 变焦装置与图像感测装置直接电连接。
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公开(公告)号：US08854526B2
公开(公告)日：2014-10-07
申请号：US12244431
申请日：2008-10-02
CPC分类号： H04N5/2252 , G03B17/00
摘要： The invention provides an image sensor device. The image sensor device includes a chip package and an opaque coating. The chip package includes an image sensor array chip, wherein a set of optical elements connect to the image sensor array chip, and an outer frame shielding the optical elements. The opaque coating overlies the outer frame.
摘要翻译： 本发明提供一种图像传感器装置。 图像传感器装置包括芯片封装和不透明涂层。 芯片封装包括图像传感器阵列芯片，其中一组光学元件连接到图像传感器阵列芯片，以及屏蔽光学元件的外部框架。 不透明涂层覆盖在外框架上。
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公开(公告)号：US09350906B2
公开(公告)日：2016-05-24
申请号：US12465092
申请日：2009-05-13
CPC分类号： H04N5/2254 , G03B19/00
摘要： The invention provides an encapsulant module for an image sensor device. The module includes an outer frame, a set of optical elements, and an opaque coating. The outer frame includes an enclosing wall and a first opening surrounded by the enclosing wall. The set of optical elements connects to and is disposed in the enclosing wall. The opaque coating overlies the enclosing wall.
摘要翻译： 本发明提供了一种用于图像传感器装置的密封剂模块。 该模块包括外框架，一组光学元件和不透明涂层。 外框包括封闭壁和由封闭壁包围的第一开口。 该组光学元件连接并设置在封闭壁中。 不透明涂层覆盖封闭壁。
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公开(公告)号：US20100085465A1
公开(公告)日：2010-04-08
申请号：US12244431
申请日：2008-10-02
IPC分类号： H04N5/225
CPC分类号： H04N5/2252 , G03B17/00
摘要： The invention provides an image sensor device. The image sensor device includes a chip package and an opaque coating. The chip package includes an image sensor array chip, wherein a set of optical elements connect to the image sensor array chip, and an outer frame shielding the optical elements. The opaque coating overlies the outer frame.
摘要翻译： 本发明提供一种图像传感器装置。 图像传感器装置包括芯片封装和不透明涂层。 芯片封装包括图像传感器阵列芯片，其中一组光学元件连接到图像传感器阵列芯片，以及屏蔽光学元件的外部框架。 不透明涂层覆盖在外框架上。
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公开(公告)号：US20090162967A1
公开(公告)日：2009-06-25
申请号：US12003186
申请日：2007-12-20
IPC分类号： H01L31/18
CPC分类号： H01L27/14623 , H01L27/14627 , H01L27/14685 , H01L27/14818
摘要： A method for forming a light-transmitting region comprises providing a support feature. A sacrificial layer is formed over a portion of the support feature, wherein the sacrificial layer comprises an energy-induced swelling material. A light-blocking layer is conformably formed over the support feature to cover the sacrificial layer and the support feature. The support feature, the sacrificial layer, and the light-blocking layer are subjected to an energy source to swell the sacrificial layer until bursting to thereby delaminate a portion of the light-blocking layer from the support feature and leave a light-transmitting region exposed with a portion of the support feature in the light-blocking layer. A gas flow or scrub cleaning force is provided to clean up the light-transmitting region and a top surface of the light-blocking layer remains over the support feature.
摘要翻译： 形成透光区域的方法包括提供支撑特征。 在支撑特征的一部分上形成牺牲层，其中牺牲层包括能量引起的膨胀材料。 在支撑特征上顺应地形成遮光层以覆盖牺牲层和支撑特征。 支撑特征，牺牲层和遮光层经受能量源以使牺牲层溶胀直到爆裂，从而使遮光层的一部分与支撑特征分层，并使透光区域暴露 其中一部分支撑特征在遮光层中。 提供气流或洗涤清洁力以清洁透光区域，并且遮光层的顶表面保留在支撑特征上。
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公开(公告)号：US07732244B2
公开(公告)日：2010-06-08
申请号：US12003186
申请日：2007-12-20
IPC分类号： H01L21/00
CPC分类号： H01L27/14623 , H01L27/14627 , H01L27/14685 , H01L27/14818
摘要： A method for forming a light-transmitting region comprises providing a support feature. A sacrificial layer is formed over a portion of the support feature, wherein the sacrificial layer comprises an energy-induced swelling material. A light-blocking layer is conformably formed over the support feature to cover the sacrificial layer and the support feature. The support feature, the sacrificial layer, and the light-blocking layer are subjected to an energy source to swell the sacrificial layer until bursting to thereby delaminate a portion of the light-blocking layer from the support feature and leave a light-transmitting region exposed with a portion of the support feature in the light-blocking layer. A gas flow or scrub cleaning force is provided to clean up the light-transmitting region and a top surface of the light-blocking layer remains over the support feature.
摘要翻译： 形成透光区域的方法包括提供支撑特征。 在支撑特征的一部分上形成牺牲层，其中牺牲层包括能量引起的膨胀材料。 在支撑特征上顺应地形成遮光层以覆盖牺牲层和支撑特征。 支撑特征，牺牲层和遮光层经受能量源以使牺牲层溶胀直到爆裂，从而使遮光层的一部分与支撑特征分层，并使透光区域暴露 其中一部分支撑特征在遮光层中。 提供气流或洗涤清洁力以清洁透光区域，并且遮光层的顶表面保留在支撑特征上。
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公开(公告)号：US09855523B2
公开(公告)日：2018-01-02
申请号：US14965032
申请日：2015-12-10
申请人： Chieh-Yuan Cheng
发明人： Chieh-Yuan Cheng
CPC分类号： B01D46/18 , B01D39/08 , B01D46/185 , B01D46/44 , B01D2239/06
摘要： A smoke filter includes a housing formed with an upper casing and a lower casing. A filtration passage with a bending section is formed between the upper casing and the lower casing and further, a replaceable filtration cloth device is provided in the interior of the housing and the filtration cloth of the replaceable filtration device passes through the filtration passage. By so designing, the smoke filter of this invention is able to increase a filtration area, enhance filtration efficiency and diminish the size of the housing and further, the smoke filter of this invention is simple in structure and convenient in maintenance and in replacement of the filtration cloth.
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公开(公告)号：US09075182B2
公开(公告)日：2015-07-07
申请号：US13152690
申请日：2011-06-03
申请人： Chieh-Yuan Cheng , Hung-Yeh Lin
发明人： Chieh-Yuan Cheng , Hung-Yeh Lin
IPC分类号： H01L27/146 , G03B17/12 , G02B7/02 , G02B7/00
CPC分类号： H01L27/14685 , G02B7/003 , G02B7/02 , G02B7/021 , G03B17/12 , H01L27/14618 , H01L27/14625 , H01L27/14687 , H01L2924/0002 , H01L2924/00
摘要： A camera module and a fabrication method thereof are provided. The camera module includes a lens structure and an image sensor device chip disposed under the lens structure. The lens structure includes a transparent substrate and a lens disposed on the transparent substrate. A spacer is disposed on the transparent substrate to surround the lens, wherein the spacer contains a base pattern and a dry film photoresist. The method includes forming a base pattern on a carrier and attaching a dry film photoresist on the carrier. The dry film photoresist is planarized by a lamination process and then patterned to form a spacer. A transparent substrate having a plurality of lenses is provided. The spacer is stripped from the carrier, attaching on the transparent substrate to surround each of the lenses, and then bonded with image sensor device chips.
摘要翻译： 提供了相机模块及其制造方法。 相机模块包括透镜结构和设置在透镜结构下方的图像传感器装置芯片。 透镜结构包括透明基板和设置在透明基板上的透镜。 间隔件设置在透明基板上以围绕透镜，其中间隔件包含基底图案和干膜光致抗蚀剂。 该方法包括在载体上形成基底图案并在载体上附着干膜光致抗蚀剂。 通过层压方法对干膜光致抗蚀剂进行平面化，然后将其图案化以形成间隔物。 提供具有多个透镜的透明基板。 间隔件从载体剥离，附着在透明基板上以围绕每个透镜，然后与图像传感器装置芯片粘合。
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