Method of fabricating inductor and structure formed therefrom
    1.
    发明授权
    Method of fabricating inductor and structure formed therefrom 有权
    制造电感器及其结构的方法

    公开(公告)号:US07167072B2

    公开(公告)日:2007-01-23

    申请号:US10810435

    申请日:2004-03-25

    IPC分类号: H01F5/00 H01F27/28

    摘要: An inductor formed on a substrate having a dielectric layer thereon is disclosed. The inductor includes a first inductor pattern, a second inductor pattern a third inductor pattern. The first inductor pattern is formed within the dielectric layer, the second inductor pattern is formed on the first inductor pattern and electrically connected thereto, and the third inductor pattern is formed on the second inductor pattern and electrically connected thereto, wherein the first inductor pattern, the second inductor pattern, and the third inductor pattern have similar pattern. Because the thickness of the inductor can be increased by forming a multi-layer inductor structure, the resistance of the inductor, therefore, is reduced.

    摘要翻译: 公开了一种在其上具有介电层的基板上形成的电感器。 电感器包括第一电感器图案,第二电感器图案,第三电感器图案。 第一电感器图案形成在电介质层内,第二电感器图案形成在第一电感器图案上并与之电连接,并且第三电感器图案形成在第二电感器图案上并与其电连接,其中第一电感器图案, 第二电感器图案和第三电感器图案具有相似的图案。 因为通过形成多层电感器结构可以增加电感器的厚度,因此电感器的电阻降低。

    Method of fabricating inductor and structure formed therefrom
    2.
    发明申请
    Method of fabricating inductor and structure formed therefrom 有权
    制造电感器及其结构的方法

    公开(公告)号:US20050212641A1

    公开(公告)日:2005-09-29

    申请号:US10810435

    申请日:2004-03-25

    IPC分类号: H01F5/00 H01F41/04

    摘要: An inductor formed on a substrate having a dielectric layer thereon is disclosed. The inductor includes a first inductor pattern, a second inductor pattern a third inductor pattern. The first inductor pattern is formed within the dielectric layer, the second inductor pattern is formed on the first inductor pattern and electrically connected thereto, and the third inductor pattern is formed on the second inductor pattern and electrically connected thereto, wherein the first inductor pattern, the second inductor pattern, and the third inductor pattern have similar pattern. Because the thickness of the inductor can be increased by forming a multi-layer inductor structure, the resistance of the inductor, therefore, is reduced.

    摘要翻译: 公开了一种在其上具有介电层的基板上形成的电感器。 电感器包括第一电感器图案,第二电感器图案,第三电感器图案。 第一电感器图案形成在电介质层内,第二电感器图案形成在第一电感器图案上并与之电连接,并且第三电感器图案形成在第二电感器图案上并与其电连接,其中第一电感器图案, 第二电感器图案和第三电感器图案具有相似的图案。 因为通过形成多层电感器结构可以增加电感器的厚度,因此电感器的电阻降低。

    Structure and fabrication method of electrostatic discharge protection circuit
    6.
    发明授权
    Structure and fabrication method of electrostatic discharge protection circuit 有权
    静电放电保护电路的结构与制造方法

    公开(公告)号:US07253480B2

    公开(公告)日:2007-08-07

    申请号:US10951373

    申请日:2004-09-28

    IPC分类号: H01L23/62

    摘要: A structure of an electrostatic discharge protection circuit, in which a buried layer is formed in the substrate of the electrostatic discharge protection circuit, and a sinker layer electrically connected to the buried layer and a drain is also formed therein. Thereby, when the electrostatic discharge protection circuit is activated, the current flows from a source through the buried layer and the sinker layer to the drain. The current flow path is remote from the gate dielectric layer to avoid damaging the gate dielectric by a large current, so as to improve the dielectric strength of the electrostatic discharge protection circuit.

    摘要翻译: 静电放电保护电路的结构,其中在静电放电保护电路的基板中形成掩埋层,以及与埋层电连接的沉降片和漏极。 因此,当静电放电保护电路被激活时,电流从源极通过掩埋层和沉降片流向漏极。 电流流动路径远离栅介质层,以避免大电流损坏栅极电介质,从而提高静电放电保护电路的绝缘强度。

    METHOD FOR PRODUCING LAYOUT OF SEMICONDUCTOR INTEGRATED CIRCUIT WITH RADIO FREQUENCY DEVICES
    10.
    发明申请
    METHOD FOR PRODUCING LAYOUT OF SEMICONDUCTOR INTEGRATED CIRCUIT WITH RADIO FREQUENCY DEVICES 审中-公开
    用无线电频率设备生产半导体集成电路布局的方法

    公开(公告)号:US20080200132A1

    公开(公告)日:2008-08-21

    申请号:US11675409

    申请日:2007-02-15

    IPC分类号: H04B1/44

    CPC分类号: G06F17/5063

    摘要: A method for producing an IC layout with radio frequency devices is provided. The method has following steps. Type information of at least one RF device is inputted, and at least one RF parameter corresponding to the RF device is inputted as well. A frequency response result is then generated based on the type information and the RF parameter. When the frequency response result meets the required specification, an IC layout process is performed based on the frequency response result. However, when the frequency response result doesn't meet the required specification, another RE parameter is inputted again to produce new frequency response result.

    摘要翻译: 提供了一种用射频设备制造IC布局的方法。 该方法具有以下步骤。 输入至少一个RF设备的类型信息,并且还输入与RF设备相对应的至少一个RF参数。 然后基于类型信息和RF参数生成频率响应结果。 当频率响应结果满足要求规格时,基于频率响应结果执行IC布局处理。 然而,当频率响应结果不满足所需规格时,再次输入另一个RE参数以产生新的频率响应结果。