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公开(公告)号：US07572033B2
公开(公告)日：2009-08-11
申请号：US11857400
申请日：2007-09-18
Applicant: Chih-Hsien Sun , Cheng-Wei Chang
Inventor： Chih-Hsien Sun , Cheng-Wei Chang
CPC classification number: F21V29/74 , F21V29/004 , F21V29/51 , F21V29/763 , F21Y2115/10 , H01L2924/0002 , H05K1/0203 , H05K1/182 , H05K7/205 , H01L2924/00
Abstract: An exemplary light source module includes a printed circuit board (PCB), a heat-dissipating assembly, and a number of light emitting elements. The PCB includes a first surface, an opposite second surface, and a number of through holes. The heat-dissipating assembly is located adjacent to the second surface and includes a base, a number of heat-conducting elements, and a number of heat dissipation fins. The base includes a third surface defining a number of cavities therein and an opposite fourth surface. The heat dissipation fins extend from the fourth surface. Each of the heat-conducting elements is inlaid in a corresponding cavity. Each of the light emitting elements is placed in a corresponding through hole and thermally contacts a corresponding heat-conducting element. Each light emitting element electrically connects with the PCB and defines a respective light emitting surface located outside the corresponding through hole.
Abstract translation: 示例性的光源模块包括印刷电路板（PCB），散热组件和多个发光元件。 PCB包括第一表面，相对的第二表面和多个通孔。 散热组件位于第二表面附近，并且包括底座，多个导热元件和多个散热翅片。 底座包括在其中限定多个空腔的第三表面和相对的第四表面。 散热片从第四表面延伸。 每个导热元件镶嵌在相应的空腔中。 每个发光元件被放置在相应的通孔中并与相应的导热元件热接触。 每个发光元件与PCB电连接并且限定位于相应通孔外部的相应的发光表面。
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公开(公告)号：US07537379B2
公开(公告)日：2009-05-26
申请号：US11309233
申请日：2006-07-14
Applicant: Tay-Jian Liu , Chih-Hsien Sun , Chao-Nien Tung , Chuen-Shu Hou , Keng-Han Liu
Inventor： Tay-Jian Liu , Chih-Hsien Sun , Chao-Nien Tung , Chuen-Shu Hou , Keng-Han Liu
CPC classification number: G01K1/143 , F28F2200/005 , G01K17/00
Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling the heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is located between the immovable portion and the movable portion for receiving the heat pipe therein. A positioning structure extends from at least one of the immovable portion and the movable portion for avoiding the movable portion from deviating from the immovable portion during movement of the movable portion relative the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for detecting temperature of the heat pipe.
Abstract translation: 用于热管的性能测试装置包括具有限定在其中的用于冷却需要测试的热管的冷却结构的不可移动部分。 可移动部分能够相对于不可移动部分移动并且具有限定在其中的冷却结构以冷却热管。 接收结构位于不可移动部分和可移动部分之间，用于在其中容纳热管。 定位结构从可移动部分和可移动部分中的至少一个延伸，用于在可移动部分相对于不可移动部分移动期间避免可移动部分偏离不动部分，以确保接收结构能够精确地接收热管 。 至少一个温度传感器连接到不可移动部分和可移动部分中的至少一个，用于检测热管的温度。
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公开(公告)号：US07530734B2
公开(公告)日：2009-05-12
申请号：US11308548
申请日：2006-04-05
Applicant: Tay-Jian Liu , Chih-Hsien Sun , Chao-Nien Tung , Chuen-Shu Hou
Inventor： Tay-Jian Liu , Chih-Hsien Sun , Chao-Nien Tung , Chuen-Shu Hou
CPC classification number: F28D15/02 , F28F2200/005
Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe needing to be tested. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion. The least a temperature sensor has a detecting section exposed in the receiving structure for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.
Abstract translation: 用于热管的性能测试装置包括具有限定在其中的用于冷却需要测试的热管的冷却结构的不可移动部分。 可移动部分能够相对于不可移动部分移动。 在不可移动部分和可移动部分之间限定接收结构，用于在其中接收热管。 至少一个温度传感器连接到不可移动部分和可移动部分中的至少一个。 至少一个温度传感器具有暴露在接收结构中的检测部分，用于热接触接收结构中的热管以检测热管的温度。
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公开(公告)号：US20090097265A1
公开(公告)日：2009-04-16
申请号：US12057699
申请日：2008-03-28
Applicant: Chih-Hsien Sun , Ching-Chung Nien , Hung-Kuang Hsu
Inventor： Chih-Hsien Sun , Ching-Chung Nien , Hung-Kuang Hsu
IPC: F21V29/00
CPC classification number: F21V29/51 , F21V29/763 , F21Y2115/10 , F28D15/0233 , F28D15/0275 , F28F1/12 , F28F21/084 , F28F21/085 , H01L2924/0002 , H01L2924/00
Abstract: The light source module (10) includes a circuit board (11), a heat dissipating module (13) and a plurality of light emitting members (121). The circuit board defines a first surface 112 for supporting the plurality of light emitting members and an opposite second surface (114) for supporting the heat dissipation module. The heat dissipating module includes a base (1312), a plurality of heat dissipation fins (1313) and a plurality of heat pipes (132). The base has a top surface (1316) and an opposite bottom surface (1315). The plurality of heat dissipation fins are protruded upwardly from the top surface of the base. A plurality of grooves (1314) are defined in the bottom surface of the base. The heat pipes are received in the plurality of grooves of the base respectively. Each of the heat pipes includes a flat sidewall (1321) and an arc-shaped sidewall (1322).
Abstract translation: 光源模块（10）包括电路板（11），散热模块（13）和多个发光元件（121）。 电路板限定用于支撑多个发光构件的第一表面112和用于支撑散热模块的相对的第二表面（114）。 散热模块包括基座（1312），多个散热翅片（1313）和多个热管（132）。 底座具有顶表面（1316）和相对的底表面（1315）。 多个散热片从基座的顶面向上突出。 多个槽（1314）限定在底座的底面上。 热管分别容纳在基座的多个槽中。 每个热管包括平坦侧壁（1321）和弧形侧壁（1322）。
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公开(公告)号：US07594749B2
公开(公告)日：2009-09-29
申请号：US11309234
申请日：2006-07-14
Applicant: Tay-Jian Liu , Chao-Nien Tung , Chuen-Shu Hou , Chih-Hsien Sun , Hui-Fu Lee
Inventor： Tay-Jian Liu , Chao-Nien Tung , Chuen-Shu Hou , Chih-Hsien Sun , Hui-Fu Lee
CPC classification number: G01K1/143 , F28F2200/005 , G01K17/00
Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion for avoiding the movable portion from deviating from the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion to detect a temperature of the heat pipe.
Abstract translation: 用于热管的性能测试装置包括具有限定在其中的用于冷却需要测试的热管的冷却结构的不可移动部分。 可移动部分能够相对于不可移动部分移动并且具有限定在其中的冷却结构以冷却热管。 在不可移动部分和可移动部分之间限定接收结构，用于在其中接收热管。 在不动部和可动部中限定有凹凸配合结构，用于避免可动部偏离不动部，确保接收结构能够精确地接收热管。 至少一个温度传感器连接到不可移动部分和可移动部分中的至少一个，以检测热管的温度。
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Patent Agency Ranking
公开(公告)号：US07553073B2
公开(公告)日：2009-06-30
申请号：US11309390
申请日：2006-08-03
Applicant: Tay-Jian Liu , Chao-Nien Tung , Chuen-Shu Hou , Chih-Hsien Sun
Inventor： Tay-Jian Liu , Chao-Nien Tung , Chuen-Shu Hou , Chih-Hsien Sun
CPC classification number: F28D15/0283 , F28F2200/005
Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe, and a movable portion capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space therein for movement of the movable portion relative to the immovable portion.
Abstract translation: 一种用于热管的性能测试装置包括一个不可移动部分，其具有位于其中的用于加热热管的蒸发部分的加热部件和能够相对于该不动部移动的可移动部分。 在不可移动部分和可移动部分之间限定接收结构，用于接收热管的蒸发部分。 在不动部和可动部中限定有凹凸配合结构，以确保接收结构能够精确地接收热管。 温度传感器连接到不动部分和可移动部分，用于检测热管的温度。 外壳将不可移动部分和可移动部分包围在其中，并且在其中限定可移动部分相对于不可移动部分移动的空间。
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公开(公告)号：US07553072B2
公开(公告)日：2009-06-30
申请号：US11309223
申请日：2006-07-13
Applicant: Tay-Jian Liu , Chao-Nien Tung , Chih-Hsien Sun , Chuen-Shu Hou , Cheng-Chi Lee
Inventor： Tay-Jian Liu , Chao-Nien Tung , Chih-Hsien Sun , Chuen-Shu Hou , Cheng-Chi Lee
CPC classification number: G01K1/143 , F28F2200/005
Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. At least one temperature sensor is attached to at least one of the immovable portion and the movable portion. The least one temperature sensor has a detecting section exposed in the receiving structure for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.
Abstract translation: 一种用于热管的性能测试装置包括具有位于其中的用于加热需要测试的热管的加热构件的不可移动部分。 可移动部分能够相对于不可移动部分移动。 在不可移动部分和可移动部分之间限定接收结构，用于在其中接收热管。 至少一个温度传感器附接到不可移动部分和可移动部分中的至少一个。 至少一个温度传感器具有暴露在接收结构中的检测部分，用于热接收接收结构中的热管以检测热管的温度。
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公开(公告)号：US07517142B2
公开(公告)日：2009-04-14
申请号：US11309186
申请日：2006-07-07
Applicant: Tay-Jian Liu , Chao-Nien Tung , Chih-Hsien Sun , Chuen-Shu Hou , Cheng-Hui Lin
Inventor： Tay-Jian Liu , Chao-Nien Tung , Chih-Hsien Sun , Chuen-Shu Hou , Cheng-Hui Lin
CPC classification number: F28D15/02 , F28F2200/005
Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe requiring to be tested. A movable portion is capable of moving relative to the immovable portion and has a cooling structure therein for cooling the heat pipe. A receiving structure is located between the immovable portion and the movable portion for receiving the heat pipe therein. At least one temperature sensor is attached to at least one of the immovable portion and the movable portion. The least one temperature sensor has a detecting section exposed in the receiving structure for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.
Abstract translation: 用于热管的性能测试装置包括具有限定在其中的用于冷却需要测试的热管的冷却结构的不可移动部分。 可移动部分能够相对于不可移动部分移动并且在其中具有用于冷却热管的冷却结构。 接收结构位于不可移动部分和可移动部分之间，用于在其中容纳热管。 至少一个温度传感器附接到不可移动部分和可移动部分中的至少一个。 至少一个温度传感器具有暴露在接收结构中的检测部分，用于热接收接收结构中的热管以检测热管的温度。
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公开(公告)号：US20070137321A1
公开(公告)日：2007-06-21
申请号：US11309331
申请日：2006-07-27
Applicant: Tay-Jian Liu , Chao-Nien Tung , Chuen-Shu Hou , Chih-Hsien Sun , Hui-Fu Lee
Inventor： Tay-Jian Liu , Chao-Nien Tung , Chuen-Shu Hou , Chih-Hsien Sun , Hui-Fu Lee
IPC: G01M19/00
CPC classification number: F28D15/02 , F28F2200/005
Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling the heat pipe. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable portion and the movable portion to detect a temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space for movement of the movable portion relative to the immovable portion.
Abstract translation: 一种用于热管的性能测试装置包括具有限定在其中用于冷却热管的冷却结构的不可移动部分。 可移动部分能够相对于不可移动部分移动并且具有限定在其中的冷却结构以冷却热管。 在不可移动部分和可移动部分之间限定接收结构，用于在其中接收热管。 在不动部和可动部中限定有凹凸配合结构，以确保接收结构能够精确地接收热管。 温度传感器附接到不动部和可动部，以检测热管的温度。 外壳将不可移动部分和可移动部分包围在其中，并且限定可移动部分相对于不可移动部分移动的空间。
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公开(公告)号：US07665508B2
公开(公告)日：2010-02-23
申请号：US11309261
申请日：2006-07-20
Applicant: Tay-Jian Liu , Chao-Nien Tung , Chuen-Shu Hou , Chih-Hsien Sun
Inventor： Tay-Jian Liu , Chao-Nien Tung , Chuen-Shu Hou , Chih-Hsien Sun
CPC classification number: F28D15/0266 , F28D15/04 , F28F13/06
Abstract: A heat pipe includes a pipe containing phase changeable working media therein. A wick structure is located on an inner face of the pipe. A space is surrounded by the wick structure in the pipe. At least one muzzle with an inlet and an outlet is positioned inside the pipe; the inlet and the outlet are deferent in radius thereof.
Abstract translation: 热管包括其中包含相变工作介质的管。 芯结构位于管的内表面上。 管道中的灯芯结构包围着一个空间。 具有入口和出口的至少一个枪口位于管内; 入口和出口的半径不同。
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