Process of manufacturing DOPO derivatives for printed circuit board and low-earth orbit spacecraft applications
    1.
    发明申请
    Process of manufacturing DOPO derivatives for printed circuit board and low-earth orbit spacecraft applications 审中-公开
    制造用于印刷电路板和低地球轨道航天器应用的DOPO衍生物的方法

    公开(公告)号:US20080021193A1

    公开(公告)日:2008-01-24

    申请号:US11819617

    申请日:2007-06-28

    Abstract: A method of manufacturing new materials for a printed circuit board and Low-Earth Orbit (LEO) spacecraft is provided. The present invention includes dinitro, diamine, various phosphorous-containing polyimides and polyamides, and synthesizing methods thereof. The polymers of the embodiment of present invention exhibit good flame retardancy, high glass transition temperature, good mechanical properties and superior oxygen resistance, so they are good materials for Low-Earth Orbit applications. Besides, these polymers can also be used as matrix for halogen-free flexible printed circuit board.

    Abstract translation: 提供了制造印刷电路板和低地轨道(LEO)航天器新材料的方法。 本发明包括二硝基二胺,各种含磷聚酰亚胺和聚酰胺及其合成方法。 本发明实施方案的聚合物显示出良好的阻燃性,高玻璃化转变温度,良好的机械性能和优异的耐氧性,因此它们是用于低地球轨道应用的良好材料。 此外,这些聚合物也可以用作无卤柔性印刷电路板的基质。

    Processes of synthesizing multi-functional phosphorus-containing epoxy curing agent
    5.
    发明授权
    Processes of synthesizing multi-functional phosphorus-containing epoxy curing agent 有权
    合成多功能含磷环氧固化剂的工艺

    公开(公告)号:US08822723B2

    公开(公告)日:2014-09-02

    申请号:US13103046

    申请日:2011-05-07

    CPC classification number: C07F9/657172 C07F9/65719

    Abstract: A series of curing agents are provided. The curing agents are multi-functional and phosphorus-containing. The curing agents have excellent processability to be used as an epoxy resin curing agent. The curing agents can be cured to obtain a phosphorus-containing epoxy thermoset with flame retardancy characteristic. The epoxy thermosets are very fit for circuit board substrate having high glass transition temperature; semiconductor packaging material; and related materials.

    Abstract translation: 提供一系列固化剂。 固化剂是多功能和含磷的。 固化剂具有优异的加工性能,可用作环氧树脂固化剂。 固化剂可以固化,得到具有阻燃特性的含磷环氧热固性材料。 环氧热固性材料非常适合具有高玻璃化转变温度的电路板基材; 半导体封装材料; 和相关材料。

    Manufacture of novel epoxy resins semi-thermosets and their high TG thermosets for electronic applications
    8.
    发明授权
    Manufacture of novel epoxy resins semi-thermosets and their high TG thermosets for electronic applications 有权
    制造新型环氧树脂半热固性材料及其高TG热固性材料用于电子应用

    公开(公告)号:US08058362B2

    公开(公告)日:2011-11-15

    申请号:US12388996

    申请日:2009-02-19

    CPC classification number: C07F9/657172 C08G59/304 C08L63/00 H05K1/0326

    Abstract: An active-hydrogen-containing (carboxyl or hydroxyl) phosphorus compound is provided. An epoxy resin semi-thermoset formed by bonding the phosphorus compound to an epoxy group is also provided. A flame-retardant epoxy resin thermoset is formed after reacting the epoxy resin semi-thermoset with a curing agent. The epoxy resin thermoset possesses excellent flame retardancy, heat stability, and high glass transition temperature (Tg), does not produce toxic and corrosive fumes during combustion, and thus is an environmentally friendly flame-retardant material.

    Abstract translation: 提供含活性氢(羧基或羟基)的磷化合物。 还提供了通过将磷化合物键合到环氧基团而形成的半热固性环氧树脂。 在环氧树脂半热固化剂与固化剂反应之后形成阻燃环氧树脂热固性材料。 环氧树脂热固性材料具有优异的阻燃性,热稳定性和高玻璃化转变温度(Tg),在燃烧过程中不产生有毒和腐蚀性烟雾,因此是环保型阻燃材料。

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