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公开(公告)号：US08100558B2
公开(公告)日：2012-01-24
申请号：US12688520
申请日：2010-01-15
申请人： Ching-Lin Tseng , Ming-Li Chang , Cheng-Chieh Lin
发明人： Ching-Lin Tseng , Ming-Li Chang , Cheng-Chieh Lin
IPC分类号： F21V21/00
CPC分类号： H05K1/021 , F21K9/00 , F21V29/70 , F21Y2105/10 , F21Y2115/10 , H05K1/142 , H05K3/0061 , H05K3/202 , H05K3/281 , H05K2201/10106 , H05K2201/10409 , H05K2201/10924 , H05K2203/063
摘要： A lighting device includes: at least one lighting module including a lead frame and a plurality of light emitting diodes packaged on the lead frame; an upper plate disposed on the lead frame, and having at least one perforated region formed with a plurality of through-holes for extension of the light emitting diodes therethrough, and at least two conductor regions respectively provided on two sides of the perforated region, the conductor regions being connected electrically to the lead frame; a heat sink disposed below the lead frame; and a plurality of fasteners fastening the lighting module to the upper plate and the heat sink such that the heat sink is in tight contact with bottom ends of the light emitting diodes.
摘要翻译： 照明装置包括：至少一个照明模块，包括引线框架和封装在引线框架上的多个发光二极管; 设置在所述引线框架上的上板，并且具有形成有用于使所述发光二极管延伸的多个通孔的至少一个穿孔区域，以及分别设置在所述穿孔区域的两侧上的至少两个导体区域， 导体区域与引线框架电连接; 布置在引线框架下方的散热器; 以及将照明模块固定到上板和散热器的多个紧固件，使得散热器与发光二极管的底端紧密接触。
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公开(公告)号：US20100181890A1
公开(公告)日：2010-07-22
申请号：US12688520
申请日：2010-01-15
申请人： Ching-Lin Tseng , Ming-Li Chang , Cheng-Chieh Lin
发明人： Ching-Lin Tseng , Ming-Li Chang , Cheng-Chieh Lin
CPC分类号： H05K1/021 , F21K9/00 , F21V29/70 , F21Y2105/10 , F21Y2115/10 , H05K1/142 , H05K3/0061 , H05K3/202 , H05K3/281 , H05K2201/10106 , H05K2201/10409 , H05K2201/10924 , H05K2203/063
摘要： A lighting device includes: at least one lighting module including a lead frame and a plurality of light emitting diodes packaged on the lead frame; an upper plate disposed on the lead frame, and having at least one perforated region formed with a plurality of through-holes for extension of the light emitting diodes therethrough, and at least two conductor regions respectively provided on two sides of the perforated region, the conductor regions being connected electrically to the lead frame; a heat sink disposed below the lead frame; and a plurality of fasteners fastening the lighting module to the upper plate and the heat sink such that the heat sink is in tight contact with bottom ends of the light emitting diodes.
摘要翻译： 照明装置包括：至少一个照明模块，包括引线框架和封装在引线框架上的多个发光二极管; 设置在所述引线框架上的上板，并且具有形成有用于使所述发光二极管延伸的多个通孔的至少一个穿孔区域，以及分别设置在所述穿孔区域的两侧上的至少两个导体区域， 导体区域与引线框架电连接; 布置在引线框架下方的散热器; 以及将照明模块固定到上板和散热器的多个紧固件，使得散热器与发光二极管的底端紧密接触。
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公开(公告)号：US20080061314A1
公开(公告)日：2008-03-13
申请号：US11852962
申请日：2007-09-10
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01322 , H01L2924/3011 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： A light emitting device includes: a heat dissipating unit including a metallic first heat sink having a chip-mounting area, a thermally conductive bonding layer, and a metallic second heat sink overlapping and attached to the first heat sink through the bonding layer such that the bonding layer is sandwiched between the first and second heat sinks, the heat dissipating unit being formed with a light exit window that is aligned with the chip-mounting area and that extends through the second heat sink and the bonding layer so as to expose the chip-mounting area; a light emitting chip attached to the chip-mounting area of the first heat sink for emitting light through the light exit window; and a transparent enclosing material filling the light exit window to enclose the light emitting chip.
摘要翻译： 发光装置包括：散热单元，包括具有芯片安装区域的金属第一散热器，导热接合层和金属第二散热器，所述金属第二散热器通过接合层重叠并附接到第一散热器，使得 粘结层被夹在第一和第二散热器之间，散热单元形成有与出口窗口对齐的光出射窗口，该出口窗口延伸穿过第二散热器和接合层，从而使芯片 安装区域 发光芯片，其附接到第一散热器的芯片安装区域，用于通过光出射窗口发射光; 以及填充光出射窗口以包围发光芯片的透明封闭材料。
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公开(公告)号：US20090010011A1
公开(公告)日：2009-01-08
申请号：US12216407
申请日：2008-07-03
申请人： Ching-Lin Tseng , Ming-Li Chang
发明人： Ching-Lin Tseng , Ming-Li Chang
IPC分类号： F21V29/00
CPC分类号： H01L33/64 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/19107 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A solid state lighting device includes a heat-dissipating base, a diode chip, and a plurality of conductive terminals. The heat-dissipating base includes a base body formed integrally from a thermally conductive material. The base body has a top side, and is formed with a cavity that is indented from the top side. The base body further has a plurality of terminal channels, each of which extends from the cavity to an exterior of the base body. The diode chip is disposed in the cavity. Each of the conductive terminals extends through a respective one of the terminal channels, and has a first connecting part that is disposed in the cavity and that is coupled electrically to the diode chip, and a second connecting part that is disposed outwardly of the heat-dissipating base.
摘要翻译： 固态照明装置包括散热基座，二极管芯片和多个导电端子。 散热基座包括由导热材料一体地形成的基体。 基体具有顶侧，并且形成有从顶侧缩进的空腔。 基体还具有多个端子通道，每个端子通道从空腔延伸到基体的外部。 二极管芯片设置在空腔中。 每个导电端子延伸通过相应的一个端子通道，并且具有设置在空腔中并且电连接到二极管芯片的第一连接部分，以及设置在散热片外侧的第二连接部件， 消散基地
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公开(公告)号：US20070217195A1
公开(公告)日：2007-09-20
申请号：US11619704
申请日：2007-01-04
IPC分类号： F21V14/00
CPC分类号： H01L33/58 , G02B19/0028 , G02B19/0061 , G02B19/0071 , H01L33/60
摘要： A lens includes a lens body having a bottom surface, a reflective surface, and a refractive surface. The bottom surface is to be disposed proximate to a light-emitting component. The reflective surface is disposed opposite to the bottom surface along a lens axis, and reflects a first portion of the light provided by the light-emitting component that is incident thereon toward the refractive surface. The refractive surface extends from an edge of the reflective surface to the bottom surface, and refracts a second portion of the light provided by the light-emitting component that is incident thereon as well as the first portion of the light reflected by the reflective surface theretoward in sideward directions relative to the light-emitting component. The lens body has cross-sections transverse to the lens axis, sizes of which increase gradually from a junction of the reflective surface and the refractive surface toward the bottom surface.
摘要翻译： 透镜包括具有底表面，反射表面和折射表面的透镜体。 底表面将靠近发光部件设置。 反射面沿着透镜轴线与底面相对设置，并且将由入射到其上的发光部件提供的光的第一部分反射到折射面。 折射表面从反射表面的边缘延伸到底表面，并且折射由入射到其上的发光部件提供的光的第二部分以及由反射表面反射的光的第一部分 在相对于发光部件的侧向。 透镜体具有横向于透镜轴线的横截面，其尺寸从反射表面和折射表面的接合部朝向底面逐渐增加。
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公开(公告)号：US08157415B2
公开(公告)日：2012-04-17
申请号：US12401266
申请日：2009-03-10
申请人： Ching-Lin Tseng , Yu-Shen Chen , Ming-Li Chang
发明人： Ching-Lin Tseng , Yu-Shen Chen , Ming-Li Chang
IPC分类号： F21V21/00 , H05K7/18 , H01L23/495 , H01R43/00
CPC分类号： F21K9/00 , Y10T29/49121
摘要： A method for making a light emitting diode lighting module includes steps of: (a) packaging a plurality of light emitting diode dies respectively on a plurality of die-mounting parts of a metal lead frame to form a plurality of light emitting diodes, respectively; and (b) cutting off supporting parts of the lead frame so as to form a connecting structure through which the light emitting diodes are connected to each other in one of serial, parallel, and serial-and-parallel connecting manners.
摘要翻译： 一种制造发光二极管照明模块的方法包括以下步骤：（a）将多个发光二极管管芯分别封装在金属引线框架的多个管芯安装部分上以分别形成多个发光二极管; 和（b）切断引线框架的支撑部分，以形成连接结构，发光二极管通过串联，并联和串联和并联连接方式彼此连接。
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公开(公告)号：US20090242908A1
公开(公告)日：2009-10-01
申请号：US12409667
申请日：2009-03-24
IPC分类号： H01L33/00
CPC分类号： F21K9/00 , H01L25/0753 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： A planar light source device includes: a substrate having a thickness larger than 0.9 mm and including a metal layer; and a plurality of light-emitting diode chips disposed on the substrate in a matrix array. Each light-emitting diode chip has a chip size ranging from 0.0784 mm2 to 0.25 mm2. Two adjacent ones of the light-emitting diode chips are spaced apart from each other by a distance of at least two times a length of the light-emitting diode chips.
摘要翻译： 平面光源装置包括：厚度大于0.9mm并包括金属层的基板; 以及以矩阵阵列设置在基板上的多个发光二极管芯片。 每个发光二极管芯片的芯片尺寸范围为0.0784mm2至0.25mm2。 两个相邻的发光二极管芯片彼此间隔开至少两倍于发光二极管芯片的长度的距离。
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公开(公告)号：US08154029B2
公开(公告)日：2012-04-10
申请号：US12409667
申请日：2009-03-24
IPC分类号： H01L33/00
CPC分类号： F21K9/00 , H01L25/0753 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： A planar light source device includes: a substrate having a thickness larger than 0.9 mm and including a metal layer; and a plurality of light-emitting diode chips disposed on the substrate in a matrix array. Each light-emitting diode chip has a chip size ranging from 0.0784 mm2 to 0.25 mm2. Two adjacent ones of the light-emitting diode chips are spaced apart from each other by a distance of at least two times a length of the light-emitting diode chips.
摘要翻译： 平面光源装置包括：厚度大于0.9mm并包括金属层的基板; 以及以矩阵阵列设置在基板上的多个发光二极管芯片。 每个发光二极管芯片的芯片尺寸范围为0.0784mm2至0.25mm2。 两个相邻的发光二极管芯片彼此间隔开至少两倍于发光二极管芯片的长度的距离。
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