Perpendicular write head having a stepped flare structure and method of manufacture thereof
    6.
    发明授权
    Perpendicular write head having a stepped flare structure and method of manufacture thereof 有权
    具有阶梯式火炬结构的垂直写头及其制造方法

    公开(公告)号:US08797685B2

    公开(公告)日:2014-08-05

    申请号:US12646879

    申请日:2009-12-23

    IPC分类号: G11B5/127

    摘要: A magnetic write head for data recording having a magnetic write pole with a stepped magnetic shell structure that defines a secondary flare point. The secondary flare point defined by the magnetic shell portion can be more tightly controlled with respect to its distance from the air bearing surface (ABS) of the write head than can a traditional flare point that is photolithographically on the main pole structure. This allows the effective flare point of the write head to be moved much closer to the ABS than would otherwise be possible using currently available tooling and photolithography techniques. The write head also includes a non-magnetic spacer layer formed over the magnetic shell structure that is recessed from the ABS by a distance that is greater than that of the magnetic shell portion. A magnetic shield is formed over the magnetic shell and non-magnetic spacer.

    摘要翻译: 一种用于数据记录的磁写头,具有限定二次闪光点的阶梯状磁性壳结构的磁性写入极。 由磁性壳体部分限定的次级火炬点可以相对于与写入磁头的空气轴承表面(ABS)的距离比在主极结构上光刻的传统闪光点更加严格地控制。 这使得使用当前可用的工具和光刻技术可以使写入头的有效喇叭点移动得更接近ABS。 写头还包括形成在磁性壳结构上的非磁性间隔层,其从ABS凹陷的距离大于磁性壳部分的距离。 在磁性壳体和非磁性间隔物上形成磁屏蔽。

    INDUCTIVE WRITE HEAD WITH SLANTED ELECTROPLATED MEMBER AND METHOD FOR PRODUCING THE SAME
    9.
    发明申请
    INDUCTIVE WRITE HEAD WITH SLANTED ELECTROPLATED MEMBER AND METHOD FOR PRODUCING THE SAME 有权
    带有电镀电极的电感写头及其制造方法

    公开(公告)号:US20090226760A1

    公开(公告)日:2009-09-10

    申请号:US12043381

    申请日:2008-03-06

    IPC分类号: G11B5/733 C25D5/48 B05D5/12

    摘要: A method for forming a tapered, electroplated structure. The method involves forming a first mask structure having an opening. A shrink material is deposited into the opening, such that the thickness of the shrink material is less than the thickness of the first mask structure. The first mask structure and the shrink material are then heated causing the sides of the opening in the mask structure to bulge inward. The shrink material is then removed, and a first electrically conductive material can then be electroplated into the opening to a thickness that is much less than the thickness of the mask. The bulbous shaped of the deformed photoresist mask forms a taper on the first electrically conductive material. The first mask can then be removed and a second electrically conductive material can be electroplated over the first electrically conductive material.

    摘要翻译: 一种形成锥形电镀结构的方法。 该方法包括形成具有开口的第一掩模结构。 收缩材料沉积到开口中,使得收缩材料的厚度小于第一掩模结构的厚度。 然后加热第​​一掩模结构和收缩材料,使得掩模结构中的开口的侧面向内凸出。 然后去除收缩材料,然后可以将第一导电材料电镀到开口中至比掩模厚度小得多的厚度。 变形的光致抗蚀剂掩模的球形形状在第一导电材料上形成锥形。 然后可以去除第一掩模,并且可以在第一导电材料上电镀第二导电材料。

    Method for manufacturing a magnetic write head
    10.
    发明授权
    Method for manufacturing a magnetic write head 有权
    磁写头制造方法

    公开(公告)号:US08028400B2

    公开(公告)日:2011-10-04

    申请号:US12043381

    申请日:2008-03-06

    IPC分类号: G11B5/127 H04R31/00

    摘要: A method for forming a tapered, electroplated structure. The method involves forming a first mask structure having an opening. A shrink material is deposited into the opening, such that the thickness of the shrink material is less than the thickness of the first mask structure. The first mask structure and the shrink material are then heated causing the sides of the opening in the mask structure to bulge inward. The shrink material is then removed, and a first electrically conductive material can then be electroplated into the opening to a thickness that is much less than the thickness of the mask. The bulbous shaped of the deformed photoresist mask forms a taper on the first electrically conductive material. The first mask can then be removed and a second electrically conductive material can be electroplated over the first electrically conductive material.

    摘要翻译: 一种形成锥形电镀结构的方法。 该方法包括形成具有开口的第一掩模结构。 收缩材料沉积到开口中,使得收缩材料的厚度小于第一掩模结构的厚度。 然后加热第​​一掩模结构和收缩材料,使得掩模结构中的开口的侧面向内凸出。 然后去除收缩材料,然后可以将第一导电材料电镀到开口中至比掩模厚度小得多的厚度。 变形的光致抗蚀剂掩模的球形形状在第一导电材料上形成锥形。 然后可以去除第一掩模,并且可以在第一导电材料上电镀第二导电材料。