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公开(公告)号：US08270702B2
公开(公告)日：2012-09-18
申请号：US12875462
申请日：2010-09-03
CPC分类号： H01L21/67265 , B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/129 , Y10S414/136
摘要： A device is provided having a robotic arm for handling a wafer, the robotic arm including one or more encoders that provide encoder data identifying a position of one or more components of the robotic arm. The device also having a processor adapted to apply an extended Kalman Filter to the encoder data to estimate a position of the wafer.
摘要翻译： 提供一种具有用于处理晶片的机器人手臂的装置，所述机器人臂包括一个或多个编码器，所述编码器提供识别所述机器人臂的一个或多个部件的位置的编码器数据。 该装置还具有适于将扩展卡尔曼滤波器应用于编码器数据以估计晶片的位置的处理器。
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公开(公告)号：US08634633B2
公开(公告)日：2014-01-21
申请号：US13617333
申请日：2012-09-14
IPC分类号： G06K9/00
CPC分类号： H01L21/681 , B65G25/02 , B65G37/00 , G05B19/02 , H01L21/67259 , H01L21/67742 , H01L21/67748 , H01L21/68 , Y10S901/09 , Y10S901/47
摘要： A device is provided having a robotic arm for handling a wafer, the robotic arm including one or more encoders that provide encoder data identifying a position of one or more components of the robotic arm. The device also having a processor adapted to apply an extended Kalman Filter to the encoder data to estimate a position of the wafer.
摘要翻译： 提供一种具有用于处理晶片的机器人手臂的装置，所述机器人臂包括一个或多个编码器，所述编码器提供识别所述机器人臂的一个或多个部件的位置的编码器数据。 该装置还具有适于将扩展卡尔曼滤波器应用于编码器数据以估计晶片的位置的处理器。
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公开(公告)号：US08267632B2
公开(公告)日：2012-09-18
申请号：US11876876
申请日：2007-10-23
IPC分类号： H01L21/677
CPC分类号： H01L21/67184 , H01L21/67161 , H01L21/6719
摘要： A system for processing semiconductor wafers including a plurality of robotic facilities serially joined to each other to form a substantially linear transport chamber through which wafers can be transferred from each facility, wherein the substantially linear transport chamber is sealed to hold a controlled atmosphere and each of the plurality of robotic facilities includes at least one scara robot having three arm links serially coupled to one another and having a substrate holder rotatably coupled at a distal end of the three arm links, the plurality of robot facilities being configured to effect the transfer of wafers through the substantially linear transport chamber via handoff a wafer between neighboring scara robots, and a multi-entry process module coupled to at least one of the plurality of robotic facilities, where each entry of the multi-entry process module is accessed by the at least one of the at least one scara robot.
摘要翻译： 一种用于处理半导体晶片的系统，其包括彼此串联连接的多个机器人设备，以形成基本上线性的输送室，通过该输送室可以从每个设备转移晶片，其中基本上线性的输送室被密封以保持受控气氛， 所述多个机器人设备包括至少一个scara机器人，其具有彼此串联连接的三个臂链节，并且具有可旋转地联接在所述三个臂链节的远端处的衬底保持架，所述多个机器人设备被配置为实现晶片的转移 通过在相邻的scara机器人之间切换晶片并且耦合到多个机器人设施中的至少一个的多入口处理模块，其中多进入处理模块的每个条目至少被访问至少 至少一个scara机器人之一。
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公开(公告)号：US20080187417A1
公开(公告)日：2008-08-07
申请号：US12025477
申请日：2008-02-04
申请人： Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese , Raymond S. Ritter , Thomas A. Schaefer
发明人： Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese , Raymond S. Ritter , Thomas A. Schaefer
IPC分类号： H01L21/67
CPC分类号： B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/139
摘要： Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.
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公开(公告)号：US08602716B2
公开(公告)日：2013-12-10
申请号：US11876896
申请日：2007-10-23
IPC分类号： B65G1/00
CPC分类号： H01L21/67184 , H01L21/67161 , H01L21/6719
摘要： A method is provided where the method includes configuring a plurality of robots so that a wafer can be handed off between neighboring robots, and disposing a plurality of sensors so that a robotic arm-relative position of a wafer that is transported by a robot is determined from sensor outputs by moving the wafer through a retract, rotate, and extend path.
摘要翻译： 提供了一种方法，其中所述方法包括配置多个机器人，使得可以在相邻机器人之间切换晶片，并且设置多个传感器，使得确定由机器人传送的晶片的机器人臂相对位置 从传感器输出通过移动晶片通过缩回，旋转和延伸路径。
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公开(公告)号：US08197177B2
公开(公告)日：2012-06-12
申请号：US12025541
申请日：2008-02-04
申请人： Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese , Raymond S. Ritter , Thomas A. Schaefer
发明人： Peter van der Meulen , Christopher C Kiley , Patrick D. Pannese , Raymond S. Ritter , Thomas A. Schaefer
IPC分类号： H01L21/306
CPC分类号： B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/139
摘要： Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.
摘要翻译： 模块化晶片输送和处理设备以各种方式组合，在真空半导体处理系统中提供更高水平的灵活性，效用，效率和功能。 各种加工和其他模块可以与隧道和车辆运输系统相互连接，以延长真空环境的距离和通用性。 引入诸如旁路热调节器，缓冲对准器，批处理，多功能模块，低粒子通风口，集束处理单元等的其它改进以扩展功能并提高处理效率。
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公开(公告)号：US08870514B2
公开(公告)日：2014-10-28
申请号：US13616683
申请日：2012-09-14
IPC分类号： H01L21/677 , H01L21/67 , B65G25/02 , H01L21/687 , B65G37/00
CPC分类号： H01L21/67703 , B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/6719 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67772 , H01L21/68792 , Y10S414/139
摘要： A semiconductor handling system including a vacuum workpiece handling system having a vacuum environment therein, the vacuum workpiece handling system including at least two workpiece handling robotic facilities, a mid-entry station positioned between the at least two workpiece handling robotic facilities, the mid-entry station including vertically stacked load locks, where the at least two workpiece handling robotic facilities are configured to transfer workpieces between the vertically stacked load locks, at least one workpiece loading station connected to the vacuum handling system, and a workpiece delivery system having an internal environment different from the vacuum environment, the workpiece delivery system being configured to transport the workpieces between each of the vertically stacked load locks of the mid-entry station and the at least one workpiece loading station.
摘要翻译： 一种半导体处理系统，包括其中具有真空环境的真空工件处理系统，所述真空工件处理系统包括至少两个工件处理机器人设施，位于所述至少两个工件处理机器人设施之间的中间入口站， 其包括垂直堆叠的装载锁，其中至少两个工件处理机器人设施构造成在垂直堆叠的负载锁之间传送工件，连接到真空处理系统的至少一个工件装载站以及具有内部环境的工件传送系统 与真空环境不同的是，工件传送系统被配置为在中间入口站的每个垂直堆叠的负载锁和至少一个工件装载站之间输送工件。
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公开(公告)号：US08812150B2
公开(公告)日：2014-08-19
申请号：US11876869
申请日：2007-10-23
IPC分类号： G06F7/00
CPC分类号： H01L21/67184 , H01L21/67161 , H01L21/6719
摘要： A method is provided. The method includes disposing a plurality of robotic facilities to form a semiconductor handling system, controlling the semiconductor handling system with a controller to handoff a workpiece between neighboring robotic facilities, and providing a software interface for the controller, wherein the software interface permits a user to view alternate configurations of the handling system in order to optimize a characteristic of the handling system.
摘要翻译： 提供了一种方法。 该方法包括设置多个机器人设备以形成半导体处理系统，通过控制器控制半导体处理系统以在相邻机器人设备之间切换工件，并为控制器提供软件接口，其中软件接口允许用户 查看处理系统的备用配置，以优化处理系统的特性。
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公开(公告)号：US08313277B2
公开(公告)日：2012-11-20
申请号：US11876915
申请日：2007-10-23
IPC分类号： B65G49/07
CPC分类号： H01L21/67703 , B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/6719 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/67772 , H01L21/68792 , Y10S414/139
摘要： A variety of process modules are described for use in semiconductor manufacturing processes.
摘要翻译： 描述了用于半导体制造工艺的各种工艺模块。
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公开(公告)号：US08696298B2
公开(公告)日：2014-04-15
申请号：US11876902
申请日：2007-10-23
IPC分类号： B65G49/07
CPC分类号： H01L21/67772 , H01L21/6719 , H01L21/67196 , H01L21/67748
摘要： A variety of process modules are described for use in semiconductor manufacturing processes.
摘要翻译： 描述了用于半导体制造工艺的各种工艺模块。
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