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公开(公告)号：US08270702B2
公开(公告)日：2012-09-18
申请号：US12875462
申请日：2010-09-03
CPC分类号： H01L21/67265 , B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/129 , Y10S414/136
摘要： A device is provided having a robotic arm for handling a wafer, the robotic arm including one or more encoders that provide encoder data identifying a position of one or more components of the robotic arm. The device also having a processor adapted to apply an extended Kalman Filter to the encoder data to estimate a position of the wafer.
摘要翻译： 提供一种具有用于处理晶片的机器人手臂的装置，所述机器人臂包括一个或多个编码器，所述编码器提供识别所述机器人臂的一个或多个部件的位置的编码器数据。 该装置还具有适于将扩展卡尔曼滤波器应用于编码器数据以估计晶片的位置的处理器。
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公开(公告)号：US20110093237A1
公开(公告)日：2011-04-21
申请号：US12977514
申请日：2010-12-23
CPC分类号： H01L21/67265 , B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/129 , Y10S414/136
摘要： A device for handling a substantially circular wafer is provided. The device includes an interior accessible through a plurality of entrances, and a plurality of sensors consisting of two sensors for each one of the plurality of entrances, each sensor capable of detecting a presence of the substantially circular wafer, at a predetermined location within the interior, wherein the plurality of sensors are arranged so that at least two of the plurality of sensors detect the wafer for any position of the wafer entirely within the interior, wherein a first one of the two sensors is positioned to detect the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances, and a second one of the two sensors is positioned immediately outside a diameter of the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances.
摘要翻译： 提供了一种用于处理基本圆形晶片的装置。 该装置包括可通过多个入口访问的内部，以及由多个入口中的每一个入口的两个传感器组成的多个传感器，每个传感器能够在内部的预定位置处检测基本圆形的晶片的存在 ，其中所述多个传感器被布置成使得所述多个传感器中的至少两个传感器在所述内部中完全检测所述晶片的任何位置的晶片，其中所述两个传感器中的第一传感器定位成当所述晶片具有 通过多个入口中的一个完全通过内部，并且当晶片已经通过多个入口之一完全通过内部时，两个传感器中的第二个位于晶片直径的正上方。
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3.发明授权Motor vehicle alternator having a single voltage sensor and a half-wave controlled rectifier bridge for increasing output 有权机动车交流发电机具有单电压传感器和半波可控整流桥，用于增加输出公开(公告)号：US06239582B1
公开(公告)日：2001-05-29
申请号：US09434004
申请日：1999-11-04
IPC分类号： H02P944
CPC分类号： H02P9/305 , H02J7/1492 , Y02T10/92
摘要： An alternator system having a single voltage sensor and a half-wave controlled rectifier bridge for increasing/decreasing alternator output power is disclosed. The half-wave controlled rectifier bridge includes three diodes and three active switches. The alternator system further includes a controlled field winding coupled to a three-phase stator winding; a battery; and, a controller for controlling the active switches and the field winding for increasing/decreasing the alternator output power. The controller uses edges sensed by the single voltage sensor for determining optimum activation and deactivation times for the three active switches in the bridge, and then controlling the switches in accordance with the determined optimum switching times.
摘要翻译： 公开了具有用于增加/减少交流发电机输出功率的单电压传感器和半波可控整流桥的交流发电机系统。 半波控整流桥包括三个二极管和三个有源开关。 交流发电机系统还包括耦合到三相定子绕组的受控励磁绕组; 一个电池 以及用于控制用于增加/减少交流发电机输出功率的有源开关和励磁绕组的控制器。 控制器使用由单个电压传感器检测的边缘来确定桥中三个有效开关的最佳激活和去激活时间，然后根据所确定的最佳切换时间来控制开关。
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公开(公告)号：US08253948B2
公开(公告)日：2012-08-28
申请号：US13406252
申请日：2012-02-27
IPC分类号： G01B11/14
CPC分类号： B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/139
摘要： A device for handling a substantially circular wafer is provided. The device includes an interior accessible through a plurality of entrances, and a plurality of sensors consisting of two sensors for each one of the plurality of entrances, each sensor capable of detecting a presence of the substantially circular wafer, at a predetermined location within the interior, wherein the plurality of sensors are arranged so that at least two of the plurality of sensors detect the wafer for any position of the wafer entirely within the interior, wherein a first one of the two sensors is positioned to detect the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances, and a second one of the two sensors is positioned immediately outside a diameter of the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances.
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公开(公告)号：US08125652B2
公开(公告)日：2012-02-28
申请号：US12977514
申请日：2010-12-23
IPC分类号： G01B11/14
CPC分类号： H01L21/67265 , B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/129 , Y10S414/136
摘要： A device for handling a substantially circular wafer is provided. The device includes an interior accessible through a plurality of entrances, and a plurality of sensors consisting of two sensors for each one of the plurality of entrances, each sensor capable of detecting a presence of the substantially circular wafer, at a predetermined location within the interior, wherein the plurality of sensors are arranged so that at least two of the plurality of sensors detect the wafer for any position of the wafer entirely within the interior, wherein a first one of the two sensors is positioned to detect the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances, and a second one of the two sensors is positioned immediately outside a diameter of the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances.
摘要翻译： 提供了一种用于处理基本圆形晶片的装置。 该装置包括可通过多个入口访问的内部，以及由多个入口中的每一个入口的两个传感器组成的多个传感器，每个传感器能够在内部的预定位置处检测基本圆形的晶片的存在 ，其中所述多个传感器被布置成使得所述多个传感器中的至少两个传感器在所述内部中完全检测所述晶片的任何位置的晶片，其中所述两个传感器中的第一传感器定位成当所述晶片具有 通过多个入口中的一个完全通过内部，并且当晶片已经通过多个入口之一完全通过内部时，两个传感器中的第二个位于晶片直径的正上方。
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公开(公告)号：US20100324732A1
公开(公告)日：2010-12-23
申请号：US12875462
申请日：2010-09-03
CPC分类号： H01L21/67265 , B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/129 , Y10S414/136
摘要： A device is provided having a robotic arm for handling a wafer, the robotic arm including one or more encoders that provide encoder data identifying a position of one or more components of the robotic arm. The device also having a processor adapted to apply an extended Kalman Filter to the encoder data to estimate a position of the wafer.
摘要翻译： 提供一种具有用于处理晶片的机器人手臂的装置，所述机器人臂包括一个或多个编码器，所述编码器提供识别所述机器人臂的一个或多个部件的位置的编码器数据。 该装置还具有适于将扩展卡尔曼滤波器应用于编码器数据以估计晶片的位置的处理器。
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公开(公告)号：US20080255798A1
公开(公告)日：2008-10-16
申请号：US12032436
申请日：2008-02-15
申请人： Forrest T. Buzan
发明人： Forrest T. Buzan
IPC分类号： H01L21/68
CPC分类号： H01L21/67265 , B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/129 , Y10S414/136
摘要： A number of wafer center finding methods and systems are disclosed herein that improve upon existing techniques used in semiconductor manufacturing.
摘要翻译： 本文公开了一些改进在半导体制造中使用的现有技术的晶片中心发现方法和系统。
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公开(公告)号：US20080147333A1
公开(公告)日：2008-06-19
申请号：US12032341
申请日：2008-02-15
IPC分类号： G06F19/00
CPC分类号： H01L21/67265 , B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/129 , Y10S414/136
摘要： A number of wafer center finding methods and systems are disclosed herein that improve upon existing techniques used in semiconductor manufacturing.
摘要翻译： 本文公开了一些改进在半导体制造中使用的现有技术的晶片中心发现方法和系统。
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公开(公告)号：US08634633B2
公开(公告)日：2014-01-21
申请号：US13617333
申请日：2012-09-14
IPC分类号： G06K9/00
CPC分类号： H01L21/681 , B65G25/02 , B65G37/00 , G05B19/02 , H01L21/67259 , H01L21/67742 , H01L21/67748 , H01L21/68 , Y10S901/09 , Y10S901/47
摘要： A device is provided having a robotic arm for handling a wafer, the robotic arm including one or more encoders that provide encoder data identifying a position of one or more components of the robotic arm. The device also having a processor adapted to apply an extended Kalman Filter to the encoder data to estimate a position of the wafer.
摘要翻译： 提供一种具有用于处理晶片的机器人手臂的装置，所述机器人臂包括一个或多个编码器，所述编码器提供识别所述机器人臂的一个或多个部件的位置的编码器数据。 该装置还具有适于将扩展卡尔曼滤波器应用于编码器数据以估计晶片的位置的处理器。
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公开(公告)号：US20130085595A1
公开(公告)日：2013-04-04
申请号：US13617333
申请日：2012-09-14
CPC分类号： H01L21/681 , B65G25/02 , B65G37/00 , G05B19/02 , H01L21/67259 , H01L21/67742 , H01L21/67748 , H01L21/68 , Y10S901/09 , Y10S901/47
摘要： A device is provided having a robotic arm for handling a wafer, the robotic arm including one or more encoders that provide encoder data identifying a position of one or more components of the robotic arm. The device also having a processor adapted to apply an extended Kalman Filter to the encoder data to estimate a position of the wafer.
摘要翻译： 提供一种具有用于处理晶片的机器人手臂的装置，所述机器人臂包括一个或多个编码器，所述编码器提供识别所述机器人臂的一个或多个部件的位置的编码器数据。 该装置还具有适于将扩展卡尔曼滤波器应用于编码器数据以估计晶片的位置的处理器。
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