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公开(公告)号：US08270702B2
公开(公告)日：2012-09-18
申请号：US12875462
申请日：2010-09-03
CPC分类号： H01L21/67265 , B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/129 , Y10S414/136
摘要： A device is provided having a robotic arm for handling a wafer, the robotic arm including one or more encoders that provide encoder data identifying a position of one or more components of the robotic arm. The device also having a processor adapted to apply an extended Kalman Filter to the encoder data to estimate a position of the wafer.
摘要翻译： 提供一种具有用于处理晶片的机器人手臂的装置，所述机器人臂包括一个或多个编码器，所述编码器提供识别所述机器人臂的一个或多个部件的位置的编码器数据。 该装置还具有适于将扩展卡尔曼滤波器应用于编码器数据以估计晶片的位置的处理器。
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公开(公告)号：US20110093237A1
公开(公告)日：2011-04-21
申请号：US12977514
申请日：2010-12-23
CPC分类号： H01L21/67265 , B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/129 , Y10S414/136
摘要： A device for handling a substantially circular wafer is provided. The device includes an interior accessible through a plurality of entrances, and a plurality of sensors consisting of two sensors for each one of the plurality of entrances, each sensor capable of detecting a presence of the substantially circular wafer, at a predetermined location within the interior, wherein the plurality of sensors are arranged so that at least two of the plurality of sensors detect the wafer for any position of the wafer entirely within the interior, wherein a first one of the two sensors is positioned to detect the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances, and a second one of the two sensors is positioned immediately outside a diameter of the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances.
摘要翻译： 提供了一种用于处理基本圆形晶片的装置。 该装置包括可通过多个入口访问的内部，以及由多个入口中的每一个入口的两个传感器组成的多个传感器，每个传感器能够在内部的预定位置处检测基本圆形的晶片的存在 ，其中所述多个传感器被布置成使得所述多个传感器中的至少两个传感器在所述内部中完全检测所述晶片的任何位置的晶片，其中所述两个传感器中的第一传感器定位成当所述晶片具有 通过多个入口中的一个完全通过内部，并且当晶片已经通过多个入口之一完全通过内部时，两个传感器中的第二个位于晶片直径的正上方。
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公开(公告)号：US08253948B2
公开(公告)日：2012-08-28
申请号：US13406252
申请日：2012-02-27
IPC分类号： G01B11/14
CPC分类号： B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/139
摘要： A device for handling a substantially circular wafer is provided. The device includes an interior accessible through a plurality of entrances, and a plurality of sensors consisting of two sensors for each one of the plurality of entrances, each sensor capable of detecting a presence of the substantially circular wafer, at a predetermined location within the interior, wherein the plurality of sensors are arranged so that at least two of the plurality of sensors detect the wafer for any position of the wafer entirely within the interior, wherein a first one of the two sensors is positioned to detect the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances, and a second one of the two sensors is positioned immediately outside a diameter of the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances.
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公开(公告)号：US08125652B2
公开(公告)日：2012-02-28
申请号：US12977514
申请日：2010-12-23
IPC分类号： G01B11/14
CPC分类号： H01L21/67265 , B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/129 , Y10S414/136
摘要： A device for handling a substantially circular wafer is provided. The device includes an interior accessible through a plurality of entrances, and a plurality of sensors consisting of two sensors for each one of the plurality of entrances, each sensor capable of detecting a presence of the substantially circular wafer, at a predetermined location within the interior, wherein the plurality of sensors are arranged so that at least two of the plurality of sensors detect the wafer for any position of the wafer entirely within the interior, wherein a first one of the two sensors is positioned to detect the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances, and a second one of the two sensors is positioned immediately outside a diameter of the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances.
摘要翻译： 提供了一种用于处理基本圆形晶片的装置。 该装置包括可通过多个入口访问的内部，以及由多个入口中的每一个入口的两个传感器组成的多个传感器，每个传感器能够在内部的预定位置处检测基本圆形的晶片的存在 ，其中所述多个传感器被布置成使得所述多个传感器中的至少两个传感器在所述内部中完全检测所述晶片的任何位置的晶片，其中所述两个传感器中的第一传感器定位成当所述晶片具有 通过多个入口中的一个完全通过内部，并且当晶片已经通过多个入口之一完全通过内部时，两个传感器中的第二个位于晶片直径的正上方。
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公开(公告)号：US20100324732A1
公开(公告)日：2010-12-23
申请号：US12875462
申请日：2010-09-03
CPC分类号： H01L21/67265 , B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/129 , Y10S414/136
摘要： A device is provided having a robotic arm for handling a wafer, the robotic arm including one or more encoders that provide encoder data identifying a position of one or more components of the robotic arm. The device also having a processor adapted to apply an extended Kalman Filter to the encoder data to estimate a position of the wafer.
摘要翻译： 提供一种具有用于处理晶片的机器人手臂的装置，所述机器人臂包括一个或多个编码器，所述编码器提供识别所述机器人臂的一个或多个部件的位置的编码器数据。 该装置还具有适于将扩展卡尔曼滤波器应用于编码器数据以估计晶片的位置的处理器。
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公开(公告)号：US08634633B2
公开(公告)日：2014-01-21
申请号：US13617333
申请日：2012-09-14
IPC分类号： G06K9/00
CPC分类号： H01L21/681 , B65G25/02 , B65G37/00 , G05B19/02 , H01L21/67259 , H01L21/67742 , H01L21/67748 , H01L21/68 , Y10S901/09 , Y10S901/47
摘要： A device is provided having a robotic arm for handling a wafer, the robotic arm including one or more encoders that provide encoder data identifying a position of one or more components of the robotic arm. The device also having a processor adapted to apply an extended Kalman Filter to the encoder data to estimate a position of the wafer.
摘要翻译： 提供一种具有用于处理晶片的机器人手臂的装置，所述机器人臂包括一个或多个编码器，所述编码器提供识别所述机器人臂的一个或多个部件的位置的编码器数据。 该装置还具有适于将扩展卡尔曼滤波器应用于编码器数据以估计晶片的位置的处理器。
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公开(公告)号：US20130085595A1
公开(公告)日：2013-04-04
申请号：US13617333
申请日：2012-09-14
CPC分类号： H01L21/681 , B65G25/02 , B65G37/00 , G05B19/02 , H01L21/67259 , H01L21/67742 , H01L21/67748 , H01L21/68 , Y10S901/09 , Y10S901/47
摘要： A device is provided having a robotic arm for handling a wafer, the robotic arm including one or more encoders that provide encoder data identifying a position of one or more components of the robotic arm. The device also having a processor adapted to apply an extended Kalman Filter to the encoder data to estimate a position of the wafer.
摘要翻译： 提供一种具有用于处理晶片的机器人手臂的装置，所述机器人臂包括一个或多个编码器，所述编码器提供识别所述机器人臂的一个或多个部件的位置的编码器数据。 该装置还具有适于将扩展卡尔曼滤波器应用于编码器数据以估计晶片的位置的处理器。
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公开(公告)号：US20120154822A1
公开(公告)日：2012-06-21
申请号：US13406252
申请日：2012-02-27
IPC分类号： G01B11/14
CPC分类号： B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/139
摘要： A device for handling a substantially circular wafer is provided. The device includes an interior accessible through a plurality of entrances, and a plurality of sensors consisting of two sensors for each one of the plurality of entrances, each sensor capable of detecting a presence of the substantially circular wafer, at a predetermined location within the interior, wherein the plurality of sensors are arranged so that at least two of the plurality of sensors detect the wafer for any position of the wafer entirely within the interior, wherein a first one of the two sensors is positioned to detect the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances, and a second one of the two sensors is positioned immediately outside a diameter of the wafer when the wafer has passed entirely into the interior through one of the plurality of entrances.
摘要翻译： 提供了一种用于处理基本圆形晶片的装置。 该装置包括可通过多个入口访问的内部，以及由多个入口中的每一个入口的两个传感器组成的多个传感器，每个传感器能够在内部的预定位置处检测基本圆形的晶片的存在 ，其中所述多个传感器被布置成使得所述多个传感器中的至少两个传感器在所述内部中完全检测所述晶片的任何位置的晶片，其中所述两个传感器中的第一传感器定位成当所述晶片具有 通过多个入口中的一个完全通过内部，并且当晶片已经通过多个入口之一完全通过内部时，两个传感器中的第二个位于晶片直径的正上方。
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公开(公告)号：US20080147333A1
公开(公告)日：2008-06-19
申请号：US12032341
申请日：2008-02-15
IPC分类号： G06F19/00
CPC分类号： H01L21/67265 , B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/129 , Y10S414/136
摘要： A number of wafer center finding methods and systems are disclosed herein that improve upon existing techniques used in semiconductor manufacturing.
摘要翻译： 本文公开了一些改进在半导体制造中使用的现有技术的晶片中心发现方法和系统。
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公开(公告)号：US07894657B2
公开(公告)日：2011-02-22
申请号：US12032341
申请日：2008-02-15
IPC分类号： G06K9/00
CPC分类号： H01L21/67265 , B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/129 , Y10S414/136
摘要： A number of wafer center finding methods and systems are disclosed herein that improve upon existing techniques used in semiconductor manufacturing.
摘要翻译： 本文公开了一些改进在半导体制造中使用的现有技术的晶片中心发现方法和系统。
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