Abstract:
The present invention relates to a low dropout regulator, and more particularly to a low dropout regulator without load capacitor and ESR (equivalent series resistance) designed in response to the discharge curve of a Li-ion battery, includes an input terminal, a reference circuit, a power transfer element, a level regulating device, a regulating circuit, and a first N-type MOSFET. The regulating circuit detects a load change at an output terminal, amplifies the load change, and couples it to the level regulating device. The level regulating device receives and boosts a received signal and transmits the received signal to the power transfer element, so as to achieve the effect of controlling the power of a power supply.
Abstract:
A charging circuit integrated into a chip, comprising a charging unit, a switch unit, a biasing unit, a voltage-dividing unit, and a comparing unit. The charging unit is connected between a power supply input and a load for outputting a constant current based on a constant bias voltage supplied by the power supply input in order to charge the load. The switch unit is connected between the charging unit and the power supply input for turning on or cutting off the charging unit. The voltage-dividing unit generates a first signal to the comparing unit according to a voltage of the load. The biasing unit outputs a second signal having a constant voltage to the comparing unit. The comparing unit compares the first signal with the second signal for cutting off or turning on the switch unit, bringing the charging unit to charge or stop charging the load, respectively.
Abstract:
The present invention relates to a low dropout regulator, and more particularly to a low dropout regulator without load capacitor and ESR (equivalent series resistance) designed in response to the discharge curve of a Li-ion battery, includes an input terminal, a reference circuit, a power transfer element, a level regulating device, a regulating circuit, and a first N-type MOSFET. The regulating circuit detects a load change at an output terminal, amplifies the load change, and couples it to the level regulating device. The level regulating device receives and boosts a received signal and transmits the received signal to the power transfer element, so as to achieve the effect of controlling the power of a power supply.
Abstract:
An ESD protection circuit with leakage current reduction function includes a silicon controlled rectifier, a first CMOS inverter, a first transistor, a current mirror, a PMOS capacitor and a resistor. The first CMOS inverter electrically connects with the silicon controlled rectifier. The first transistor comprises a first end, a second end and a third end, wherein the first end electrically connects with the silicon controlled rectifier and the first CMOS inverter, and the current mirror electrically connects with the third end of the first transistor. The PMOS capacitor electrically connects with the current mirror, and the resistor electrically connects with the first CMOS inverter, the second end of the first transistor and the PMOS capacitor.
Abstract:
An output buffer with process and temperature compensation comprises an enable terminal, a clock generator, a PMOS threshold voltage detector, an NMOS threshold voltage detector, a first comparator, a second comparator, a first compensation code generator, a second compensation code generator and an output buffer stage, wherein the output buffer stage has an output stage, the output buffer stage means for controlling a drive current generated by the output stage, wherein the output stage has a first voltage output terminal, and the modulated drive current is capable of compensating slew rate of the first voltage output terminal.
Abstract:
A threshold voltage detection circuit comprises a first inverter, a first transistor, a second transistor, a third transistor and a fourth transistor. The first inverter comprises a first terminal and a second terminal, a first electrode of the first transistor is electrically connected with the second terminal of the first inverter, a fourth electrode of the second transistor is electrically connected with the first terminal of the first inverter, a seventh electrode of the third transistor is electrically connected with the second terminal of the first inverter and the first electrode of the first transistor, a tenth electrode of the fourth transistor is electrically connected with a third electrode of the first transistor and a fifth electrode of the second transistor, and an eleventh electrode of the fourth transistor is electrically connected with a ninth electrode of the third transistor.
Abstract:
A 2×VDD-tolerant input/output (I/O) buffer circuit with process, voltage, and temperature (PVT) compensation suitable for CMOS technology is disclosed. A 2×VDD-tolerant I/O buffer with a PVT compensation circuit is implemented with novel 2×VDD-tolerant logic gates. Output slew rate variations can be kept within smaller ranges to match maximum and minimum timing specifications. A 2×VDD tolerant logic circuit for implementing the I/O buffer is also disclosed.
Abstract:
The invention relates to an electrostatic discharge protecting circuit with ultra-low standby leakage current for twice supply voltage tolerance. The electrostatic discharge protecting circuit of the invention includes a substrate driver, a third transistor, a start-up circuit, a RC circuit and a second resistor. The substrate driver has a first transistor and a second transistor in serious connection. The start-up circuit has a fourth transistor and a fifth transistor with diode-connected. The RC circuit has a first resistor, a sixth transistor and a seventh transistor in serious connection. Compared with the prior art, the electrostatic discharge protecting circuit with ultra-low standby leakage current for twice supply voltage tolerance of the invention with advantages of low standby leakage current, high ESD robustness, and no gate-oxide reliability issue is an excellent circuit solution for on-chip ESD protection design for mixed-voltage I/O buffers in nanometer CMOS technologies.
Abstract:
The invention relates to an integrated circuit memory unit comprising: a memory cell, a switched bulk DC voltage source and a plurality of wordline-controlled transistors. Each of wordline-controlled transistors has a bulk connected to the switched bulk DC voltage source. When the data bit is read from the memory cell or the data bit is written into the memory cell, the bulks of the wordline-controlled transistors are switched to a first voltage level from the switched bulk DC voltage source so as to increase the drain current and obtain faster operation speed. When in an idle mode, the bulks of the wordline-controlled transistors are switched to a second voltage level from the switched bulk DC voltage source so as to obtain higher threshold voltage and decrease the leakage current.
Abstract:
A method and a circuit for resolving the out-of-phase problem between a color burst signal and a sub-carrier signal of a television system. A delay means is used which leads to the synchronization of the color burst signal and the sub-carrier signal such that a subsequent color demodulator can demodulate correct color signals. Therefore, the locking of the two signals will be fastened without any excessively large circuit hardware.