Microinjector for jetting droplets of different sizes
    1.
    发明授权
    Microinjector for jetting droplets of different sizes 有权
    用于喷射不同大小的液滴的微量注射器

    公开(公告)号:US06789880B2

    公开(公告)日:2004-09-14

    申请号:US10064254

    申请日:2002-06-26

    IPC分类号: B41J214

    摘要: A microinjector uses bubbles as virtual valves to eject droplets of different sizes. The microinjector is in fluid communications with a reservoir and has a substrate, an orifice layer, and a plurality of nozzles. The substrate has a manifold for receiving ink from the reservoir. The orifice layer is positioned on the top of the substrate so that a plurality of chambers are formed between the orifice layer and the top of the substrate. Each of the nozzles has an orifice and at least three bubble generating components. The bubble generating components are selectively driven by a driving circuit so that each nozzle can eject droplets of different sizes.

    摘要翻译: 微量注射器使用气泡作为虚拟阀来喷射不同尺寸的液滴。 微型注射器与储存器流体连通,并具有基底,孔层和多个喷嘴。 衬底具有用于从储存器接收墨水的歧管。 孔层位于基板的顶部,使得在孔板层和基板的顶部之间形成多个室。 每个喷嘴具有孔口和至少三个气泡产生部件。 气泡生成部件由驱动电路选择性地驱动,使得每个喷嘴可喷射不同尺寸的液滴。

    Surface isolation device
    2.
    发明授权
    Surface isolation device 失效
    表面隔离装置

    公开(公告)号:US06733616B2

    公开(公告)日:2004-05-11

    申请号:US10063878

    申请日:2002-05-21

    IPC分类号: H05H100

    摘要: A surface isolation device for isolating a predetermined area of a second surface of a wafer from an etching solution while the etching solution etches a first surface of the wafer to form a plurality of manifolds in the wafer. The surface isolation device has a base for positioning the wafer, a fixture for fixing the wafer on the base, and an isolation ring positioned on the base for isolating the predetermined area from the etching solution. When the fixture fixes the wafer on the base, the wafer sticks to the isolation ring, forming a seal that isolates the predetermined area from the etching solution.

    摘要翻译: 一种表面隔离装置,用于在蚀刻溶液蚀刻晶片的第一表面以在晶片中形成多个歧管时,将晶片的第二表面的预定区域与蚀刻溶液隔离。 表面隔离装置具有用于定位晶片的基座,用于将晶片固定在基座上的固定器,以及位于基座上用于将预定区域与蚀刻溶液隔离的隔离环。 当夹具将晶片固定在基座上时,晶片粘附到隔离环上,形成将预定面积与蚀刻溶液隔离的密封。

    Fluid injector and method of manufacturing the same
    3.
    发明申请
    Fluid injector and method of manufacturing the same 失效
    流体注射器及其制造方法

    公开(公告)号:US20060284932A1

    公开(公告)日:2006-12-21

    申请号:US11372964

    申请日:2006-03-09

    IPC分类号: B41J2/04

    摘要: A fluid injector and method of manufacturing the same. The fluid injector comprises a base, a first through hole, a bubble generator, a passivation layer, and a metal layer. The base includes a chamber and a surface. The first through hole communicates with the chamber, and is disposed in the base. The bubble generator is disposed on the surface near the first through hole, and is located outside the chamber. The passivation layer is disposed on the surface. The metal layer defines a second through hole, and is disposed on the passivation layer outside the chamber. The second through hole communicates with the first through hole.

    摘要翻译: 一种流体注射器及其制造方法。 流体注射器包括底座,第一通孔,气泡发生器,钝化层和金属层。 底座包括一个腔室和一个表面。 第一通孔与腔室连通,并设置在基座中。 气泡发生器设置在靠近第一通孔的表面上,并且位于室外。 钝化层设置在表面上。 金属层限定第二通孔,并且设置在室外的钝化层上。 第二通孔与第一通孔连通。

    Method for fluid injector
    4.
    发明授权
    Method for fluid injector 失效
    流体注射器的方法

    公开(公告)号:US07513042B2

    公开(公告)日:2009-04-07

    申请号:US11372964

    申请日:2006-03-09

    IPC分类号: B21D53/76 B41J2/04

    摘要: A fluid injector and method of manufacturing the same. The fluid injector comprises a base, a first through hole, a bubble generator, a passivation layer, and a metal layer. The base includes a chamber and a surface. The first through hole communicates with the chamber, and is disposed in the base. The bubble generator is disposed on the surface near the first through hole, and is located outside the chamber. The passivation layer is disposed on the surface. The metal layer defines a second through hole, and is disposed on the passivation layer outside the chamber. The second through hole communicates with the first through hole.

    摘要翻译: 一种流体注射器及其制造方法。 流体注射器包括底座,第一通孔,气泡发生器,钝化层和金属层。 底座包括一个腔室和一个表面。 第一通孔与腔室连通,并设置在基座中。 气泡发生器设置在靠近第一通孔的表面上,并且位于室外。 钝化层设置在表面上。 金属层限定第二通孔,并且设置在室外的钝化层上。 第二通孔与第一通孔连通。

    Fluid injector and method of manufacturing the same
    5.
    发明授权
    Fluid injector and method of manufacturing the same 失效
    流体注射器及其制造方法

    公开(公告)号:US07040740B2

    公开(公告)日:2006-05-09

    申请号:US10618928

    申请日:2003-07-11

    IPC分类号: B41J2/05

    摘要: A fluid injector and method of manufacturing the same. The fluid injector includes a base, a first through hole, a bubble generator, a passivation layer, and a metal layer. The base includes a chamber and a surface. The first through hole communicates with the chamber, and is disposed in the base. The bubble generator is disposed on the surface near the first through hole, and is located outside the chamber. The passivation layer is disposed on the surface. The metal layer defines a second through hole, and is disposed on the passivation layer outside the chamber. The second through hole communicates with the first through hole.

    摘要翻译: 一种流体注射器及其制造方法。 流体注射器包括基座,第一通孔,气泡发生器,钝化层和金属层。 底座包括一个腔室和一个表面。 第一通孔与腔室连通,并设置在基座中。 气泡发生器设置在靠近第一通孔的表面上,并且位于室外。 钝化层设置在表面上。 金属层限定第二通孔,并且设置在室外的钝化层上。 第二通孔与第一通孔连通。

    High density wafer production method
    7.
    发明授权
    High density wafer production method 失效
    高密度晶圆生产方法

    公开(公告)号:US06693045B2

    公开(公告)日:2004-02-17

    申请号:US09683692

    申请日:2002-02-04

    IPC分类号: H01L2100

    摘要: A gradational etching method for high density wafer production. The gradational etching method acts on a substrate having a first passivation layer and a second passivation layer on a top surface and a bottom surface, respectively, of the substrate. A first etching process is performed to simultaneously etch the substrate and the first passivation layer to remove the first passivation layer. Finally, a second etching process is performed to etch the substrate to a designated depth that is used to control the thickness of the wafer after the second etching process.

    摘要翻译: 用于高密度晶片生产的渐变蚀刻方法。 分级蚀刻方法分别作用于具有基板的顶表面和底表面上的第一钝化层和第二钝化层的基板上。 执行第一蚀刻工艺以同时蚀刻衬底和第一钝化层以去除第一钝化层。 最后,执行第二蚀刻工艺以将衬底蚀刻到用于在第二蚀刻工艺之后控制晶片的厚度的指定深度。

    Apparatus for using bubble as virtual valve to eject ink and fabricating method thereof

    公开(公告)号:US06530648B2

    公开(公告)日:2003-03-11

    申请号:US10138291

    申请日:2002-05-06

    IPC分类号: B41J214

    摘要: An apparatus for using the bubble as a virtual valve to eject ink comprises a chamber, orifice, and heaters. The chamber, having a top surface and a bottom surface, is connected to the ink reservoir by a manifold. Two heaters, connected in series to a common electrode, are located on the bottom surface of the chamber. One heater having higher resistance is positioned adjacent to the manifold, and the other heater having lower resistance is positioned away from the manifold. When an electrical pulse is applied to activate the heaters, the heater close to the manifold heats up first, and generates a first bubble to isolate the ink flow between the chamber and manifold, thereby reducing the effects of cross talk. Subsequently, the heater away from the manifold generates the second bubble to pressurize the ink in the chamber with the first bubble, and the ink is ejected through the orifice. Then, the first bubble collapses, and breaks the isolation between the manifold and the chamber. The ink in the manifold immediately refills to the chamber.

    Fluid injection device and method of fabricating the same
    9.
    发明申请
    Fluid injection device and method of fabricating the same 审中-公开
    流体注射装置及其制造方法

    公开(公告)号:US20060092231A1

    公开(公告)日:2006-05-04

    申请号:US11265050

    申请日:2005-11-02

    IPC分类号: B41J2/05

    摘要: A fluid injection device. The device includes a substrate, a chamber formed in the substrate, and a structural layer covering the substrate and the chamber, wherein the structural layer covering the chamber has two regions with different thicknesses, and at least two nozzles pass through the two structural layer regions respectively and connected to the chamber. The method of fabricating the above fluid injection device is also disclosed.

    摘要翻译: 流体注射装置。 该装置包括基板,形成在基板中的腔室和覆盖基板和腔室的结构层,其中覆盖腔室的结构层具有不同厚度的两个区域,并且至少两个喷嘴穿过两个结构层区域 分别连接到腔室。 还公开了制造上述流体注射装置的方法。