公开(公告)号：US20110255247A1

公开(公告)日：2011-10-20

申请号：US12853280

申请日：2010-08-09

Applicant: Chung-Jun CHU

Inventor： Chung-Jun CHU

IPC: H05K7/20

CPC classification number: H01L23/4093 ,  H01L23/552 ,  H01L2924/0002 ,  H05K9/0022 ,  H01L2924/00

Abstract: A heat sink assembly with shielding frame is mounted on a circuit board and includes a heat sink, a shielding frame and a heat transmitting film. The circuit board comprises at least one electronic component and a plurality of latching slots surrounding the electronic component. The heat sink includes a base and a plurality of heat fins extending upwardly from the base. A plurality of slots are defined between the plurality of heat fins. The shielding frame includes a hollow frame, a plurality of latch portions and a plurality of limitation portions. The plurality of latch portions are disposed on one end of the hollow frame and evenly spaced apart from each other. The plurality of limitation portions extend from the other end of the hollow frame. The shielding frame cooperates with the heat sink to shield the electronic component from electromagnetic interference (EMI).

Abstract translation: 具有屏蔽框架的散热器组件安装在电路板上，包括散热器，屏蔽框架和传热膜。 电路板包括至少一个电子部件和围绕电子部件的多个锁定槽。 散热器包括从基座向上延伸的基部和多个散热片。 在多个散热片之间限定多个槽。 屏蔽框架包括中空框架，多个闩锁部分和多个限制部分。 多个闩锁部分设置在中空框架的一端并且彼此间隔开。 多个限制部分从中空框架的另一端延伸。 屏蔽框架与散热器协同工作，以防止电子部件受到电磁干扰（EMI）的影响。

公开(公告)号：US20090101324A1

公开(公告)日：2009-04-23

申请号：US12200128

申请日：2008-08-28

Applicant: Chung-Jun CHU

Inventor： Chung-Jun CHU

IPC: F28F7/00 ,  H05K7/20

CPC classification number: H01L23/367 ,  F28D15/0266 ,  F28F13/00 ,  F28F2013/008 ,  H01L2924/0002 ,  H05K7/20445 ,  H01L2924/00

Abstract: A heat conducting apparatus adopts a design of two oblique slide blocks disposed between and contacted with two objects for conducting heat from one of the two objects to another. The two oblique slide blocks can be adjusted freely according to the different heights of the two objects to conduct the heat produced by a heat generating component to a heat dissipating structure.

Abstract translation: 导热装置采用设置在两个物体之间并与两个物体接触的两个倾斜滑块的设计，以将热量从两个物体之一传导到另一个物体。 两个斜滑块可以根据两个物体的不同高度自由调节，以将由发热部件产生的热量传导到散热结构。

公开(公告)号：US20090229808A1

公开(公告)日：2009-09-17

申请号：US12349710

申请日：2009-01-07

Applicant: Chung-Jun CHU

Inventor： Chung-Jun CHU

IPC: F28F99/00

CPC classification number: F28F3/06 ,  F28D15/0233 ,  F28F2275/18 ,  H01L23/4338 ,  H01L2924/0002 ,  H05K7/2049 ,  H01L2924/00

Abstract: A heat-conducting assembly is mounted between a heat-generating element and a heat-dissipating plate. The heat-conducting assembly includes a base, a first heat-conducting block, a second heat-conducting block and an elastic element. The base is attached on the heat-generating element. The first heat-conducting block is provided on the base. The first heat-conducting block has a first slope and a fixing groove. The second heat-conducting block abuts on the heat-dissipating plate. The second heat-conducting block has a second slope and a locking groove. The second slope is slidingly disposed on the first slope. The elastic element has a fixed end and a buckling end formed on one side of the fixed end. The fixed end is fixed in the fixing groove, and the buckling end is buckled into the locking groove. Via this arrangement, the heat-conducting efficiency of the heat-conducting assembly of the present invention can be improved.

Abstract translation: 导热组件安装在发热元件和散热板之间。 导热组件包括基座，第一导热块，第二导热块和弹性元件。 底座附着在发热元件上。 第一导热块设置在基座上。 第一导热块具有第一斜面和固定槽。 第二导热块邻接在散热板上。 第二导热块具有第二斜面和锁定槽。 第二斜坡滑动地设置在第一斜坡上。 弹性元件具有固定端和形成在固定端的一侧上的弯曲端。 固定端固定在固定槽中，并且弯曲端部弯曲到锁定槽中。 通过这种布置，可以提高本发明的导热组件的导热效率。

公开(公告)号：US20090159240A1

公开(公告)日：2009-06-25

申请号：US11960925

申请日：2007-12-20

Applicant: Chung-Jun CHU

Inventor： Chung-Jun CHU

IPC: F28F7/00

CPC classification number: H01L23/427 ,  H01L2924/0002 ,  H05K7/20336 ,  H01L2924/00

Abstract: A cooling structure, through a design of rail installed on an inner wall of a machine case, can be adjusted in corresponding to various electronic heating components disposed in the machine case, and freely moved to a position, where an electronic heating component is needed to conduct heat generated thereof to the machine case.

Abstract translation: 通过安装在机壳的内壁上的轨道设计的冷却结构可以根据设置在机器壳体中的各种电子加热部件进行调节，并且可自由地移动到需要电子加热部件的位置 将其产生的热量传导到机器壳体。