公开(公告)号：US20190110126A1

公开(公告)日：2019-04-11

申请号：US16150591

申请日：2018-10-03

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Scott Lyall CARGILL ,  Timothy John BROSNIHAN

IPC: H04R1/34 ,  H04R19/04 ,  H04R19/00 ,  B81B3/00

Abstract: The application relates to MEMS transducers comprising at least one support structure for connecting a backplate structure of the transducer with an underlying substrate. A strengthening portion is provided in the region of the support structure.

公开(公告)号：US20180148315A1

公开(公告)日：2018-05-31

申请号：US15810592

申请日：2017-11-13

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Tom HANLEY ,  Timothy John BROSNIHAN ,  Euan James BOYD

IPC: B81B3/00 ,  B81C1/00 ,  H04R9/08

CPC classification number: B81B3/001 ,  B81B2201/0257 ,  B81B2203/033 ,  B81B2203/0376 ,  B81B2207/012 ,  B81C1/00984 ,  B81C2201/115 ,  H04R9/08 ,  H04R19/005 ,  H04R19/04 ,  H04R31/006 ,  H04R2201/003

Abstract: The application describes a MEMS transducer comprising a substrate having a cavity. The transducer exhibits a membrane layer supported relative to the substrate to define a flexible membrane. An upper surface of the substrate comprises an overlap region between the edge of the cavity and a perimeter of the flexible membrane where the membrane overlies the upper surface of the substrate. At least one portion of the overlap region of the upper surface of the substrate is provided with a plurality of recesses. The recesses are defined so as to extend from the edge of the cavity towards the perimeter of the flexible membrane.