公开(公告)号：US20180057390A1

公开(公告)日：2018-03-01

申请号：US15560390

申请日：2016-03-23

Applicant: Corning Incorporated

Inventor： Thomas Hackert ,  Xinghua Li ,  Sasha Marjanovic ,  Moussa N'Gom ,  David Andrew Pastel ,  Garrett Andrew Piech ,  Daniel Schnitzler ,  Robert Stephen Wagner ,  James Joseph Watkins

IPC: C03B33/02 ,  B23K26/364 ,  C03C3/093

CPC classification number: C03B33/0222 ,  B23K26/364 ,  B23K26/53 ,  B23K2103/54 ,  C03B33/0215 ,  C03C3/093 ,  Y02P40/57

Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >0.25 m/sec, to cut sharp radii outer corners (

公开(公告)号：US11773004B2

公开(公告)日：2023-10-03

申请号：US15560390

申请日：2016-03-23

Applicant: Corning Incorporated

Inventor： Thomas Hackert ,  Xinghua Li ,  Sasha Marjanovic ,  Moussa N'Gom ,  David Andrew Pastel ,  Garrett Andrew Piech ,  Daniel Schnitzler ,  Robert Stephen Wagner ,  James Joseph Watkins

IPC: C03B33/02 ,  B23K26/364 ,  C03C3/093 ,  B23K26/53 ,  B23K103/00

CPC classification number: C03B33/0222 ,  B23K26/364 ,  B23K26/53 ,  C03B33/0215 ,  C03C3/093 ,  B23K2103/54 ,  Y02P40/57

Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >0.25 m/sec, to cut sharp radii outer corners (

公开(公告)号：US10377658B2

公开(公告)日：2019-08-13

申请号：US15657320

申请日：2017-07-24

Applicant: Corning Incorporated

Inventor： Daniel Schnitzler ,  Helmut Schillinger

IPC: C03B33/02 ,  B23K26/00 ,  B23K26/53 ,  B23K26/073 ,  B23K26/08 ,  C03B33/09 ,  B23K26/0622 ,  B23K103/00 ,  B23K101/40

Abstract: A workpiece may be laser processed by a method that may include forming a contour line in the workpiece, and directing an infrared laser beam onto the workpiece along or near the contour line to separate the workpiece along the contour line. The contour line may include defects in the workpiece. The infrared laser beam may have a beam profile such that a greater distribution of cumulated energy from the infrared laser beam is located in areas adjacent to the contour line than directly on the contour line.

公开(公告)号：US20180029919A1

公开(公告)日：2018-02-01

申请号：US15657320

申请日：2017-07-24

Applicant: Corning Incorporated

Inventor： Daniel Schnitzler ,  Helmut Schillinger

IPC: C03B33/02 ,  B23K26/00 ,  B23K26/53 ,  B23K26/073

CPC classification number: C03B33/0222 ,  B23K26/0006 ,  B23K26/0624 ,  B23K26/0734 ,  B23K26/0738 ,  B23K26/08 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/54 ,  C03B33/091

Abstract: A workpiece may be laser processed by a method that may include forming a contour line in the workpiece, and directing an infrared laser beam onto the workpiece along or near the contour line to separate the workpiece along the contour line. The contour line may include defects in the workpiece. The infrared laser beam may have a beam profile such that a greater distribution of cumulated energy from the infrared laser beam is located in areas adjacent to the contour line than directly on the contour line.