公开(公告)号：US20060001703A1

公开(公告)日：2006-01-05

申请号：US10880898

申请日：2004-06-30

申请人： Craig Bertelsen ,  James Mrvos ,  Paul Spivey ,  Melissa Waldeck ,  Sean Weaver

发明人： Craig Bertelsen ,  James Mrvos ,  Paul Spivey ,  Melissa Waldeck ,  Sean Weaver

IPC分类号： B41J2/05

CPC分类号： B41J2/17559

摘要： A micro-fluid ejection device structure, a multi-fluid cartridge containing the ejection device structure, and methods for making the ejection device structure and cartridge. The ejection device includes an ejection head substrate having a fluid supply side and a device side and containing two or more fluid flow paths therein for supplying fluid from the fluid supply side to the device side thereof. A multi-channel manifold is attached to the fluid supply side of the ejection head substrate for providing fluid from two or more fluid reservoirs to the fluid flow paths in the ejection head substrate. The multi-channel manifold has fluid flow channels therein in fluid flow communications with the fluid flow paths in the ejection head substrate and the manifold consists essentially of a patterned photoresist material.

摘要翻译： 微流体喷射装置结构，包含喷射装置结构的多流体盒，以及用于制造喷射装置结构和盒的方法。 喷射装置包括具有流体供给侧和装置侧的喷射头基板，并且在其中包含用于将流体从流体供应侧供应到其装置侧的两个或更多个流体流动路径。 多通道歧管连接到喷射头基板的流体供应侧，用于将流体从两个或更多个流体储存器提供到喷射头基板中的流体流动路径。 多通道歧管在其中具有与喷射头基底中的流体流动通路的流体流动通道，并且歧管基本上由图案化的光致抗蚀剂材料组成。

公开(公告)号：US20060000090A1

公开(公告)日：2006-01-05

申请号：US10880899

申请日：2004-06-30

申请人： Mary Smoot ,  Paul Spivey ,  Melissa Waldeck ,  Craig Bertelsen ,  Sean Weaver

发明人： Mary Smoot ,  Paul Spivey ,  Melissa Waldeck ,  Craig Bertelsen ,  Sean Weaver

IPC分类号： B21D53/76

CPC分类号： B41J2/17559 ,  B41J2/17513 ,  B41J2/1752 ,  B41J2/17526 ,  B41J2/17553 ,  C07D235/18 ,  C07D401/12 ,  C07D403/12 ,  Y10S29/001 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49401 ,  Y10T29/49798 ,  Y10T156/1062

摘要： A method is provided for making a multi-fluid cartridge for holding multiple fluids in segregated containment localities. The cartridge body contains fluid supply paths in fluid flow communication with the containment localities. A nozzle plate is attached to a device side of each of a plurality of defined ejection head substrates on a semiconductor wafer. Each of the ejection head substrates has a fluid supply side and two or more fluid flow paths therein for supplying fluid from the supply side to the device side thereof. The fluid flow paths in the ejection head substrates have a flow path density of greater than about 1.0 flow paths per millimeter. The wafer is diced to provide a plurality of micro-fluid ejection device structures. A circuit device is attached to the device side of each of the substrates. An adhesive is stencil printed with a bond line density of at least about 1.2 mm−1 on the micro-fluid ejection device structures or on the cartridge body. At least one of the micro-fluid ejection device structures and attached circuit is adhesively bonded to the cartridge body for flow of fluid from the containment localities to the device side thereof.

摘要翻译： 提供了一种用于制造用于将多个流体保持在分离的容纳区域中的多流体盒的方法。 盒体包含与容纳部位流体连通的流体供给路径。 在半导体晶片上的多个限定的喷墨头基板的每一个的装置侧附着喷嘴板。 每个喷射头基板具有流体供应侧和两个或更多个流体流动路径，用于将流体从供给侧提供到其装置侧。 喷射头基板中的流体流动路径具有大于约1.0流动路径/毫米的流路密度。 切割晶片以提供多个微流体喷射装置结构。 电路装置连接到每个基板的装置侧。 在微流体喷射装置结构上或筒体上的粘合线密度为至少约1.2mm -1的粘合线密度的粘合剂。 微流体喷射装置结构和附接电路中的至少一个被粘合到盒主体上，用于将流体从容纳区域流动到其装置侧。

公开(公告)号：US20060213060A1

公开(公告)日：2006-09-28

申请号：US11386174

申请日：2006-03-22

申请人： Mary Smoot ,  Paul Spivey ,  Melissa Waldeck ,  Craig Bertelsen ,  Sean Weaver

发明人： Mary Smoot ,  Paul Spivey ,  Melissa Waldeck ,  Craig Bertelsen ,  Sean Weaver

IPC分类号： B21D53/76 ,  H05K3/10

CPC分类号： B41J2/17559 ,  B41J2/17513 ,  B41J2/1752 ,  B41J2/17526 ,  B41J2/17553 ,  C07D235/18 ,  C07D401/12 ,  C07D403/12 ,  Y10S29/001 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49401 ,  Y10T29/49798 ,  Y10T156/1062

摘要： A method is provided for making a multi-fluid cartridge for holding multiple fluids in segregated containment localities. The cartridge body contains fluid supply paths in fluid flow communication with the containment localities. A nozzle plate is attached to a device side of each of a plurality of defined ejection head substrates on a semiconductor wafer. Each of the ejection head substrates has a fluid supply side and two or more fluid flow paths therein for supplying fluid from the supply side to the device side thereof. The fluid flow paths in the ejection head substrates have a flow path density of greater than about 1.0 flow paths per millimeter. The wafer is diced to provide a plurality of micro-fluid ejection device structures. A circuit device is attached to the device side of each of the substrates. An adhesive is stencil printed with a bond line density of at least about 1.2 mm−1 on the micro-fluid ejection device structures or on the cartridge body. At least one of the micro-fluid ejection device structures and attached circuit is adhesively bonded to the cartridge body for flow of fluid from the containment localities to the device side thereof.

公开(公告)号：US20050200660A1

公开(公告)日：2005-09-15

申请号：US10800989

申请日：2004-03-15

申请人： Jonathon Laurer ,  Paul Spivey ,  Melissa Waldeck ,  John Warren

发明人： Jonathon Laurer ,  Paul Spivey ,  Melissa Waldeck ,  John Warren

IPC分类号： B41J2/14 ,  B41J2/16

CPC分类号： B41J2/1433 ,  B41J2/162 ,  B41J2/1623 ,  B41J2/1634 ,  B41J2002/14387 ,  B41J2002/14491

摘要： The invention provides a micro-fluid ejection head for a micro-fluid ejection device and a method for making a micro-fluid ejection head. The micro-fluid ejection head includes a semiconductor substrate containing fluid ejection devices electrically connected to contact pads on a surface thereof. A TAB circuit including lead beams is electrically connected to the contact pads on the semiconductor substrate surface. A nozzle plate structure is provided and installed relative to the TAB circuit so as to substantially cover the lead beams and contact pads in order to protect the lead beams and contact pads from exposure to fluid ejected by the micro-fluid ejection device. The micro-fluid ejection head is effective to reduce contact between electrical components and the fluid without the use of a separate encapsulant material.

摘要翻译： 本发明提供了一种用于微流体喷射装置的微流体喷射头和用于制造微流体喷射头的方法。 微流体喷射头包括含有与其表面上的接触焊盘电连接的流体喷射装置的半导体衬底。 包括引导光束的TAB电路电连接到半导体衬底表面上的接触焊盘。 提供并相对于TAB电路安装喷嘴板结构，以便基本上覆盖引导梁和接触垫，以便保护引导梁和接触垫不被暴露于由微流体喷射装置喷射的流体。 微流体喷射头有效地减少电气部件和流体之间的接触，而不使用单独的密封剂材料。

公开(公告)号：US20060001704A1

公开(公告)日：2006-01-05

申请号：US10881961

申请日：2004-06-30

申请人： Frank Anderson ,  Jeffery Buchanan ,  Curtis Droege ,  David Greer ,  Kin Kwan ,  Gregory Long ,  Ganesh Phatak ,  Paul Spivey ,  Carl Sullivan ,  Kent Ubellacker ,  Melissa Waldeck

发明人： Frank Anderson ,  Jeffery Buchanan ,  Curtis Droege ,  David Greer ,  Kin Kwan ,  Gregory Long ,  Ganesh Phatak ,  Paul Spivey ,  Carl Sullivan ,  Kent Ubellacker ,  Melissa Waldeck

IPC分类号： B41J2/05

CPC分类号： B41J2/17513

摘要： A multi-fluid body and an ejection head substrate connected in fluid flow communication with the multi-fluid body for ejecting multiple fluids therefrom. The multi-fluid body includes at least two segregated fluid chambers. Independent fluid supply paths lead from each of the fluid chambers providing fluid to multiple fluid flow paths in the ejection head substrate. The ejection head substrate is attached adjacent an ejection head area of the body. The fluid flow paths in the ejection head substrate have a flow path density of greater than about one flow paths per millimeter.

摘要翻译： 多流体和喷射头基板，其与多流体主体流体连通地连通，用于从其中喷射多个流体。 多流体包括至少两个分离的流体室。 独立的流体供应路径从每个流体室引导，以提供流体到喷射头基板中的多个流体流动路径。 喷射头基板被附接在身体的喷射头部区域附近。 喷射头基板中的流体流动路径具有大于每毫米约一个流动路径的流路密度。

公开(公告)号：US20070076044A1

公开(公告)日：2007-04-05

申请号：US11241218

申请日：2005-09-30

申请人： Richard Corley ,  Brian Hart ,  James Mrvos ,  Paul Spivey

发明人： Richard Corley ,  Brian Hart ,  James Mrvos ,  Paul Spivey

IPC分类号： B41J2/165

CPC分类号： B41J2/17536

摘要： Sealing tapes, such as those utilizing an ultra-thin adhesive layer for attaching the sealing tape to the nozzle member of an ink jet printhead. One such ultra-thin adhesive has a thickness of 3 microns or less, and can be applied using pressure or both heat and pressure.

摘要翻译： 密封带，例如利用超薄粘合剂层的密封带，用于将密封带附着到喷墨打印头的喷嘴构件上。 一种这样的超薄粘合剂具有3微米或更小的厚度，并且可以使用压力或热和压力施加。

公开(公告)号：US20070120890A1

公开(公告)日：2007-05-31

申请号：US11699295

申请日：2007-01-29

申请人： Paul Spivey ,  William Rose

发明人： Paul Spivey ,  William Rose

IPC分类号： B41J2/135

CPC分类号： B41J2/14072

摘要： An inkjet printhead has a body and a heater chip attached thereto. A nozzle plate on the heater chip includes a periphery and plurality of nozzle holes. An encapsulant bead lines the periphery of the nozzle plate and has a leading edge extending in a direction away from the periphery toward the plurality of nozzle holes. The boundary of the bead embodies an irregular shape and the leading edge exists less than about 500 microns from any of the nozzle holes. A tape attaches to the nozzle plate and covers each of the nozzle holes. The tape does not, however, touch the encapsulant bead. Preferably, the tape has a narrow width portion shorter than a width of the nozzle plate. In this manner, the encapsulant bead may encroach upon the nozzle holes closer than heretofore known. In turn, the heater chip can have reduced size and silicon savings.

摘要翻译： 喷墨打印头具有附接到其上的主体和加热器芯片。 加热器芯片上的喷嘴板包括周边和多个喷嘴孔。 密封剂珠沿着喷嘴板的周边排列，并且具有沿远离周边的方向朝向多个喷嘴孔延伸的前缘。 珠的边界体现为不规则形状，并且前缘离任何喷嘴孔小于约500微米。 胶带附着在喷嘴板上并覆盖每个喷嘴孔。 然而，胶带不接触密封剂珠。 优选地，带具有比喷嘴板的宽度短的宽度部分。 以这种方式，密封剂珠可能比以前已知的更接近喷嘴孔。 反过来，加热器芯片可以减小尺寸并节省硅。

公开(公告)号：US20060068111A1

公开(公告)日：2006-03-30

申请号：US10956938

申请日：2004-09-30

申请人： Jonathan Laurer ,  Jeanne Singh ,  Paul Spivey ,  Mary Smoot

发明人： Jonathan Laurer ,  Jeanne Singh ,  Paul Spivey ,  Mary Smoot

IPC分类号： B05D5/00

CPC分类号： B41J2/1601 ,  B41J2/1623 ,  B41M1/12 ,  B41M3/006 ,  Y10T29/49401 ,  Y10T156/1798

摘要： A progressive stencil printing system and method for applying encapsulant onto an inkjet printhead body is described. The system relates to a continuous stencil printing apparatus that can print encapsulant on different types of inkjet printhead bodies and clean the stencil during production.

摘要翻译： 描述了将密封剂施加到喷墨打印头主体上的渐进式模板印刷系统和方法。 该系统涉及一种可在不同类型的喷墨打印头主体上印刷密封剂并在生产期间清洁模板的连续模版印刷设备。

公开(公告)号：US20050174386A1

公开(公告)日：2005-08-11

申请号：US10775939

申请日：2004-02-10

申请人： Paul Spivey ,  William Rose

发明人： Paul Spivey ,  William Rose

IPC分类号： B41J2/14

CPC分类号： B41J2/14072

摘要： An inkjet printhead has a body and a heater chip attached thereto. A nozzle plate on the heater chip includes a periphery and plurality of nozzle holes. An encapsulant bead lines the periphery of the nozzle plate and has a leading edge extending in a direction away from the periphery toward the plurality of nozzle holes. The boundary of the bead embodies an irregular shape and the leading edge exists less than about 500 microns from any of the nozzle holes. A tape attaches to the nozzle plate and covers each of the nozzle holes. The tape does not, however, touch the encapsulant bead. Preferably, the tape has a narrow width portion shorter than a width of the nozzle plate. In this manner, the encapsulant bead may encroach upon the nozzle holes closer than heretofore known. In turn, the heater chip can have reduced size and silicon savings.

摘要翻译： 喷墨打印头具有附接到其上的主体和加热器芯片。 加热器芯片上的喷嘴板包括周边和多个喷嘴孔。 密封剂珠沿着喷嘴板的周边排列，并且具有沿远离周边的方向朝向多个喷嘴孔延伸的前缘。 珠的边界体现为不规则形状，并且前缘离任何喷嘴孔小于约500微米。 胶带附着在喷嘴板上并覆盖每个喷嘴孔。 然而，胶带不接触密封剂珠。 优选地，带具有比喷嘴板的宽度短的宽度部分。 以这种方式，密封剂珠可能比以前已知的更接近喷嘴孔。 反过来，加热器芯片可以减小尺寸并节省硅。

公开(公告)号：US20050099449A1

公开(公告)日：2005-05-12

申请号：US10704427

申请日：2003-11-07

申请人： Tim Frasure ,  James Kerr ,  Steven Komplin ,  Paul Spivey

发明人： Tim Frasure ,  James Kerr ,  Steven Komplin ,  Paul Spivey

IPC分类号： B41J2/16 ,  B41J2/175 ,  B41J2/015

CPC分类号： B41J2/17506 ,  B29C65/16 ,  B29C65/1635 ,  B29C65/76 ,  B29C66/112 ,  B29C66/114 ,  B29C66/53461 ,  B29L2031/767 ,  Y10T29/49401

摘要： Methods for disassembling at least two components of an inkjet printhead include applying heat, preferably in the form of laser energy, to one of the components and wholly or partially separating the components thereafter. The disassembly enables ease of refilling the inkjet printhead or replacing original parts. In one embodiment, the components comprise inkjet printhead lids and bodies originally laser welded to one another. In another aspect, methods of disassembly include laser unwelding inkjet printhead lids and bodies according to whether the inkjet printhead body embodies a mono or color ink body type through use of selective control of one or more laser light sources to illuminate the inkjet printhead lid in a specific pattern of light. Still other aspects include a disassembled inkjet printhead having components with laser welding residue thereon. The laser welding residue may have substantially matching edge lines between the two components.

摘要翻译： 用于拆卸喷墨打印头的至少两个部件的方法包括将优选以激光能量的形式的热量施加到其中一个部件，然后将部件全部或部分分离。 拆卸使得易于重新填充喷墨打印头或更换原始部件。 在一个实施例中，组件包括原始地彼此激光焊接的喷墨打印头盖和主体。 在另一方面，拆卸方法包括根据喷墨打印头体是否通过选择性地控制一个或多个激光源以喷墨打印头盖来照亮喷墨打印头盖来体现单色或彩色墨体型的激光焊接喷墨打印头盖和主体 具体的光线模式。 还有其它方面包括具有在其上具有激光焊接残留的部件的分解的喷墨打印头。 激光焊接残余物可以在两个部件之间具有基本匹配的边缘线。