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公开(公告)号：US06966440B1
公开(公告)日：2005-11-22
申请号：US10215500
申请日：2002-08-12
CPC分类号： H05K13/0084 , H01R12/58 , H01R43/205 , Y10S206/82
摘要： A non-intrusive surface mount interconnect that provides a through-hole interconnect to the opposite side of a PCB board. A headed pin (head up/shank down) can be picked by standard placement equipment from a specially configured pocket tape using a hole that is tightly controlled for pin location. The head of the pin rests on top of the packaging tape preventing the pin from passing through the hole. A tapered section on the pin fits with minimal clearence assuring that a vacuum nozzle on the placement equipment when it descends sees and contacts the head top for vacuum nozzle pick-up.
摘要翻译： 一种非侵入式表面贴装互连，可在PCB板的相对侧提供通孔互连。 通过标准配置设备，可以使用专门配置的口袋式胶带，使用针脚位置紧密控制的孔来拾取带头的针头（抬头/向下）。 销的头部位于包装胶带的顶部，防止销穿过孔。 销上的锥形部分具有最小的清晰度，确保放置设备下降时的真空喷嘴可以看到并接触顶部，用于真空吸嘴。
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2.发明授权Connector with base having channels to facilitate surface mount solder attachment 失效带底座的连接器具有便于表面贴装焊接附件的通道公开(公告)号：US06623283B1
公开(公告)日：2003-09-23
申请号：US10027894
申请日：2001-12-20
IPC分类号： H01R402
CPC分类号： H01R12/57 , H01R43/0256 , H01R43/0263 , H05K3/3426 , H05K13/0465 , Y02P70/613
摘要： A surface mount connector for circuit board attachment is provided in the form of an elongate pin with a head or base formed at the lower end of the pin. The base has a bottom surface that extends substantially normal to the axis of the pin and is dimensioned to be positioned on, and soldered to, a pad on a primary circuit board. A solder bond is achieved by re-flowing a quantity of solder applied to the pad along with a quantity of flux before placing the base on top of the quantity of solder. The base is formed with a plurality of channels that open through the bottom surface and through a peripheral wall of the base for permitting gases generated by vaporizing the flux during solder re-flow to escape from underneath the base and to increase the strength of the solder bond between the pad and the base. Exhaustion of the gases prevents undesirable skating of the connector and misalignment and eliminates voids in the solder bond that would otherwise weaken the bond.
摘要翻译： 用于电路板连接的表面安装连接器以细长销的形式提供，其头部或底部形成在销的下端。 基座具有基本上垂直于销的轴线延伸的底表面，并且尺寸设计成定位在主电路板上的焊盘上并焊接到主电路板上的焊盘。 通过在将基底放置在焊料量的顶部之前，将一定数量的焊料与一定量的焊剂一起重新流动，来实现焊接接合。 底座形成有多个通道，该通道穿过底部表面并穿过底座的周边壁，用于允许在焊料重新流动期间汽化助焊剂而产生的气体从底部下方逸出并增加焊料的强度 垫与基座之间的接合。 气体的耗尽可防止连接器的不希望的滑冰和不对准，并且消除焊料接合中的空隙，否则会削弱接合。
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