-
公开(公告)号：US06976855B2
公开(公告)日：2005-12-20
申请号：US10843972
申请日：2004-05-13
CPC分类号： H01R43/0235 , H01R4/028 , H01R12/52 , H05K3/3405 , H05K3/3447 , H05K3/366 , H05K2201/10303 , H05K2203/042
摘要： A solder transfer method which uses an electrically-conductive, e.g., metal, surface, of a stamping or pin or pad as a vehicle to transfer molten solder from a remote solder reserve to a solder joint to be made. In one of the preferred embodiments, a solder deposit previously formed on a surface mount pad during a first reflow step will transfer up to the adjoining contact surfaces by a wicking process to provide the additional solder needed to fabricate a robust solder joint. The method and construction are useful for attaching a daughter board to motherboard, and for surface mounting a long header with multiple pins to the contact surfaces of a PCB without the need to separately add solder during a second reflow step to make a robust solder joint between the contact surfaces.
摘要翻译： 使用冲压或引脚或焊盘的导电的例如金属表面作为车辆的焊接转移方法将熔融焊料从远程焊料储存器转移到待制造的焊点。 在优选实施例之一中，在第一回流步骤期间预先形成在表面安装焊盘上的焊料沉积物将通过芯吸工艺传递到相邻的接触表面，以提供制造坚固的焊接接头所需的附加焊料。 该方法和结构对于将子板附接到主板是有用的，并且用于将具有多个引脚的长插头表面安装到PCB的接触表面，而不需要在第二回流步骤期间单独添加焊料，以在第二回流步骤之间形成牢固的焊接接头 接触面。
-
公开(公告)号：US06966440B1
公开(公告)日：2005-11-22
申请号：US10215500
申请日：2002-08-12
CPC分类号： H05K13/0084 , H01R12/58 , H01R43/205 , Y10S206/82
摘要： A non-intrusive surface mount interconnect that provides a through-hole interconnect to the opposite side of a PCB board. A headed pin (head up/shank down) can be picked by standard placement equipment from a specially configured pocket tape using a hole that is tightly controlled for pin location. The head of the pin rests on top of the packaging tape preventing the pin from passing through the hole. A tapered section on the pin fits with minimal clearence assuring that a vacuum nozzle on the placement equipment when it descends sees and contacts the head top for vacuum nozzle pick-up.
摘要翻译： 一种非侵入式表面贴装互连，可在PCB板的相对侧提供通孔互连。 通过标准配置设备，可以使用专门配置的口袋式胶带，使用针脚位置紧密控制的孔来拾取带头的针头（抬头/向下）。 销的头部位于包装胶带的顶部，防止销穿过孔。 销上的锥形部分具有最小的清晰度，确保放置设备下降时的真空喷嘴可以看到并接触顶部，用于真空吸嘴。
-
公开(公告)号：US06700079B2
公开(公告)日：2004-03-02
申请号：US10084125
申请日：2002-02-28
IPC分类号： H05K100
CPC分类号： H05K3/3426 , H01L2924/00013 , H01R4/024 , H01R43/0235 , H01R43/0249 , H05K3/3447 , Y02P70/613 , H01L2224/29099
摘要： Upper and lower planar circuit boards are connected in spaced apart parallel relationship by a plurality of contacts each made of a conductive pin, insulative collar and solder ball. The upper ends of the pins are inserted in plated though holes in the upper circuit board and soldered thereto by wave soldering or re-flow. The pins have shoulders to establish the penetration of the pins into the upper circuit board. The lower ends of the pins are bonded to conductive pads on the lower circuit board via the solder balls that are maintained in substantially spherical configuration by the insulative collars and accommodate variations in board co-planarity or pin length. Where the lower ends of the pins do not contact their corresponding conductive pads the volume of solder in the solder balls allows reliable fillet solder joints to be formed.
摘要翻译： 上下平面电路板通过由导电针，绝缘套圈和焊球制成的多个触点以间隔开的平行关系连接。 销的上端插入上电路板的电镀通孔中，并通过波峰焊或再流动焊接。 针脚有肩部以确定销钉穿入上部电路板。 引脚的下端通过焊球焊接在下电路板上的导电焊盘上，该焊球通过绝缘套圈保持基本上为球形，并适应板的共平面性或引脚长度的变化。 在引脚的下端不与其相应的导电焊盘接触的情况下，焊球中的焊料体积允许形成可靠的圆角焊点。
-
公开(公告)号：US06610253B2
公开(公告)日：2003-08-26
申请号：US09777784
申请日：2001-02-05
IPC分类号： B01L302
CPC分类号： B01L3/0244 , B01J19/0046 , B01J2219/00387 , B01J2219/00527 , B01J2219/00585 , B01J2219/00596 , B01J2219/00605 , B01J2219/00621 , B01J2219/00659 , C40B60/14 , G01N35/1074 , G01N2035/1037 , Y10T436/2575
摘要： Several pin transfer assemblies are disclosed that utilize the surface tension of liquids for picking up and dispensing minute volumes of liquid from wells in a first well plate to a flat substrate surface or into wells in a second well plate. In one embodiment, a plurality of pins reciprocate through complementary arrays of holes in a base plate and an overlying spring plate biased apart by coil springs located around the periphery of the base plate. A foam layer sits on top of the spring plate and a weight plate sits on top of the foam layer. A single coil spring is positioned between a center of the weight plate and the cover to push the weight plate downwardly. The periphery of the cover guides the vertical movement of the weight plate and is connected to the periphery of the base plate. The periphery of the base plate is supported by a frame used to register the pin assembly in a receptacle of a manual or automated liquid transfer apparatus.
摘要翻译： 公开了几种销传送组件，其利用液体的表面张力来从第一孔板中的井到平坦衬底表面或第二孔板中的孔中拾取和分配微小体积的液体。 在一个实施例中，多个销通过基板中的孔的互补阵列往复运动，以及由位于基板周边的螺旋弹簧偏置的上覆弹簧板。 泡沫层位于弹簧板的顶部，重量板位于泡沫层的顶部。 单个螺旋弹簧位于配重板的中心和盖之间，以向下推动配重板。 盖的周边引导重物板的垂直运动并连接到基板的周边。 基板的周边由用于将销组件对准在手动或自动液体输送装置的容器中的框架支撑。
-
公开(公告)号：US06579499B1
公开(公告)日：2003-06-17
申请号：US09584616
申请日：2000-05-31
IPC分类号： B01L302
CPC分类号： B01L3/0244 , B01J19/0046 , B01J2219/00387 , B01J2219/00527 , B01J2219/00585 , B01J2219/00596 , B01J2219/00605 , B01J2219/00659 , C40B60/14 , G01N35/1074 , G01N2035/1037 , Y10T436/2575
摘要： A pin replicator is disclosed for dispensing minute volumes of liquid onto a substrate surface in an array in connection with drug discovery, diagnostic analysis, and other applications. The pin replicator comprises a base plate, a plurality of pins reciprocable through corresponding holes in the base plate, and a free floating weight plate resting on top of the upper ends of the pins. The weight plate biases the pins toward their fully extended lowered positions. A cover attaches to the base plate, encloses the pins and weight plate and guides the weight plate during vertical movement thereof. The pin replicator can be moved downwardly toward a first micro titer plate so that a lower end of each of the pins contacts the sample liquid in the corresponding well a sufficient amount to pick up and retain a small quantity of the sample liquid due to surface tension. The pin replicator can thereafter be moved downwardly toward a second micro titer plate so that the lower end of each of the pins is sufficiently close to a corresponding well of the second micro titer plate so that the small quantity of the sample liquid on the lower end of each of the pins contacts an upper surface of the corresponding well of the second micro titer plate.
摘要翻译： 公开了一种销复制器，其用于将药物发现，诊断分析和其它应用与微量体积的液体分配到阵列中的基底表面上。 销复制器包括基板，可通过基板中的相应孔往复运动的多个销，以及搁置在销的上端顶部的自由浮动重物板。 重量板将销朝向完全伸出的下降位置偏压。 盖子连接到基板上，包围销和配重板，并在其垂直运动期间引导重物板。 销复制器可以向下移动朝向第一微型滴定板，使得每个销的下端与对应的井中的样品液体接触足够的量以吸收并保持少量的样品液体，由于表面张力 。 然后，针式复制器可以向下移动到第二微型滴定板，使得每个销的下端足够靠近第二微量滴定板的对应孔，使得少量的下端的样品液体 的每个销接触第二微量滴定板的相应孔的上表面。
-
公开(公告)号：US06780028B1
公开(公告)日：2004-08-24
申请号：US10310215
申请日：2002-12-06
IPC分类号： H01R1200
CPC分类号： H01R43/0235 , H01R4/028 , H01R12/52 , H05K3/3405 , H05K3/3447 , H05K3/366 , H05K2201/10303 , H05K2203/042
摘要： A solder transfer method which uses an electrically-conductive, e.g., metal, surface, of a stamping or pin or pad as a vehicle to transfer molten solder from a remote solder reserve to a solder joint to be made. In a preferred embodiment, a solder deposit previously-formed on a surface mount pad during a first reflow step will transfer up to the adjoining contact surfaces by a wicking process to provide the additional solder needed to fabricate a robust solderjoint. When one of the contact surfaces is a contact or pin on a first PCB, and the other contact surface is a SMT pad on a second PCB serving, for example, as a memory card, the process of the invention makes for an easy SMT processed attachment of the memory card to the first PCB without the need to add solder during a second reflow step to make a robust solder joint between the contact surfaces.
摘要翻译： 使用冲压或引脚或焊盘的导电的例如金属表面作为车辆的焊接转移方法将熔融焊料从远程焊料储存器转移到待制造的焊点。 在优选实施例中，在第一回流步骤期间预先形成在表面安装焊盘上的焊料沉积物将通过芯吸工艺传递到相邻的接触表面，以提供制造坚固的焊接点所需的附加焊料。 当其中一个接触表面是第一PCB上的触点或引脚，另一个接触表面是第二个PCB上的SMT焊盘，例如作为存储卡时，本发明的工艺使得SMT处理容易 将存储卡连接到第一PCB，而不需要在第二回流步骤期间添加焊料以在接触表面之间形成坚固的焊接接头。
-
7.发明授权Hybrid solder ball and pin grid array circuit board interconnect system and method 失效混合焊球和针阵阵列电路板互连系统及方法公开(公告)号：US06272741B1
公开(公告)日：2001-08-14
申请号：US09122225
申请日：1998-07-24
IPC分类号： H05K336
CPC分类号： H01R12/523 , H01L2224/16225 , H01L2924/00014 , H01L2924/15312 , H01R4/02 , H05K3/3426 , H05K3/3436 , H05K7/1092 , H05K2201/10318 , H05K2201/10704 , H05K2203/041 , Y02P70/613 , Y10T29/49126 , Y10T29/49149 , H01L2224/0401
摘要： A circuit board interconnect system includes a carrier board with a hybrid solder ball and pin grid array. A plurality of electrically conductive pins extend through the carrier board and are arranged in rows and columns to form a grid array. A first circuit board such as a multi-chip module (MCM) board has a plurality of conductive pads or traces formed on a lower surface thereof that are arranged to form a complementary grid array, i.e. the spacing and location of the conductive pads or traces corresponds to the spacing and location of the pins. A plurality of solder balls are provided with each ball being positioned on top of a corresponding pin so that each solder ball forms a solder connection between a pin and a corresponding conductive pad or trace. A second circuit board such as a computer mother board has a pin connector mounted on an upper surface thereof for individually receiving and providing electrical connection with each of the pins. After reflow, the solder balls wrap around the side walls of the heads of the pins and the side walls of the pads. The resulting generally spherical solder connections are therefore much stronger than conventional elongated fillet connections.
摘要翻译： 电路板互连系统包括具有混合焊球和引脚格栅阵列的载板。 多个导电针延伸穿过载板并且以行和列布置以形成网格阵列。 诸如多芯片模块（MCM）板的第一电路板具有形成在其下表面上的多个导电焊盘或迹线，其布置成形成互补的栅格阵列，即导电焊盘或迹线的间隔和位置 对应于销的间距和位置。 设置多个焊球，每个球位于相应销的顶部，使得每个焊球在销和相应的导电焊盘或迹线之间形成焊接连接。 诸如计算机母板的第二电路板具有安装在其上表面上的引脚连接器，用于单独地接收并提供与每个引脚的电连接。 在回流之后，焊球围绕销的头部的侧壁和垫的侧壁。 因此，所得到的大体上球形的焊接连接比传统的细长圆角连接强得多。
-
-
-
-
-
-
搜索结果
7 条记录 (耗时 0.015 秒)
