公开(公告)号：US20210159368A1

公开(公告)日：2021-05-27

申请号：US16690707

申请日：2019-11-21

Applicant: Cree, Inc.

Inventor： David Suich ,  Daniel E. Stasiw ,  Samuel Richard Harrell, JR.

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/50

Abstract: Submount structures for light-emitting diode (LED) packages are provided. Submounts may include a base material that is configured to provide high thermal conductivity and a ceramic layer on the base material that is configured to provide high reflectivity for one or more LED chips that are mounted thereon. In certain aspects, the base material may include a ceramic base having a ceramic material that is different than a material of the ceramic layer. In certain aspects, submounts may also include additional ceramic layers configured to provide high reflectivity. In certain aspects, LED packages include electrical traces that are arranged either on one or more ceramic layers or at least partially embedded within one or more ceramic layers. The arrangement of such ceramic layers may provide increased reflectivity in areas where it may be difficult for other reflective materials to be present, such as gaps formed between tightly spaced electrical traces.

公开(公告)号：US20200075813A1

公开(公告)日：2020-03-05

申请号：US16118779

申请日：2018-08-31

Applicant: Cree, Inc.

Inventor： Sung Chul Joo ,  Kenneth M. Davis ,  David Suich ,  Jae-Hyung Park ,  Arthur F. Pun

IPC: H01L33/50 ,  H01L33/10 ,  H01L33/36 ,  H01L33/62

Abstract: Light-emitting diodes (LEDs), LED arrays, and related devices are disclosed. An LED device includes a first LED chip and a second LED chip mounted on a submount with a light-altering material in between. The light-altering material may include at least one of a light-reflective material and/or a light-absorbing material. Individual wavelength conversion elements may be arranged on each of the first and second LED chips. The light-altering material may improve the contrast between the first and second LED chips as well as between the individual wavelength conversion elements. LED devices may include submounts in modular configurations where LED chips may be mounted on adjacent submounts to form an LED array. Each LED chip of the LED array may be laterally separated from at least one other LED chip by a same distance and a light-altering material may be arranged around the LED array.

公开(公告)号：US20210134766A1

公开(公告)日：2021-05-06

申请号：US16675750

申请日：2019-11-06

Applicant: Cree, Inc.

Inventor： David Suich ,  Arthur F. Pun ,  Colin Blakely

IPC: H01L25/075 ,  H01L33/26 ,  H01L33/62

Abstract: Lumiphoric material region arrangements are provided for light-emitting diode (LED) packages. Certain aspects relate to arrangements of light-altering materials and lumiphoric material regions for LED packages. Lumiphoric material regions over corresponding LED chips may include increased sizes relative to overall LED package dimensions. Lumiphoric material regions may be arranged to extend to certain peripheral edges of an LED package. Multiple lumiphoric material regions and corresponding LED chips may be arranged in close proximity to one another to provide LED packages with multiple and selectable illumination characteristics. Light-altering materials may be arranged that at least partially define certain peripheral edges of lumiphoric material regions. The light-altering materials may form one or more nonintersecting segments arranged about the lumiphoric material regions. Certain aspects relate to LED packages having one or more of reduced sizes, increased light output, and reduced fabrication steps.

公开(公告)号：US11024613B2

公开(公告)日：2021-06-01

申请号：US16675750

申请日：2019-11-06

Applicant: Cree, Inc.

Inventor： David Suich ,  Arthur F. Pun ,  Colin Blakely

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/26

Abstract: Lumiphoric material region arrangements are provided for light-emitting diode (LED) packages. Certain aspects relate to arrangements of light-altering materials and lumiphoric material regions for LED packages. Lumiphoric material regions over corresponding LED chips may include increased sizes relative to overall LED package dimensions. Lumiphoric material regions may be arranged to extend to certain peripheral edges of an LED package. Multiple lumiphoric material regions and corresponding LED chips may be arranged in close proximity to one another to provide LED packages with multiple and selectable illumination characteristics. Light-altering materials may be arranged that at least partially define certain peripheral edges of lumiphoric material regions. The light-altering materials may form one or more nonintersecting segments arranged about the lumiphoric material regions. Certain aspects relate to LED packages having one or more of reduced sizes, increased light output, and reduced fabrication steps.

公开(公告)号：US20200075822A1

公开(公告)日：2020-03-05

申请号：US16545357

申请日：2019-08-20

Applicant: Cree, Inc.

Inventor： David Suich ,  Arthur F. Pun ,  Kenneth M. Davis

IPC: H01L33/60 ,  H01L33/50 ,  H01L25/075

Abstract: Light-emitting diodes (LEDs), LED arrays, and related devices are disclosed. An LED device includes a first LED chip and a second LED chip mounted on a submount with a light-altering material in between. The light-altering material may include at least one of a light-reflective material and/or a light-absorbing material. Individual wavelength conversion elements may be arranged on each of the first and second LED chips. The light-altering material may improve the contrast between the first and second LED chips as well as between the individual wavelength conversion elements. The light-altering material may include at least one of nanoparticles, nanowires, mesowires, or combinations thereof. LED devices may include submounts in modular configurations where LED chips may be mounted on adjacent submounts to form an LED array.