公开(公告)号：US11121298B2

公开(公告)日：2021-09-14

申请号：US16118762

申请日：2018-08-31

Applicant: Cree, Inc.

Inventor： Roshan Murthy ,  Kenneth M. Davis ,  Jae-Hyung Park ,  Xiameng Shi

IPC: H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L33/64 ,  H01L21/66 ,  H01L33/50 ,  H01L33/60 ,  H01L27/02 ,  G02B5/02 ,  G02B27/09 ,  H01L23/00 ,  H01L33/10

Abstract: Solid-state light emitting devices including light-emitting diodes (LEDs), and more particularly packaged LEDs that include individually controllable LED chips are disclosed. In some embodiments, an LED package includes electrical connections configured to reduce corrosion of metals within the package; or decrease the overall forward voltage of the LED package; or provide an electrical path for electrostatic discharge (ESD) chips. In some embodiments, an LED package includes an array of LED chips, each of which is individually controllable such that individual LED chips or subgroups of LED chips may be selectively activated or deactivated. A single wavelength conversion element may be provided over the array of LED chips, or separate wavelength conversion elements may be provided over one or more individual LED chips of the array. Representative LED packages may be beneficial for applications where a high luminous intensity with a controllable brightness or adaptable emission pattern is desired.

公开(公告)号：US20200075813A1

公开(公告)日：2020-03-05

申请号：US16118779

申请日：2018-08-31

Applicant: Cree, Inc.

Inventor： Sung Chul Joo ,  Kenneth M. Davis ,  David Suich ,  Jae-Hyung Park ,  Arthur F. Pun

IPC: H01L33/50 ,  H01L33/10 ,  H01L33/36 ,  H01L33/62

Abstract: Light-emitting diodes (LEDs), LED arrays, and related devices are disclosed. An LED device includes a first LED chip and a second LED chip mounted on a submount with a light-altering material in between. The light-altering material may include at least one of a light-reflective material and/or a light-absorbing material. Individual wavelength conversion elements may be arranged on each of the first and second LED chips. The light-altering material may improve the contrast between the first and second LED chips as well as between the individual wavelength conversion elements. LED devices may include submounts in modular configurations where LED chips may be mounted on adjacent submounts to form an LED array. Each LED chip of the LED array may be laterally separated from at least one other LED chip by a same distance and a light-altering material may be arranged around the LED array.

公开(公告)号：US11024785B2

公开(公告)日：2021-06-01

申请号：US16118747

申请日：2018-08-31

Applicant: Cree, Inc.

Inventor： Roshan Murthy ,  Kenneth M. Davis ,  Jae-Hyung Park ,  Xiameng Shi

IPC: H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L33/64 ,  H01L21/66 ,  H01L33/50 ,  H01L33/60 ,  H01L27/02 ,  G02B5/02 ,  G02B27/09 ,  H01L23/00 ,  H01L33/10

Abstract: Solid state light emitting devices including light-emitting diodes (LEDs), and more particularly packaged LEDs are disclosed. In some embodiments, an LED package includes electrical connections that are configured to reduce corrosion of metals within the LED package; or decrease the overall forward voltage of the LED package; or provide an electrical path for serially-connected electrostatic discharge (ESD) chips. In some embodiments, an LED package includes at least two LED chips and a material between the two LED chips that promotes homogeneity of composite emissions from the two LED chips. In this manner, LED packages according to the present disclosure may be beneficial for various applications, including those where a high luminous intensity is desired in a variety of environmental conditions. Such applications include automotive lighting, aerospace lighting, and general illumination.

公开(公告)号：US10991862B2

公开(公告)日：2021-04-27

申请号：US16118747

申请日：2018-08-31

Applicant: Cree, Inc.

Inventor： Roshan Murthy ,  Kenneth M. Davis ,  Jae-Hyung Park ,  Xiameng Shi

IPC: H01L33/62 ,  H01L25/075 ,  H01L25/16 ,  H01L33/64 ,  H01L21/66 ,  H01L33/50 ,  H01L33/60 ,  H01L27/02 ,  G02B5/02 ,  G02B27/09 ,  H01L23/00 ,  H01L33/10

Abstract: Solid state light emitting devices including light-emitting diodes (LEDs), and more particularly packaged LEDs are disclosed. In some embodiments, an LED package includes electrical connections that are configured to reduce corrosion of metals within the LED package; or decrease the overall forward voltage of the LED package; or provide an electrical path for serially-connected electrostatic discharge (ESD) chips. In some embodiments, an LED package includes at least two LED chips and a material between the two LED chips that promotes homogeneity of composite emissions from the two LED chips. In this manner, LED packages according to the present disclosure may be beneficial for various applications, including those where a high luminous intensity is desired in a variety of environmental conditions. Such applications include automotive lighting, aerospace lighting, and general illumination.

公开(公告)号：US20200075822A1

公开(公告)日：2020-03-05

申请号：US16545357

申请日：2019-08-20

Applicant: Cree, Inc.

Inventor： David Suich ,  Arthur F. Pun ,  Kenneth M. Davis

IPC: H01L33/60 ,  H01L33/50 ,  H01L25/075

Abstract: Light-emitting diodes (LEDs), LED arrays, and related devices are disclosed. An LED device includes a first LED chip and a second LED chip mounted on a submount with a light-altering material in between. The light-altering material may include at least one of a light-reflective material and/or a light-absorbing material. Individual wavelength conversion elements may be arranged on each of the first and second LED chips. The light-altering material may improve the contrast between the first and second LED chips as well as between the individual wavelength conversion elements. The light-altering material may include at least one of nanoparticles, nanowires, mesowires, or combinations thereof. LED devices may include submounts in modular configurations where LED chips may be mounted on adjacent submounts to form an LED array.