公开(公告)号：US11919274B2

公开(公告)日：2024-03-05

申请号：US16832313

申请日：2020-03-27

Applicant: Cytec Industries Inc.

Inventor： Bérénice Remy ,  Junjie Jeffrey Sang ,  Samuel J. Hill ,  Carmelo Luca Restuccia

IPC: B32B15/14 ,  B32B3/10 ,  B32B5/02 ,  B32B5/26 ,  B32B7/14 ,  B32B15/02 ,  B32B27/12 ,  B32B27/38

CPC classification number: B32B15/14 ,  B32B3/10 ,  B32B5/022 ,  B32B5/26 ,  B32B7/14 ,  B32B15/02 ,  B32B27/12 ,  B32B27/38 ,  B32B2250/03 ,  B32B2250/05 ,  B32B2250/40 ,  B32B2262/101 ,  B32B2307/202 ,  B32B2307/726 ,  B32B2311/12

Abstract: A permeable LSP material that can be incorporated into a resin infusion process such as RTM and VaRTM. This permeable LSP material may be in the form of an elongated or continuous tape that can be used in an automated placement process such as ATL and AFP. In one embodiment, the permeable LSP material includes at least the following components: (a) a nonwoven veil of randomly arranged fibers; (b) a porous electrically conductive layer having openings through its thickness; and (c) a resin material distributed, in a non-continuous manner, throughout the nonwoven veil 11 and between the nonwoven veil and the porous conductive layer. The permeable LSP material can be brought into contact with a dry preform, followed by resin infusion and curing to form a hardened composite part having the LSP material integrated therein.