公开(公告)号：US20170348805A1

公开(公告)日：2017-12-07

申请号：US15536344

申请日：2015-12-09

Applicant: SENJU METAL INDUSTRY CO., LTD. ,  DDK Ltd.

Inventor： Kaichi TSURUTA ,  Osamu MUNEKATA ,  Hiroyuki IWAMOTO ,  Atsushi IKEDA ,  Hiroyuki MORIUCHI ,  Shinichi KAYAMA ,  Yoshihiro TADOKORO

IPC: B23K35/26 ,  C22C13/00 ,  H05K1/11 ,  H05K1/09 ,  H05K3/40 ,  B23K101/36 ,  H05K3/18

CPC classification number: B23K35/262 ,  B23K2101/36 ,  C22C13/00 ,  C23C2/04 ,  C23C2/08 ,  C23C30/00 ,  H05K1/09 ,  H05K1/111 ,  H05K1/118 ,  H05K3/18 ,  H05K3/4007 ,  H05K2201/0769

Abstract: The disclosed solder alloy is useful for plating and for use with electronic components, which are capable of suppressing the formation of external stress-type whiskers. This solder alloy for plating contains Sn and Ni, with the Ni content being 0.06-5.0 mass % inclusive and the remainder including Sn, and is used in electrical contacts that are electrically connected through mechanical joining.

公开(公告)号：US20160064846A1

公开(公告)日：2016-03-03

申请号：US14784778

申请日：2014-04-04

Applicant: DDK LTD.

Inventor： Yoshihiro TADOKORO

IPC: H01R13/03

CPC classification number: H01R13/035 ,  C25D3/12 ,  C25D3/48 ,  C25D5/12 ,  C25D5/34 ,  C25D5/48 ,  C25D7/00 ,  H01R13/03 ,  H01R24/62

Abstract: An electronic component includes at least a contact member having, on a surface of a contact portion adapted to come into contact with another contact member, at least an undercoat plating layer and a main plating layer formed on the undercoat plating layer. A coating containing a fluorine-based oil is provided on the main plating layer, and the coating has a dry coating weight per unit area on the main plating layer of greater than or equal to 0.011 mg/cm2.

Abstract translation: 电子部件至少包括接触部件，所述接触部件在适于与另一接触部件接触的接触部分的表面上至少形成在底涂层镀层上形成的底涂层镀层和主镀层。 在主镀层上设置含有氟系油的涂层，主镀层上的单位面积的干涂层重量为0.011mg / cm 2以上。