HEAT DISSIPATION ASSEMBLY
    1.
    发明申请

    公开(公告)号:US20220120510A1

    公开(公告)日:2022-04-21

    申请号:US17646148

    申请日:2021-12-28

    Abstract: A heat dissipation assembly includes a condenser, an evaporator, a vapor conduit, and a liquid conduit. The condenser has a condensing chamber therein. Two ends of the vapor conduit are respectively connected to the condenser and the evaporator. Two ends of the liquid conduit are respectively connected to the condenser and the evaporator. A geometric center of the liquid conduit in the condensing chamber is lower than or equal to a geometric center of the condensing chamber.

    WATER COOLING DEVICE AND COLLECTOR THEREOF

    公开(公告)号:US20250102247A1

    公开(公告)日:2025-03-27

    申请号:US18970812

    申请日:2024-12-05

    Abstract: A water cooling device includes a first collector, a second collector and a plurality of tubes. The first collector includes a receiving chamber and a plurality of distribution chamber. The receiving chamber has an inlet for receiving a working fluid. Each of the distribution chambers includes a first wall portion and a second wall portion opposite to the first wall portion. The first wall portion has an opening communicating with the receiving chamber. The second wall portion has an outlet. Each of the tubes is connected to the outlet of one of the distribution chambers on one end, and is connected to the second collector on another end.

    HEAT DISSIPATION ASSEMBLY
    4.
    发明申请

    公开(公告)号:US20200217595A1

    公开(公告)日:2020-07-09

    申请号:US16820662

    申请日:2020-03-16

    Abstract: A heat dissipation assembly includes a condenser, an evaporator, a vapor conduit, and a liquid conduit. The condenser has a condensing chamber therein. Two ends of the vapor conduit are respectively connected to the condenser and the evaporator. Two ends of the liquid conduit are respectively connected to the condenser and the evaporator. A geometric center of the liquid conduit in the condensing chamber is lower than or equal to a geometric center of the condensing chamber.

    HEAT SINK ASSEMBLY AND CLIP THEREOF
    5.
    发明申请
    HEAT SINK ASSEMBLY AND CLIP THEREOF 有权
    散热器组件及其夹子

    公开(公告)号:US20140262148A1

    公开(公告)日:2014-09-18

    申请号:US13945376

    申请日:2013-07-18

    CPC classification number: H01L23/4093 F16B2/08 F16B2/22 Y10T403/595

    Abstract: A clip for fixing a heat sink on a retaining bracket includes an elastic supporter, an operating member, a movable fastener and a fixing bar. Two ends of the elastic supporter have a connecting portion and a first buckle portion, respectively. The operating member has a resisting portion, a pivot portion and an operating bar. The pivot portion pivots to the connecting portion. The movable fastener installs on the resisting portion and the connecting portion, and includes two sliding slots, a resisting surface and a second buckle portion. The resisting portion has an arc surface for resisting against the resisting surface. The distance between the apex of the arc surface and the pivot portion is the largest distance between the arc surface and the pivot portion. When the clip is locked, the junction of the resisting portion and the resisting surface excludes the apex of the arc surface.

    Abstract translation: 用于将散热器固定在保持支架上的夹子包括弹性支撑件,操作构件,可移动紧固件和固定杆。 弹性支撑体的两端分别具有连接部分和第一带扣部分。 操作构件具有阻力部分,枢转部分和操作杆。 枢轴部分枢转到连接部分。 可动紧固件安装在抵抗部分和连接部分上,并且包括两个滑动槽,阻力表面和第二带扣部分。 抵抗部分具有用于抵抗抵抗表面的弧形表面。 弧形表面的顶点与枢转部分之间的距离是弧形表面和枢转部分之间的最大距离。 当夹子被锁定时,阻力部分和阻力表面的接合部排除了弧形表面的顶点。

    THERMOSYPHON COOLING DEVICE
    6.
    发明公开

    公开(公告)号:US20240310127A1

    公开(公告)日:2024-09-19

    申请号:US18378859

    申请日:2023-10-11

    CPC classification number: F28D15/0266 F28D15/0275

    Abstract: The disclosure is directed to a thermosyphon cooling device having a heat-exchange plate and a plurality of roll-bond fins. An evaporation chamber is defined inside the heat-exchange plate. A heat-exchange surface and a top surface are disposed at two sides of the heat-exchange plate. A capillary structure is arranged in the evaporation chamber, and the capillary structure is corresponding to the heat-exchange surface. The roll-bond fins are arranged upright on the top surface, and a plurality of condensing chambers communicating with the evaporation chamber are defined in each of the roll-bond fins, respectively. Each of the condensing chambers communicates with each of the evaporation chambers through at least one overflow port, respectively, and a working fluid is contained in the condensing chambers. Each of the condensing chambers is extended across the at least one overflow port in a direction perpendicular to a normal line of the heat-exchange plate.

    HEAT SINK MODULE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20180054920A1

    公开(公告)日:2018-02-22

    申请号:US15336467

    申请日:2016-10-27

    Abstract: In a heat sink module and a manufacturing method thereof, the method includes steps of: forming a heat dissipation fin set by aluminum extrusion process, wherein the heat dissipation fin set includes a plate, a plurality of fins extending from one side of the plate and being arranged spaced apart from one another, and a joint portion formed on the other side of the plate; placing the plate in a mold; injecting molten metal into the mold; forming a base by die-casting of the molten metal. The plate and the joint portion are wrapped by the base. The joint portion forms a connection structure including a bump and a notch fitted with the bump, so as to connect and fix the base and the heat dissipation fin set. The heat sink module has the strengthened connection structure and the fins with a superior aspect ratio.

    WATER COOLING DEVICE AND COLLECTOR THEREOF

    公开(公告)号:US20220099388A1

    公开(公告)日:2022-03-31

    申请号:US17337444

    申请日:2021-06-03

    Abstract: A water cooling device includes a first collector, a second collector and a plurality of tubes. The first collector includes a receiving chamber and a plurality of distribution chamber. The receiving chamber has an inlet for receiving a working fluid. Each of the distribution chambers includes a first wall portion and a second wall portion opposite to the first wall portion. The first wall portion has an opening communicating with the receiving chamber. The second wall portion has an outlet. Each of the tubes is connected to the outlet of one of the distribution chambers on one end, and is connected to the second collector on another end.

    METHOD OF MANUFACTURING HEAT SINK MODULE
    10.
    发明申请

    公开(公告)号:US20180263140A1

    公开(公告)日:2018-09-13

    申请号:US15974894

    申请日:2018-05-09

    Abstract: In a heat sink module and a manufacturing method thereof, the method includes steps of: forming a heat dissipation fin set by aluminum extrusion process, wherein the heat dissipation fin set includes a plate, a plurality of fins extending from one side of the plate and being arranged spaced apart from one another, and a joint portion formed on the other side of the plate; placing the plate in a mold; injecting molten metal into the mold; forming a base by die-casting of the molten metal. The plate and the joint portion are wrapped by the base. The joint portion forms a connection structure including a bump and a notch fitted with the bump, so as to connect and fix the base and the heat dissipation fin set. The heat sink module has the strengthened connection structure and the fins with a superior aspect ratio.

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