公开(公告)号：US20170107158A1

公开(公告)日：2017-04-20

申请号：US15127214

申请日：2015-03-18

Applicant: DENKA COMPANY LIMITED

Inventor： Daisuke GOTO ,  Hideki HIROTSURU ,  Yoshitaka TANIGUCHI ,  Goh IWAMOTO ,  Kazunori KOYANAGI

IPC: C04B35/80 ,  H01L21/48 ,  C04B41/00 ,  H01L23/373 ,  C04B41/88 ,  C04B41/51

CPC classification number: C04B35/806 ,  C04B41/009 ,  C04B41/5155 ,  C04B41/88 ,  C04B2111/00844 ,  C04B2235/3826 ,  C04B2235/402 ,  C04B2235/5264 ,  H01L21/4871 ,  H01L23/3733 ,  H01L2924/0002 ,  C04B35/565 ,  C04B38/00 ,  C04B41/4523 ,  H01L2924/00

Abstract: To provide an aluminum-silicon carbide composite which is suitable for use as a power-module base plate. An aluminum-silicon carbide composite wherein a peripheral portion having, as a main component thereof, an aluminum-ceramic fiber composite containing ceramic fibers having an average fiber diameter of at most 20 μm and an average aspect ratio of at least 100, is provided on the periphery of a flat plate-shaped aluminum-silicon carbide composite having a plate thickness of 2 to 6 mm formed by impregnating, with a metal containing aluminum, a porous silicon carbide molded body having a silicon carbide content of 50 to 80 vol %, and wherein the proportion of the aluminum-ceramic fiber composite occupied in the peripheral portion is at least 50 area %.