公开(公告)号：US20170268834A1

公开(公告)日：2017-09-21

申请号：US15508187

申请日：2015-09-01

Applicant: DENKA COMPANY LIMITED

Inventor： Yosuke ISHIHARA ,  Takeshi MIYAKAWA ,  Kazunori KOYANAGI

IPC: F28F21/02 ,  C22C49/06 ,  H01L23/373 ,  C22C21/02 ,  F28F21/08 ,  C22C26/00 ,  C22C47/12

Abstract: A heat dissipation component for a semiconductor element includes: a composite part containing 50-80 vol % diamond powder with the remainder having metal including aluminum, the diamond powder having a particle diameter volume distribution first peak at 5-25 μm and a second peak at 55-195 μm. A ratio between a volume distribution area at particle diameters of 1-35 μm and a volume distribution area at particle diameters of 45-205 μm is 1:9 to 4:6; surface layers on both composite part principal surfaces, each of the surface layers containing 80 vol % or more metal including aluminum and having a film thickness of 0.03-0.2 mm; and a crystalline Ni layer and an Au layer on at least one of the surface layers, the crystalline Ni layer having a film thickness of 0.5-6.5 μm, and the Au layer having a film thickness of 0.05 μm or larger.

公开(公告)号：US20240404913A1

公开(公告)日：2024-12-05

申请号：US18698695

申请日：2022-10-03

Applicant: DENKA COMPANY LIMITED

Inventor： Daisuke GOTO ,  Hiroaki OTA ,  Kazunori KOYANAGI ,  Nobuhiro FUNATSU

IPC: H01L23/373

Abstract: Provided is a heat dissipation member according to the present invention including a flat metal-silicon carbide composite containing aluminum, in which a thickness of the heat dissipation member is equal to or less than 4 mm, and the heat dissipation member is used as a heat dissipation member for automobile mount.

公开(公告)号：US20190093201A1

公开(公告)日：2019-03-28

申请号：US16084475

申请日：2016-12-27

Applicant: DENKA COMPANY LIMITED

Inventor： Yosuke ISHIHARA ,  Takeshi MIYAKAWA ,  Hideo TSUKAMOTO ,  Kazunori KOYANAGI

IPC: C22C26/00 ,  B22F3/17 ,  B22F3/26 ,  H01L23/373

Abstract: Provided is an aluminum-diamond-based composite which can be processed with high dimensional accuracy. The flat-plate-shaped aluminum-diamond-based composite is coated with a surface layer of which the entire surface has an average film thickness of 0.01-0.2 mm and which contains not less than 80 volume % of a metal containing an aluminum.

公开(公告)号：US20170107158A1

公开(公告)日：2017-04-20

申请号：US15127214

申请日：2015-03-18

Applicant: DENKA COMPANY LIMITED

Inventor： Daisuke GOTO ,  Hideki HIROTSURU ,  Yoshitaka TANIGUCHI ,  Goh IWAMOTO ,  Kazunori KOYANAGI

IPC: C04B35/80 ,  H01L21/48 ,  C04B41/00 ,  H01L23/373 ,  C04B41/88 ,  C04B41/51

CPC classification number: C04B35/806 ,  C04B41/009 ,  C04B41/5155 ,  C04B41/88 ,  C04B2111/00844 ,  C04B2235/3826 ,  C04B2235/402 ,  C04B2235/5264 ,  H01L21/4871 ,  H01L23/3733 ,  H01L2924/0002 ,  C04B35/565 ,  C04B38/00 ,  C04B41/4523 ,  H01L2924/00

Abstract: To provide an aluminum-silicon carbide composite which is suitable for use as a power-module base plate. An aluminum-silicon carbide composite wherein a peripheral portion having, as a main component thereof, an aluminum-ceramic fiber composite containing ceramic fibers having an average fiber diameter of at most 20 μm and an average aspect ratio of at least 100, is provided on the periphery of a flat plate-shaped aluminum-silicon carbide composite having a plate thickness of 2 to 6 mm formed by impregnating, with a metal containing aluminum, a porous silicon carbide molded body having a silicon carbide content of 50 to 80 vol %, and wherein the proportion of the aluminum-ceramic fiber composite occupied in the peripheral portion is at least 50 area %.