BORON NITRIDE FINE PARTICLES AND PRODUCTION METHOD THEREOF
    2.
    发明申请
    BORON NITRIDE FINE PARTICLES AND PRODUCTION METHOD THEREOF 有权
    BORON NITRIDE FINE颗粒及其生产方法

    公开(公告)号:US20170008767A1

    公开(公告)日:2017-01-12

    申请号:US15117878

    申请日:2015-02-09

    Abstract: A boron nitride fine particle has low major diameter/thickness (aspect) ratio, high purity and high crystallinity, and also has an average particle diameter of 0.05 to 2.0 μm, a graphitization index of 3 or less, and a total oxygen content of 0.20% by mass or less, with an average value of a major diameter/thickness ratio of scaly particles being 6.0 or less. A method of producing a boron nitride fine particle includes introducing ammonia and an alkoxide borate at an ammonia/alkoxide borate molar ratio of 1 to 5 in a reaction vessel in an inert gas atmosphere for heating at 800 to 1,350° C. within 30 seconds thereby obtaining a boron nitride precursor, and then heating the boron nitride precursor at 1,650 to 2,200° C. for at least 0.5 hour in an inert gas atmosphere.

    Abstract translation: 氮化硼微粒具有低的长径/厚度(纵横)比,高纯度和高结晶度,并且平均粒径为0.05-2.0μm,石墨化指数为3或更小,总氧含量为0.20 质量%以下,鳞片状颗粒的长径/厚度比的平均值为6.0以下。 氮化硼微粒的制造方法包括在惰性气体气氛下,在反应容器内以氨/硼酸盐摩尔比为1〜5的氨和醇盐硼酸盐引入,在30分钟内在800〜1350℃下加热, 获得氮化硼前体,然后在惰性气体气氛中将氮化硼前体在1650-2200℃加热至少0.5小时。

    BORON NITRIDE POWDER, METHOD FOR PRODUCING SAME, COMPOSITE MATERIAL, AND HEAT DISSIPATION MEMBER

    公开(公告)号:US20220204830A1

    公开(公告)日:2022-06-30

    申请号:US17441740

    申请日:2020-03-25

    Abstract: Provided is a boron nitride powder including: an agglomerated particle obtained by aggregating flaky primary particles, in which in-plane directions of the primary particles are oriented in a direction parallel to a short-side direction of the agglomerated particle. In addition, provided is a method for producing a boron nitride powder including: a nitriding step of firing a boron carbide powder having an aspect ratio of 1.5 to 10 in a nitrogen pressurized atmosphere to obtain a fired product; and a crystallization step of heating a formulation that contains the fired product and a boron source to produce flaky boron nitride primary particles and obtaining a boron nitride powder containing an agglomerated particle obtained by aggregating the primary particles.

    BORON NITRIDE POWDER, METHOD FOR PRODUCING SAME, AND HEAT-DISSIPATING MEMBER PRODUCED USING SAME

    公开(公告)号:US20200247672A1

    公开(公告)日:2020-08-06

    申请号:US16755715

    申请日:2018-08-17

    Abstract: To provide a boron nitride powder having excellent heat conductivity and high particle strength. Provided is a boron nitride powder which comprises bulky boron nitride formed such that scaly primary particles of hexagonal boron nitride are aggregated to form bulky particles, and which has the following characteristics (A) to (C): (A) a particle strength of the bulky particles at a cumulative breakdown rate of 63.2% is 5.0 MPa or more; (B) an average particle size of the boron nitride powder is 2 μm or more and 20 μm or less; and (C) an orientation index of the boron nitride powder as determined from X-ray diffraction is 20 or less.

    BULK BORON NITRIDE PARTICLES, THERMALLY CONDUCTIVE RESIN COMPOSITION, AND HEAT DISSIPATING MEMBER

    公开(公告)号:US20220153583A1

    公开(公告)日:2022-05-19

    申请号:US17441263

    申请日:2020-03-25

    Abstract: The present invention relates to aggregated boron nitride particles including hexagonal boron nitride primary particles aggregated, including a spacer type coupling agent. The thermally conductive resin composition of the present invention includes the aggregated boron nitride particles of the present invention. The heat dissipation member of the present invention includes the thermally conductive resin composition of the present invention. According to the present invention, aggregated boron nitride particles that can suppress the formation of voids in a heat dissipation member produced by mixing with a resin, a thermally conductive resin composition including the aggregated boron nitride particles, and a heat dissipation member using the thermally conductive resin composition can be provided.

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