公开(公告)号：US20130241043A1

公开(公告)日：2013-09-19

申请号：US13799787

申请日：2013-03-13

Applicant: DENSO CORPORATION

Inventor： Chikage KATO ,  Yoshiyuki YAMAUCHI

IPC: H01L23/34

CPC classification number: H01L23/34 ,  H01L23/051 ,  H01L23/373 ,  H01L23/427 ,  H01L23/4334 ,  H01L23/4985 ,  H01L25/072 ,  H01L25/074 ,  H01L2224/33 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor module includes at least one intermediate plate which has heat conductivity, power semiconductor elements which are provided for respective main surfaces of the intermediate plate, heat sinks which are arranged so that the power semiconductor elements are held between the heat sinks and the intermediate plate, and a mold part which seals the intermediate plate, the power semiconductor elements, and the heat sinks with mold resin. Surfaces of the heat sinks opposite to the side of the power semiconductor elements are exposed from the mold part. The intermediate plate has an intermediate radiator which projects in the direction parallel to the main surface from the mold part.

Abstract translation: 半导体模块包括至少一个具有导热性的中间板，为中间板的各个主表面设置的功率半导体元件，散热器，其布置成使得功率半导体元件保持在散热器和中间板之间 以及用模具树脂密封中间板，功率半导体元件和散热器的模具部件。 与功率半导体元件侧相反的散热片的表面从模具部件露出。 中间板具有从模具部分沿平行于主表面的方向突出的中间散热器。