公开(公告)号：US20130255920A1

公开(公告)日：2013-10-03

申请号：US13775394

申请日：2013-02-25

Applicant: DENSO CORPORATION

Inventor： Yoshiyuki YAMAUCHI ,  Tomohiro SHIMAZU

IPC: F28D15/02

CPC classification number: F28D15/02 ,  F28D1/0333 ,  F28D15/0266 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A power card is accommodated in a vaporizing portion. Heat medium in the vaporizing portion is vaporized by heat generated at the power card so as to cool down the power card. A vapor passage and a condensing portion are connected to the vaporizing portion and a communication passage is provided at upper ends of the vapor passage and the condensing portion. The heat medium vaporized in the vaporizing portion moves up to the communication passage and to the condensing portion, so that the heat medium is condensed in the condensing portion and moves to the vaporizing portion. The condensing portion is arranged at an upstream side of the vapor passage in a direction of blowing air. A cross sectional area of the vapor passage is larger than that of the condensing portion.

Abstract translation: 电源卡被容纳在蒸发部分中。 蒸发部分中的热介质由在电源卡上产生的热量蒸发，以冷却功率卡。 蒸汽通道和冷凝部分连接到蒸发部分，并且在蒸气通道和冷凝部分的上端设置连通通道。 在汽化部中蒸发的热介质向连通通道和冷凝部分移动，使得热介质在冷凝部分中冷凝并移动到汽化部分。 冷凝部在空气吹送方向上配置在蒸气流路的上游侧。 蒸汽通道的横截面积大于冷凝部分的横截面面积。

公开(公告)号：US20170356690A1

公开(公告)日：2017-12-14

申请号：US15541595

申请日：2016-02-05

Applicant: DENSO CORPORATION

Inventor： Kouhei NAKAMURA ,  Aun OTA ,  Tomohide NISHINO ,  Yoshiyuki YAMAUCHI ,  Takahito SHIBATA

IPC: F28D1/04 ,  B60H1/32 ,  F28F21/02 ,  F28F1/16 ,  F28F3/12 ,  F28F21/06

CPC classification number: F28D1/04 ,  B60H1/32 ,  F25B39/022 ,  F25B39/04 ,  F25B2339/02 ,  F25B2339/04 ,  F28D1/0316 ,  F28D1/0333 ,  F28D1/05383 ,  F28F1/16 ,  F28F3/12 ,  F28F21/02 ,  F28F21/06 ,  F28F21/065

Abstract: A refrigerant heat exchanger has the passage defining member. The passage defining member is made of carbon fiber reinforced plastics. The passage defining member has a tube portion defining a refrigerant passage. The passage defining member has the plate portion which spreads from the tube portion. In the tube portion, carbon fibers are oriented to surround the tube portion. This orientation contributes to a pressure resisting performance in a radial direction of the tube portion. In the plate portion, the carbon fibers are oriented to protrude from the tube portion. This orientation contributes to improve mechanical strength in the plate portion. The carbon fibers are extended over both the tube portion and the plate portion. This orientation promotes thermal transfer over the tube portion and the plate portion.

公开(公告)号：US20130241043A1

公开(公告)日：2013-09-19

申请号：US13799787

申请日：2013-03-13

Applicant: DENSO CORPORATION

Inventor： Chikage KATO ,  Yoshiyuki YAMAUCHI

IPC: H01L23/34

CPC classification number: H01L23/34 ,  H01L23/051 ,  H01L23/373 ,  H01L23/427 ,  H01L23/4334 ,  H01L23/4985 ,  H01L25/072 ,  H01L25/074 ,  H01L2224/33 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor module includes at least one intermediate plate which has heat conductivity, power semiconductor elements which are provided for respective main surfaces of the intermediate plate, heat sinks which are arranged so that the power semiconductor elements are held between the heat sinks and the intermediate plate, and a mold part which seals the intermediate plate, the power semiconductor elements, and the heat sinks with mold resin. Surfaces of the heat sinks opposite to the side of the power semiconductor elements are exposed from the mold part. The intermediate plate has an intermediate radiator which projects in the direction parallel to the main surface from the mold part.

Abstract translation: 半导体模块包括至少一个具有导热性的中间板，为中间板的各个主表面设置的功率半导体元件，散热器，其布置成使得功率半导体元件保持在散热器和中间板之间 以及用模具树脂密封中间板，功率半导体元件和散热器的模具部件。 与功率半导体元件侧相反的散热片的表面从模具部件露出。 中间板具有从模具部分沿平行于主表面的方向突出的中间散热器。