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公开(公告)号:US20160123769A1
公开(公告)日:2016-05-05
申请号:US14927688
申请日:2015-10-30
Applicant: DENSO CORPORATION
Inventor: Seiji NISHIMOTO , Akitoshi MIZUTANI
IPC: G01D5/14
CPC classification number: G01D5/145 , G01B7/312 , G01D5/2046
Abstract: A rotation angle and stroke amount detection device includes a sensor unit, a rotation angle calculation unit, and a stroke amount calculation unit. The sensor unit includes sin and cos sensors which are magnetic sensing elements that detect changes in a magnetic field caused by rotation or linear displacement of a detection target. The sensor unit outputs sin and cos signals based on detection values of the sin and cos sensors. The rotation angle calculation unit calculates a rotation angle of the detection target based on the sin and cos signals output by the sensor unit. The stroke amount calculation unit calculates a stroke amount of the detection target based on the same signals as those used by the rotation angle calculation unit, i.e., the sin and cos signals. Accordingly, the configuration of the sensor unit may be simplified and the physical size of the device may be reduced.
Abstract translation: 旋转角度和行程量检测装置包括传感器单元,旋转角度计算单元和行程量计算单元。 传感器单元包括sin和cos传感器,它们是检测由检测目标的旋转或线性位移引起的磁场变化的磁感应元件。 传感器单元根据sin和cos传感器的检测值输出sin和cos信号。 旋转角度计算单元基于由传感器单元输出的sin和cos信号来计算检测对象的旋转角度。 行程量计算单元基于与旋转角度计算单元相同的信号,即sin和cos信号来计算检测对象的行程量。 因此,可以简化传感器单元的配置,并且可以减小设备的物理尺寸。
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公开(公告)号:US20180245953A1
公开(公告)日:2018-08-30
申请号:US15755234
申请日:2016-08-08
Applicant: DENSO CORPORATION
Inventor: Seiji NISHIMOTO , Tomoyuki TAKIGUCHI , Yoshiyuki KONO , Akitoshi MIZUTANI
CPC classification number: G01D11/245 , G01D5/14 , G01D5/145 , G01R33/02 , H01L23/3107 , H01L23/3135
Abstract: A magnetic field detection device includes an IC package, a terminal, a resin mold member. The IC package includes a magnetism detection element, a lead frame located on a first side of the magnetism detection element, and a resin member covering the magnetism detection element and the lead frame. The resin mold member includes a base portion and a head portion. The head portion includes a thickest portion. An outer wall surface of the thickest portion located on a second side of the magnetism detection element is a detection reference surface. An element corresponding surface that is an outer wall surface of the IC package located on the second side is exposed to an outside of resin mold member or covered with a detection side thin portion thinner than a thickness from the element corresponding surface to the detection side reference surface.
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公开(公告)号:US20170345998A1
公开(公告)日:2017-11-30
申请号:US15603733
申请日:2017-05-24
Applicant: DENSO CORPORATION , TDK-MICRONAS GMBH
Inventor: Toshiyuki KOUMORI , Yoshiyuki KONO , Tomoyuki TAKIGUCHI , Yoshinori INUZUKA , Akitoshi MIZUTANI , Seiji NISHIMOTO , Camillo PILLA
CPC classification number: H01L43/04 , H01L23/48 , H01L43/065 , H01L43/14 , H01L2224/48247 , H01L2224/48257 , H01L2924/181 , H01L2924/00012
Abstract: A method for manufacturing semiconductor devices is provided. The method includes bonding a semiconductor element to a first surface of a planar lead frame, clamping a partial area of the lead frame to hold the lead frame and the semiconductor element in molding dies, and covering at least a part of the lead frame and the semiconductor element with a resin member by resin molding which fills the molding dies with resin. A thin-walled portion having a relative small thickness is previously formed on a shortest virtual line connecting a clamp area of the lead frame to an area where the semiconductor element is bonded.
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公开(公告)号:US20150198101A1
公开(公告)日:2015-07-16
申请号:US14595457
申请日:2015-01-13
Applicant: Denso Corporation
Inventor: Seiji NISHIMOTO , Yoshiyuki KONO
CPC classification number: F02D9/105 , F02D11/106 , F02D2400/18
Abstract: A sensor module is adapted to be attached to an actuator body incorporating an electric actuator. The sensor module includes a sensor assembly, a sensor cover, and a connector housing. The sensor assembly includes a sensor detection part and a sensor housing. The sensor detection part is configured to detect a physical change amount of a driven body driven by the electric actuator and to convert the physical change amount into an electrical signal. The sensor housing incorporates the sensor detection part. The sensor cover is provided separately from the sensor housing and is attached to the actuator body. The sensor module is configured integrally by attaching the sensor assembly to the sensor cover. A connector terminal electrically connected to a connection terminal of the sensor detection part is insert-molded in the connector housing. The connector housing is provided integrally with the sensor housing.
Abstract translation: 传感器模块适于附接到结合有电致动器的致动器主体。 传感器模块包括传感器组件,传感器盖和连接器壳体。 传感器组件包括传感器检测部分和传感器外壳。 传感器检测部被配置为检测由电致动器驱动的被驱动体的物理变化量,并将物理变化量转换为电信号。 传感器外壳包含传感器检测部件。 传感器盖与传感器壳体分开设置,并附接到致动器主体。 传感器模块通过将传感器组件附接到传感器盖而被一体地配置。 电连接到传感器检测部分的连接端子的连接器端子插入模制在连接器壳体中。 连接器壳体与传感器壳体一体设置。
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