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公开(公告)号：US20140333297A1
公开(公告)日：2014-11-13
申请号：US14263230
申请日：2014-04-28
Applicant: DENSO CORPORATION
Inventor： Seiji Nishimoto , Yoshiyuki Kono , Ninh Duc Hoang
IPC: G01D5/12
CPC classification number: G01D5/12 , G01D5/142 , G01D5/145 , G01D5/2033 , G01D5/2241 , G04C5/00 , H02K49/102
Abstract: A magnetic flux emission unit is mounted on a detection object and rotatable integrally with the detection object. An IC package includes a magnetism detection element, which sends a signal according to change in a magnetic flux caused when the magnetic flux emission unit rotates. A cover member includes a bottom portion and a tubular portion. The tubular portion is extended from an outer periphery of the bottom portion. The cover member surrounds the magnetic flux emission unit with the bottom portion when mounted to the housing. A support portion is projected from the bottom portion toward an opening of the tubular portion to support the IC package. A projection is projected toward the opening from the bottom portion to at least a position corresponding to the magnetism detection element.
Abstract translation: 磁通发射单元安装在检测对象上并与检测对象一体地旋转。 IC封装包括磁检测元件，其根据磁通发射单元旋转引起的磁通量的变化发送信号。 盖构件包括底部和管状部分。 管状部分从底部的外周延伸。 当安装到壳体时，盖构件围绕具有底部的磁通发射单元。 支撑部分从底部突出到管状部分的开口以支撑IC封装。 突起从底部突出到开口，至少对应于磁性检测元件的位置。
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Patent Agency Ranking
公开(公告)号：US10830611B2
公开(公告)日：2020-11-10
申请号：US15755234
申请日：2016-08-08
Applicant: DENSO CORPORATION
Inventor： Seiji Nishimoto , Tomoyuki Takiguchi , Yoshiyuki Kono , Akitoshi Mizutani
Abstract: A magnetic field detection device includes an IC package, a terminal, a resin mold member. The IC package includes a magnetism detection element, a lead frame located on a first side of the magnetism detection element, and a resin member covering the magnetism detection element and the lead frame. The resin mold member includes a base portion and a head portion. The head portion includes a thickest portion. An outer wall surface of the thickest portion located on a second side of the magnetism detection element is a detection reference surface. An element corresponding surface that is an outer wall surface of the IC package located on the second side is exposed to an outside of resin mold member or covered with a detection side thin portion thinner than a thickness from the element corresponding surface to the detection side reference surface.
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公开(公告)号：US09709422B2
公开(公告)日：2017-07-18
申请号：US14927688
申请日：2015-10-30
Applicant: DENSO CORPORATION
Inventor： Seiji Nishimoto , Akitoshi Mizutani
CPC classification number: G01D5/145 , G01B7/312 , G01D5/2046
Abstract: A rotation angle and stroke amount detection device includes a sensor unit, a rotation angle calculation unit, and a stroke amount calculation unit. The sensor unit includes sin and cos sensors which are magnetic sensing elements that detect changes in a magnetic field caused by rotation or linear displacement of a detection target. The sensor unit outputs sin and cos signals based on detection values of the sin and cos sensors. The rotation angle calculation unit calculates a rotation angle of the detection target based on the sin and cos signals output by the sensor unit. The stroke amount calculation unit calculates a stroke amount of the detection target based on the same signals as those used by the rotation angle calculation unit, i.e., the sin and cos signals. Accordingly, the configuration of the sensor unit may be simplified and the physical size of the device may be reduced.
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公开(公告)号：US10115889B2
公开(公告)日：2018-10-30
申请号：US15603733
申请日：2017-05-24
Applicant: DENSO CORPORATION , TDK-MICRONAS GMBH
Inventor： Toshiyuki Koumori , Yoshiyuki Kono , Tomoyuki Takiguchi , Yoshinori Inuzuka , Akitoshi Mizutani , Seiji Nishimoto , Camillo Pilla
Abstract: A method for manufacturing semiconductor devices is provided. The method includes bonding a semiconductor element to a first surface of a planar lead frame, clamping a partial area of the lead frame to hold the lead frame and the semiconductor element in molding dies, and covering at least a part of the lead frame and the semiconductor element with a resin member by resin molding which fills the molding dies with resin. A thin-walled portion having a relative small thickness is previously formed on a shortest virtual line connecting a clamp area of the lead frame to an area where the semiconductor element is bonded.
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公开(公告)号：US09784188B2
公开(公告)日：2017-10-10
申请号：US14595457
申请日：2015-01-13
Applicant: DENSO CORPORATION
Inventor： Seiji Nishimoto , Yoshiyuki Kono
CPC classification number: F02D9/105 , F02D11/106 , F02D2400/18
Abstract: A sensor module is adapted to be attached to an actuator body incorporating an electric actuator. The sensor module includes a sensor assembly, a sensor cover, and a connector housing. The sensor assembly includes a sensor detection part and a sensor housing. The sensor detection part is configured to detect a physical change amount of a driven body driven by the electric actuator and to convert the physical change amount into an electrical signal. The sensor housing incorporates the sensor detection part. The sensor cover is provided separately from the sensor housing and is attached to the actuator body. The sensor module is configured integrally by attaching the sensor assembly to the sensor cover. A connector terminal electrically connected to a connection terminal of the sensor detection part is insert-molded in the connector housing. The connector housing is provided integrally with the sensor housing.
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公开(公告)号：US09417095B2
公开(公告)日：2016-08-16
申请号：US14263230
申请日：2014-04-28
Applicant: DENSO CORPORATION
Inventor： Seiji Nishimoto , Yoshiyuki Kono , Ninh Duc Hoang
IPC: G01B7/14 , G01B7/30 , G01D5/12 , G01D5/14 , G01D5/20 , G01D5/22 , G01R33/06 , H01L43/08 , H01L43/06 , G04C5/00 , H02K49/10
CPC classification number: G01D5/12 , G01D5/142 , G01D5/145 , G01D5/2033 , G01D5/2241 , G04C5/00 , H02K49/102
Abstract: A magnetic flux emission unit is mounted on a detection object and rotatable integrally with the detection object. An IC package includes a magnetism detection element, which sends a signal according to change in a magnetic flux caused when the magnetic flux emission unit rotates. A cover member includes a bottom portion and a tubular portion. The tubular portion is extended from an outer periphery of the bottom portion. The cover member surrounds the magnetic flux emission unit with the bottom portion when mounted to the housing. A support portion is projected from the bottom portion toward an opening of the tubular portion to support the IC package. A projection is projected toward the opening from the bottom portion to at least a position corresponding to the magnetism detection element.
Abstract translation: 磁通发射单元安装在检测对象上并与检测对象一体地旋转。 IC封装包括磁检测元件，其根据磁通发射单元旋转引起的磁通量的变化发送信号。 盖构件包括底部和管状部分。 管状部分从底部的外周延伸。 当安装到壳体时，盖构件围绕具有底部的磁通发射单元。 支撑部分从底部突出到管状部分的开口以支撑IC封装。 突起从底部突出到开口，至少对应于磁性检测元件的位置。
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