公开(公告)号：US12278525B2

公开(公告)日：2025-04-15

申请号：US17818865

申请日：2022-08-10

Applicant: DENSO CORPORATION

Inventor： Atsushi Saitou ,  Tomoaki Yoshimi

IPC: H02K11/30 ,  H02K5/22

Abstract: A drive device includes an electric motor and a control unit which are integrated together. The control unit is configured to control the electric motor by using an electric power supply and a signal supplied through an external cable. The control unit includes: a parent circuit board, which is installed to the electric motor; and a connector module, which is configured to connect the parent circuit board to an external connector of the external cable. The connector module includes: a connector portion that is configured to be coupled with and decoupled from the external connector; a wiring module that is configured to receive the electric power supply and the signal from the external cable through the connector portion; and a plurality of connecting conductors that electrically connect the wiring module to the parent circuit board.

公开(公告)号：US10070563B2

公开(公告)日：2018-09-04

申请号：US15090159

申请日：2016-04-04

Applicant: DENSO CORPORATION

Inventor： Tomoaki Yoshimi

IPC: H05K7/20

Abstract: A substrate is fixed to a housing. Heating elements are mounted on a surface of the substrate on the housing-side. A radiating component is provided between the heating elements and the housing. A surface of the housing on the substrate-side includes accommodating recesses, a partitioning wall part, a peripheral wall part, and buffer parts. In each of the accommodating recesses, a corresponding one of the heating elements is accommodated. The partitioning wall part separates the heating elements from each other. The peripheral wall part surrounds the accommodating recesses and the partitioning wall part. Each of the buffer parts is formed between a corresponding one of the accommodating recesses and the peripheral wall part. Each of the buffer parts is formed to be higher than a bottom part of a corresponding one of the accommodating recesses, and to be lower than the peripheral wall part.

公开(公告)号：US09214406B2

公开(公告)日：2015-12-15

申请号：US14578561

申请日：2014-12-22

Applicant: DENSO CORPORATION

Inventor： Tomoaki Yoshimi ,  Takayuki Uchida

IPC: H01L23/10 ,  H01L23/34 ,  H01L23/367 ,  H01L25/065 ,  H01L23/053 ,  H01L23/24 ,  H01L23/42 ,  H01L23/00

CPC classification number: H01L23/367 ,  H01L23/053 ,  H01L23/24 ,  H01L23/34 ,  H01L23/3675 ,  H01L23/42 ,  H01L24/32 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00

Abstract: In an electronic control device, semiconductor modules are disposed in a power region of a substrate, and on a surface of a substrate adjacent to a housing to radiate heat from rear surfaces to the housing through a heat radiation layer. Therefore, a heat radiation performance improves. Further, a first distance from an end surface of a power region corresponding part corresponding to the power region to the substrate is shorter than a second distance from an end surface of a control region corresponding part corresponding to a control region of the substrate to the substrate. Therefore, a closed circuit bridged by parasitic capacitances is formed mainly in an area of the power region and the power region corresponding part. A noise generated from the semiconductor modules is returned to noise sources through the closed circuit without affecting the control region.

Abstract translation: 在电子控制装置中，半导体模块设置在基板的功率区域中，并且在与壳体相邻的基板的表面上，通过散热层从后表面向壳体辐射热量。 因此，散热性能提高。 此外，从与功率区域对应的功率区域对应部分的端面到基板的第一距离比距离对应于基板的控制区域到基板的控制区域对应部分的端面的第二距离短 。 因此，主要在功率区域和功率区域对应部分的区域中形成由寄生电容桥接的闭路。 从半导体模块产生的噪声通过闭路返回到噪声源，而不影响控制区域。

公开(公告)号：US11760284B2

公开(公告)日：2023-09-19

申请号：US17806913

申请日：2022-06-14

Applicant: DENSO CORPORATION

Inventor： Tomoaki Yoshimi

IPC: B62D3/12 ,  B60R16/03 ,  H02K11/33 ,  H02M7/48 ,  H05K7/14 ,  B62D5/04

CPC classification number: B60R16/03 ,  H02K11/33 ,  H02M7/48 ,  H05K7/1432 ,  B62D5/0484

Abstract: A power relay unit includes a high potential side relay connected so that an anode of a parasitic diode is on a high potential side and a cathode is on a low potential side, and a low potential side relay connected in series with a low potential side of the high potential side relay so that a cathode of a parasitic diode is on a high potential side and an anode is on a low potential side. A relay-to-relay connection line connects an intermediate point between the first high potential side relay and the first low potential side relay and an intermediate point between the second high potential side relay and the second low potential side relay. A control unit controls an on/off operation of the first high potential side relay based on a first supply voltage, a second supply voltage, and a relay intermediate voltage.

公开(公告)号：US20160295680A1

公开(公告)日：2016-10-06

申请号：US15090159

申请日：2016-04-04

Applicant: DENSO CORPORATION

Inventor： Tomoaki Yoshimi

IPC: H05K1/02 ,  H05K7/14

CPC classification number: H05K7/209 ,  H05K7/20454

Abstract: A substrate is fixed to a housing. Heating elements are mounted on a surface of the substrate on the housing-side. A radiating component is provided between the heating elements and the housing. A surface of the housing on the substrate-side includes accommodating recesses, a partitioning wall part, a peripheral wall part, and buffer parts. In each of the accommodating recesses, a corresponding one of the heating elements is accommodated. The partitioning wall part separates the heating elements from each other. The peripheral wall part surrounds the accommodating recesses and the partitioning wall part. Each of the buffer parts is formed between a corresponding one of the accommodating recesses and the peripheral wall part. Each of the buffer parts is formed to be higher than a bottom part of a corresponding one of the accommodating recesses, and to be lower than the peripheral wall part.

Abstract translation: 基板固定在壳体上。 加热元件安装在壳体侧的基板的表面上。 辐射部件设置在加热元件和壳体之间。 基板侧的壳体的表面包括容纳凹部，分隔壁部，周壁部和缓冲部。 在每个容纳凹部中，容纳相应的一个加热元件。 分隔壁部分将加热元件彼此分开。 周壁部围绕容纳凹部和分隔壁部。 每个缓冲部分形成在相应的一个容纳凹部和周壁部分之间。 每个缓冲部分形成为高于相应的一个容纳凹部的底部，并且比周壁部低。