Inertial sensor
    1.
    发明授权

    公开(公告)号:US11740087B2

    公开(公告)日:2023-08-29

    申请号:US17703164

    申请日:2022-03-24

    CPC classification number: G01C19/56 G01S19/47

    Abstract: A micro vibration body includes a curved surface portion, a recessed portion recessed from the curved surface portion, a bottom surface protruding portion protruding from a bottom surface of the recessed portion, and a through hole in the bottom surface protruding portion. A mounting substrate has a positioning recess, into which the bottom surface protruding portion is inserted, and electrode portions surrounding the inner frame portion. A joining member is in the positioning recess and joins the bottom surface protruding portion with the mounting substrate. The bottom surface is in contact with a region of the mounting substrate around the positioning recess. The bottom surface protruding portion has a tip end surface that is at a distance from the positioning recess. The joining member at least partially enters the through hole and is electrically connected to the conductive layer.

    Optical scanner having a variable focus mirror

    公开(公告)号:US10108005B2

    公开(公告)日:2018-10-23

    申请号:US14831996

    申请日:2015-08-21

    Abstract: An optical scanner includes a substrate having a rigid body and a beam, and a layered body having multiple layers, including a lower conductive layer, a interlayer insulation film and an upper conductive layer, the layered body layered on and protruding outward from the rigid body and the beam. The layered body is patterned to form a resonance scanner portion and a vari-focal mirror, the resonance scanner portion (i) made as a part of the layered body and (ii) having an actuator part, and the vari-focal mirror made as a part of the layered body. The layered body including the resonance scanner portion and the vari-focal mirror is patterned to form a mirror driving wire. In such structure, the size of the optical scanner is reduced, and a frequency change of the resonance scanner portion due to the voltage application to the mirror driving wire is suppressed.

    Inertial sensor and method for manufacturing the same

    公开(公告)号:US11733044B2

    公开(公告)日:2023-08-22

    申请号:US17730284

    申请日:2022-04-27

    CPC classification number: G01C19/5712

    Abstract: An inertial sensor includes a lower substrate and an upper substrate. The upper substrate includes a micro oscillator, electrodes and a pad, which are independent of each other. The micro oscillator includes a curved surface portion, a joint portion recessed inward from an apex of the curved surface portion and joined to a support portion of the lower substrate, a rim at an end of the curved surface portion and a conductive film covering the micro oscillator. The curved surface portion is in an aerial state. The rim is made of the same material as the electrodes, located on a virtual flat plane formed by the electrodes, and apart from and surrounded by the electrodes. A portion of the conductive film that covers the joint portion is electrically bonded to a lower metal film covering the support portion.

    Mounting structure of micro vibrator

    公开(公告)号:US12287203B2

    公开(公告)日:2025-04-29

    申请号:US18169438

    申请日:2023-02-15

    Abstract: In a mounting structure, a micro vibrator has: a curved surface portion having a hemispherical curved surface; a connecting portion extending from the curved surface portion toward a center of a hemispherical shape of the curved surface portion; and a surface electrode covering at least a part of the connecting portion and at least a part of the curved surface portion. A mounting substrate has two or more wirings and a part of the micro vibrator is connected to the mounting substrate. The wirings each have an electrode connection portion connected to a portion of the surface electrode covering the connecting portion at an end. The two or more wirings include a voltage application wiring and a voltage detection wiring. The voltage application wiring is spaced away from the voltage detection wiring on the mounting substrate.

    Semiconductor device having silicon layer with trench

    公开(公告)号:US11192781B2

    公开(公告)日:2021-12-07

    申请号:US16376336

    申请日:2019-04-05

    Abstract: A semiconductor device includes: a silicon layer in which a trench is disposed; a surface structure portion disposed on the silicon layer at a position distant from the trench and having a surface provided by a metal layer; and a low electric conductivity portion disposed on the surface of the metal layer or in a part of the resist disposed on the trench side of the metal layer, and having an electric conductivity lower than at least a part of the metal layer covering a trench side portion of the surface of the metal layer.

    Optical scanning apparatus having pivoting reflector and piezoelectric element

    公开(公告)号:US10459217B2

    公开(公告)日:2019-10-29

    申请号:US15547218

    申请日:2016-03-25

    Abstract: A reflector has a reflective surface on first and second directions. Each of torsion beams extends to each opposite side of the reflective surface in the first direction. Each of coupling portions is to each opposite side of the reflector in the first direction and includes a central portion with U-shape having two projection portions and a bottom portion joined to the torsion beam. The projection portions include first concave portions opposing across the torsion beam by being penetrated in thickness direction. Each first concave portion extends in the second direction from an opening to a side surface facing the torsion beam towards an opposite side surface up to a bottom. A distance between the bottoms of the first concave portions across the torsion beam is greater than a distance between the side surfaces each facing the torsion beam of the projection portions.

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