公开(公告)号：US20160181140A1

公开(公告)日：2016-06-23

申请号：US14761913

申请日：2014-08-18

Applicant: DEXERIALS CORPORATION

Inventor： Hironobu MORIYAMA ,  Shingo DEGUCHI ,  Hidekazu YAGI ,  Tomoyuki ISHIMATSU

IPC: H01L21/683 ,  H01L21/78 ,  H01L23/31 ,  H01L21/304

CPC classification number: H01L21/6836 ,  B32B27/00 ,  C09J7/20 ,  H01L21/304 ,  H01L21/78 ,  H01L23/3142 ,  H01L2224/13 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A protective tape and a method for manufacturing a semiconductor device using the same capable of achieving excellent connection properties. The protective tape includes an adhesive layer, a thermoplastic resin layer and a backing material film in that order; a modulus ratio of a shear storage modulus of the adhesive layer to a shear storage modulus of the thermoplastic resin layer at an application temperature at which the protective tape is applied is 0.01 or less. This suppresses resin residue on bumps thereby achieving excellent connection properties.

Abstract translation: 保护带以及使用该保护带的半导体器件的制造方法能够实现良好的连接性能。 保护带依次包括粘合剂层，热塑性树脂层和背衬材料膜; 在施加保护带的施加温度下，粘合剂层的剪切储能模量与热塑性树脂层的剪切储能模量的模量比为0.01以下。 这样可以抑制凸点上的树脂残留，从而实现良好的连接性能。

公开(公告)号：US20180151405A1

公开(公告)日：2018-05-31

申请号：US15574729

申请日：2016-06-03

Applicant: DEXERIALS CORPORATION

Inventor： Hironobu MORIYAMA ,  Hidekazu YAGI ,  Tomoyuki ISHIMATSU ,  Katsuyuki EBISAWA ,  Keiji HONJYO ,  Junichi KANEKO

IPC: H01L21/683 ,  B32B27/08 ,  B32B38/10 ,  H01L21/304 ,  H01L21/78 ,  H01L23/00 ,  C09J7/25 ,  C09J7/24 ,  C09J7/38 ,  C09J163/04

CPC classification number: H01L21/6836 ,  B32B27/00 ,  B32B27/08 ,  B32B38/10 ,  B32B2405/00 ,  C09J7/245 ,  C09J7/255 ,  C09J7/29 ,  C09J7/38 ,  C09J163/00 ,  C09J163/04 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2205/114 ,  C09J2423/046 ,  C09J2431/006 ,  C09J2463/00 ,  C09J2467/006 ,  H01L21/304 ,  H01L21/78 ,  H01L23/562 ,  H01L24/11 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68386 ,  H01L2224/11009

Abstract: A protective tape that improves solder bonding properties and reduces wafer warping. The protective tape includes, in the following order, an adhesive agent layer, a first thermoplastic resin layer, a second thermoplastic resin layer, and a matrix film layer. The protective tape satisfies the conditions expressed by the following formulae (1) to (3): Ga>Gb  (1) Ta