公开(公告)号：US20170221787A1

公开(公告)日：2017-08-03

申请号：US15486663

申请日：2017-04-13

Applicant: DEXERIALS CORPORATION

Inventor： Hironobu MORIYAMA

IPC: H01L23/29 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/293 ,  C08G59/18 ,  C08G59/24 ,  C08G59/4207 ,  C08G59/686 ,  C08K5/14 ,  C08L33/10 ,  C08L63/00 ,  H01L21/563 ,  H01L21/6836 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2224/13023 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75301 ,  H01L2224/75702 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81204 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/83191 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/92 ,  H01L2224/9205 ,  H01L2224/921 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/06 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/186 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01051 ,  H01L2924/05442 ,  H01L2924/0549 ,  H01L2924/0532 ,  H01L2924/01012 ,  H01L2924/05341 ,  H01L2924/0102 ,  H01L2924/0544 ,  H01L2924/01006 ,  H01L2224/27 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83 ,  H01L21/78 ,  H01L2924/00

Abstract: An underfill material enabling voidless packaging and excellent solder bonding properties, and a method for manufacturing a semiconductor device using the same are provided. An underfill material is used which contains an epoxy resin and a curing agent, and a time for a reaction rate to reach 20% at 240° C. calculated by Ozawa method using a differential scanning calorimeter is 2.0 sec or less and a time for the reaction rate to reach 60% is 3.0 sec or more. This enables voidless packaging and excellent solder connection properties.

公开(公告)号：US20160181140A1

公开(公告)日：2016-06-23

申请号：US14761913

申请日：2014-08-18

Applicant: DEXERIALS CORPORATION

Inventor： Hironobu MORIYAMA ,  Shingo DEGUCHI ,  Hidekazu YAGI ,  Tomoyuki ISHIMATSU

IPC: H01L21/683 ,  H01L21/78 ,  H01L23/31 ,  H01L21/304

CPC classification number: H01L21/6836 ,  B32B27/00 ,  C09J7/20 ,  H01L21/304 ,  H01L21/78 ,  H01L23/3142 ,  H01L2224/13 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A protective tape and a method for manufacturing a semiconductor device using the same capable of achieving excellent connection properties. The protective tape includes an adhesive layer, a thermoplastic resin layer and a backing material film in that order; a modulus ratio of a shear storage modulus of the adhesive layer to a shear storage modulus of the thermoplastic resin layer at an application temperature at which the protective tape is applied is 0.01 or less. This suppresses resin residue on bumps thereby achieving excellent connection properties.

Abstract translation: 保护带以及使用该保护带的半导体器件的制造方法能够实现良好的连接性能。 保护带依次包括粘合剂层，热塑性树脂层和背衬材料膜; 在施加保护带的施加温度下，粘合剂层的剪切储能模量与热塑性树脂层的剪切储能模量的模量比为0.01以下。 这样可以抑制凸点上的树脂残留，从而实现良好的连接性能。

公开(公告)号：US20150348859A1

公开(公告)日：2015-12-03

申请号：US14423881

申请日：2014-09-10

Applicant: DEXERIALS CORPORATION

Inventor： Hironobu MORIYAMA

IPC: H01L23/29 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L23/293 ,  C08G59/18 ,  C08G59/24 ,  C08G59/4207 ,  C08G59/686 ,  C08K5/14 ,  C08L33/10 ,  C08L63/00 ,  H01L21/563 ,  H01L21/6836 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2224/13023 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75301 ,  H01L2224/75702 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81204 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/83191 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/92 ,  H01L2224/9205 ,  H01L2224/921 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/06 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/186 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01051 ,  H01L2924/05442 ,  H01L2924/0549 ,  H01L2924/0532 ,  H01L2924/01012 ,  H01L2924/05341 ,  H01L2924/0102 ,  H01L2924/0544 ,  H01L2924/01006 ,  H01L2224/27 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83 ,  H01L21/78 ,  H01L2924/00

Abstract: An underfill material enabling voidless packaging and excellent solder bonding properties, and a method for manufacturing a semiconductor device using the same are provided. An underfill material is used which contains an epoxy resin and a curing agent, and a time for a reaction rate to reach 20% at 240° C. calculated by Ozawa method using a differential scanning calorimeter is 2.0 sec or less and a time for the reaction rate to reach 60% is 3.0 sec or more. This enables voidless packaging and excellent solder connection properties.

Abstract translation: 提供了能够实现无空隙封装和优异的焊接接合性能的底部填充材料，以及制造使用其的半导体器件的方法。 使用含有环氧树脂和固化剂的底部填充材料，并且使用差示扫描量热计通过Ozawa方法在240℃下反应速率达到20％的时间为2.0秒以下，时间为 反应速率达到60％是3.0秒以上。 这使得无孔封装和优异的焊接连接性能。

公开(公告)号：US20180286737A1

公开(公告)日：2018-10-04

申请号：US15765358

申请日：2016-10-18

Applicant: DEXERIALS CORPORATION

Inventor： Hironobu MORIYAMA

IPC: H01L21/683 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00

Abstract: A protective tape including an adhesive agent layer, a thermoplastic resin layer, and a matrix film layer in this order to a surface of a wafer on which a bump electrode is formed; grinding a surface of the wafer opposite to the surface on which the protective tape is pasted; pasting an adhesive tape to the ground surface of the wafer; peeling the protective tape so that the adhesive agent layer remains and other layers are removed; dicing the wafer to which the adhesive tape is pasted to obtain individual semiconductor chips; and curing the adhesive agent layer before dicing; the adhesive agent layer after curing has a shear storage modulus of 3.0E+08 Pa to 5.0E+09 Pa, and the ratio of the thickness of the adhesive agent layer of the protective tape before pasting to the height of the bump electrode is 1/30 to ⅙.

公开(公告)号：US20180151405A1

公开(公告)日：2018-05-31

申请号：US15574729

申请日：2016-06-03

Applicant: DEXERIALS CORPORATION

Inventor： Hironobu MORIYAMA ,  Hidekazu YAGI ,  Tomoyuki ISHIMATSU ,  Katsuyuki EBISAWA ,  Keiji HONJYO ,  Junichi KANEKO

IPC: H01L21/683 ,  B32B27/08 ,  B32B38/10 ,  H01L21/304 ,  H01L21/78 ,  H01L23/00 ,  C09J7/25 ,  C09J7/24 ,  C09J7/38 ,  C09J163/04

CPC classification number: H01L21/6836 ,  B32B27/00 ,  B32B27/08 ,  B32B38/10 ,  B32B2405/00 ,  C09J7/245 ,  C09J7/255 ,  C09J7/29 ,  C09J7/38 ,  C09J163/00 ,  C09J163/04 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2205/114 ,  C09J2423/046 ,  C09J2431/006 ,  C09J2463/00 ,  C09J2467/006 ,  H01L21/304 ,  H01L21/78 ,  H01L23/562 ,  H01L24/11 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68386 ,  H01L2224/11009

Abstract: A protective tape that improves solder bonding properties and reduces wafer warping. The protective tape includes, in the following order, an adhesive agent layer, a first thermoplastic resin layer, a second thermoplastic resin layer, and a matrix film layer. The protective tape satisfies the conditions expressed by the following formulae (1) to (3): Ga>Gb  (1) Ta

公开(公告)号：US20160194517A1

公开(公告)日：2016-07-07

申请号：US14915734

申请日：2014-09-10

Applicant: DEXERIALS CORPORATION

Inventor： Takayuki SAITO ,  Taichi KOYAMA ,  Hironobu MORIYAMA

IPC: C09D163/00 ,  H01L23/29 ,  H01L23/31

CPC classification number: C09D163/00 ,  C08G59/42 ,  C08L63/00 ,  C09D133/066 ,  C09J133/04 ,  C09J133/066 ,  C09J163/08 ,  H01L21/563 ,  H01L21/6836 ,  H01L23/293 ,  H01L23/3142 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/13025 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/81191 ,  H01L2224/81204 ,  H01L2224/81444 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83204 ,  H01L2224/83862 ,  H01L2224/92 ,  H01L2224/9211 ,  H01L2224/9212 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01051 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/0635 ,  H01L2924/05442 ,  H01L2924/05341 ,  H01L2924/0549 ,  H01L2924/0532 ,  H01L2924/0102 ,  H01L2924/0544 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/11 ,  H01L21/78 ,  C08K5/14 ,  C08L33/10

Abstract: An underfill material achieving a wide margin for mounting and a method for manufacturing a semiconductor device using the same are provided. The underfill material contains an epoxy resin, an acid anhydride, an acrylic resin, and an organic peroxide, wherein a minimum melt viscosity attainment temperature and a minimum melt viscosity obtained when melt viscosity of the underfill material is measured under a temperature increase rate condition in a range of 5 to 50° C./min are in a range of 100° C. to 150° C. and in a range of 100 to 5000 Pa·s, respectively. Since variation in the minimum melt viscosity attainment temperature measured under different temperature increase conditions is small, voidless mounting and good solder bonding properties can be achieved without strict control on the temperature profile during thermocompression bonding, and a wide margin for mounting can be achieved.

Abstract translation: 提供了用于安装的宽裕度的底部填充材料和使用其的制造半导体器件的方法。 底部填充材料含有环氧树脂，酸酐，丙烯酸树脂和有机过氧化物，其中在底物填充材料的熔融粘度在温度升高速率条件下测定时获得的最小熔体粘度达到温度和最小熔体粘度 5〜50℃/分钟的范围分别为100〜150℃，范围为100〜5000Pa·s。 由于在不同温度升高条件下测量的最小熔融粘度达到温度的变化小，无需严格控制热压接温度分布，就可以实现无孔安装和良好的焊接性能，并且可以实现大的安装余地。