公开(公告)号：US20180151405A1

公开(公告)日：2018-05-31

申请号：US15574729

申请日：2016-06-03

Applicant: DEXERIALS CORPORATION

Inventor： Hironobu MORIYAMA ,  Hidekazu YAGI ,  Tomoyuki ISHIMATSU ,  Katsuyuki EBISAWA ,  Keiji HONJYO ,  Junichi KANEKO

IPC: H01L21/683 ,  B32B27/08 ,  B32B38/10 ,  H01L21/304 ,  H01L21/78 ,  H01L23/00 ,  C09J7/25 ,  C09J7/24 ,  C09J7/38 ,  C09J163/04

CPC classification number: H01L21/6836 ,  B32B27/00 ,  B32B27/08 ,  B32B38/10 ,  B32B2405/00 ,  C09J7/245 ,  C09J7/255 ,  C09J7/29 ,  C09J7/38 ,  C09J163/00 ,  C09J163/04 ,  C09J2201/162 ,  C09J2203/326 ,  C09J2205/114 ,  C09J2423/046 ,  C09J2431/006 ,  C09J2463/00 ,  C09J2467/006 ,  H01L21/304 ,  H01L21/78 ,  H01L23/562 ,  H01L24/11 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68386 ,  H01L2224/11009

Abstract: A protective tape that improves solder bonding properties and reduces wafer warping. The protective tape includes, in the following order, an adhesive agent layer, a first thermoplastic resin layer, a second thermoplastic resin layer, and a matrix film layer. The protective tape satisfies the conditions expressed by the following formulae (1) to (3): Ga>Gb  (1) Ta